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    MEMS-based electrically isolated analog-to-digital converter
    3.
    发明授权
    MEMS-based electrically isolated analog-to-digital converter 有权
    基于MEMS的电隔离模数转换器

    公开(公告)号：US06593870B2

    公开(公告)日：2003-07-15

    申请号：US09982726

    申请日：2001-10-18

    申请人： Ernst H. Dummermuth ,  Michael J. Knieser ,  Patrick C. Herbert ,  Jeffrey R. Annis ,  Steven M. Galecki ,  Richard D. Harris ,  Mark A. Lucak ,  Robert J. Kretschmann

    发明人： Ernst H. Dummermuth ,  Michael J. Knieser ,  Patrick C. Herbert ,  Jeffrey R. Annis ,  Steven M. Galecki ,  Richard D. Harris ,  Mark A. Lucak ,  Robert J. Kretschmann

    IPC分类号： H03M100

    CPC分类号： H03M3/368 ,  H03M3/43 ,  H03M3/438

    摘要： An isolated-ADC and a method for providing isolated analog-to-digital conversion are disclosed. The isolated-ADC includes a microelectromechanical system (MEMS), a comparator, and a digital-to-analog converter (DAC). The MEMS includes a beam element supported from a substrate for movement with respect to an axis, first and second actuators and a sensor. The first and second actuators are capable of exerting respective forces upon the beam element causing the beam element to move in response to analog input and feedback signals, respectively. The sensor detects changes in position of the beam element and produces a position signal indicative thereof. The comparator generates a digital signal based upon a comparison of the position signal with a reference value. Based on the digital signal, the DAC generates the feedback signal, and the isolated-ADC produces a digital output signal.

    摘要翻译： 公开了隔离ADC和用于提供隔离的模数转换的方法。 隔离ADC包括微机电系统（MEMS），比较器和数模转换器（DAC）。 MEMS包括从基板支撑的用于相对于轴线移动的梁元件，第一和第二致动器以及传感器。 第一和第二致动器能够在梁元件上施加相应的力，导致波束元件分别响应于模拟输入和反馈信号而移动。 传感器检测波束元件的位置变化并产生指示其的位置信号。 比较器基于位置信号与参考值的比较产生数字信号。 基于数字信号，DAC产生反馈信号，隔离ADC产生数字输出信号。

    Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge
    9.
    发明授权
    Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge 失效
    使用预图案化桥制造微机电系统（MEMS）装置的方法

    公开(公告)号：US06794271B2

    公开(公告)日：2004-09-21

    申请号：US09967157

    申请日：2001-09-28

    申请人： Richard D. Harris ,  Robert J. Kretschmann

    发明人： Richard D. Harris ,  Robert J. Kretschmann

    IPC分类号： H01L2130

    CPC分类号： B81C1/00357 ,  B81C2201/019 ,  B81C2203/0109

    摘要： A method for fabricating MEMS structures includes etching a recess in either an upper surface of a substrate that is bonded to a wafer that ultimately forms the MEMS structure, or to the lower surface of the wafer that is bonded to the substrate. Accordingly, once the etching processes of the wafer are completed, the recess facilitates the release of an internal movable structure within the fabricated MEMS structure without the use of a separate sacrificial material. Furthermore, a bridge, which is preferably insulating, is pre-etched before the wafer is attached to the substrate.

    摘要翻译： 一种用于制造MEMS结构的方法包括蚀刻在结合到最终形成MEMS结构的晶片的衬底的上表面中的凹陷，或者蚀刻到结合到衬底的晶片的下表面。 因此，一旦晶片的蚀刻工艺完成，凹陷便于在制造的MEMS结构内释放内部可移动结构，而不使用单独的牺牲材料。 此外，优选绝缘的桥在晶片附着到衬底之前被预蚀刻。