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11 条记录 (耗时 0.033 秒)

    MEMS-based electrically isolated analog-to-digital converter
    4.
    发明授权
    MEMS-based electrically isolated analog-to-digital converter 有权
    基于MEMS的电隔离模数转换器

    公开(公告)号：US06593870B2

    公开(公告)日：2003-07-15

    申请号：US09982726

    申请日：2001-10-18

    申请人： Ernst H. Dummermuth ,  Michael J. Knieser ,  Patrick C. Herbert ,  Jeffrey R. Annis ,  Steven M. Galecki ,  Richard D. Harris ,  Mark A. Lucak ,  Robert J. Kretschmann

    发明人： Ernst H. Dummermuth ,  Michael J. Knieser ,  Patrick C. Herbert ,  Jeffrey R. Annis ,  Steven M. Galecki ,  Richard D. Harris ,  Mark A. Lucak ,  Robert J. Kretschmann

    IPC分类号： H03M100

    CPC分类号： H03M3/368 ,  H03M3/43 ,  H03M3/438

    摘要： An isolated-ADC and a method for providing isolated analog-to-digital conversion are disclosed. The isolated-ADC includes a microelectromechanical system (MEMS), a comparator, and a digital-to-analog converter (DAC). The MEMS includes a beam element supported from a substrate for movement with respect to an axis, first and second actuators and a sensor. The first and second actuators are capable of exerting respective forces upon the beam element causing the beam element to move in response to analog input and feedback signals, respectively. The sensor detects changes in position of the beam element and produces a position signal indicative thereof. The comparator generates a digital signal based upon a comparison of the position signal with a reference value. Based on the digital signal, the DAC generates the feedback signal, and the isolated-ADC produces a digital output signal.

    摘要翻译： 公开了隔离ADC和用于提供隔离的模数转换的方法。 隔离ADC包括微机电系统（MEMS），比较器和数模转换器（DAC）。 MEMS包括从基板支撑的用于相对于轴线移动的梁元件，第一和第二致动器以及传感器。 第一和第二致动器能够在梁元件上施加相应的力，导致波束元件分别响应于模拟输入和反馈信号而移动。 传感器检测波束元件的位置变化并产生指示其的位置信号。 比较器基于位置信号与参考值的比较产生数字信号。 基于数字信号，DAC产生反馈信号，隔离ADC产生数字输出信号。

    Thermal cooling of industrial electronic module by conductive structure
    8.
    发明授权
    Thermal cooling of industrial electronic module by conductive structure 有权
    工业电子模块通过导电结构进行散热

    公开(公告)号：US07391610B2

    公开(公告)日：2008-06-24

    申请号：US11536751

    申请日：2006-09-29

    申请人： Ronald E. Schultz ,  Kenwood H. Hall ,  Patrick C. Herbert ,  Douglas R. Bodmann ,  Daniel E. Killian

    发明人： Ronald E. Schultz ,  Kenwood H. Hall ,  Patrick C. Herbert ,  Douglas R. Bodmann ,  Daniel E. Killian

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20545

    摘要： An electronic module and chassis/module installation are disclosed. The installation comprises a chassis including a metallic heat input region. An electronic module including an electronic component is adapted to be connected to the chassis. An uninterrupted thermal pathway thermally connects the electronic component of the module to the heat input region of the chassis. The thermal pathway comprises a chimney, a heat channel thermally connected to the chimney, and a heat output block thermally connected to the heat channel. A first electrically insulative non-metallic layer thermally couples the chimney to the electronic component. A second electrically insulative non-metallic layer thermally couples the heat output block to the chassis heat input region.

    摘要翻译： 公开了电子模块和底盘/模块安装。 该装置包括一个包括金属热输入区域的底盘。 包括电子部件的电子模块适于连接到底盘。 不间断的热路径将模块的电子部件热连接到机箱的热输入区域。 热路径包括烟道，热连接到烟囱的热通道和热连接到热通道的热输出块。 第一绝缘非金属层将烟囱热耦合到电子部件。 第二电绝缘非金属层将热输出块热耦合到底盘热输入区域。

    Thermal cooling of industrial electronic module by conductive structure
    9.
    发明授权
    Thermal cooling of industrial electronic module by conductive structure 有权
    工业电子模块通过导电结构进行散热

    公开(公告)号：US07525798B2

    公开(公告)日：2009-04-28

    申请号：US12214142

    申请日：2008-06-17

    申请人： Ronald E. Schultz ,  Kenwood H. Hall ,  Patrick C. Herbert ,  Douglas R. Bodmann ,  Daniel E. Killian

    发明人： Ronald E. Schultz ,  Kenwood H. Hall ,  Patrick C. Herbert ,  Douglas R. Bodmann ,  Daniel E. Killian

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20545

    摘要： An electronic module and chassis/module installation and cooling method are disclosed. The installation comprises a chassis including a metallic heat input region. An electronic module including an electronic component is adapted to be connected to the chassis. An uninterrupted thermal pathway thermally connects the electronic component of the module to the heat input region of the chassis. The thermal pathway comprises a chimney, a heat channel thermally connected to the chimney, and a heat output block thermally connected to the heat channel. A first electrically insulative non-metallic layer thermally couples the chimney to the electronic component. A second electrically insulative non-metallic layer thermally couples the heat output block to the chassis heat input region.

    摘要翻译： 公开了一种电子模块和底盘/模块的安装和冷却方法。 该装置包括一个包括金属热输入区域的底盘。 包括电子部件的电子模块适于连接到底盘。 不间断的热路径将模块的电子部件热连接到机箱的热输入区域。 热路径包括烟道，热连接到烟囱的热通道和热连接到热通道的热输出块。 第一绝缘非金属层将烟囱热耦合到电子部件。 第二电绝缘非金属层将热输出块热耦合到底盘热输入区域。

    Thermal cooling of industrial electronic module by conductive structure
    10.
    发明申请
    Thermal cooling of industrial electronic module by conductive structure 有权
    工业电子模块通过导电结构进行散热

    公开(公告)号：US20080253086A1

    公开(公告)日：2008-10-16

    申请号：US12214142

    申请日：2008-06-17

    申请人： Ronald E. Schultz ,  Kenwood H. Hall ,  Patrick C. Herbert ,  Douglas R. Bodmann ,  Daniel E. Killian

    发明人： Ronald E. Schultz ,  Kenwood H. Hall ,  Patrick C. Herbert ,  Douglas R. Bodmann ,  Daniel E. Killian

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20545

    摘要： An electronic module and chassis/module installation and cooling method are disclosed. The installation comprises a chassis including a metallic heat input region. An electronic module including an electronic component is adapted to be connected to the chassis. An uninterrupted thermal pathway thermally connects the electronic component of the module to the heat input region of the chassis. The thermal pathway comprises a chimney, a heat channel thermally connected to the chimney, and a heat output block thermally connected to the heat channel. A first electrically insulative non-metallic layer thermally couples the chimney to the electronic component. A second electrically insulative non-metallic layer thermally couples the heat output block to the chassis heat input region.

    摘要翻译： 公开了一种电子模块和底盘/模块的安装和冷却方法。 该装置包括一个包括金属热输入区域的底盘。 包括电子部件的电子模块适于连接到底盘。 不间断的热路径将模块的电子部件热连接到机箱的热输入区域。 热路径包括烟道，热连接到烟囱的热通道和热连接到热通道的热输出块。 第一绝缘非金属层将烟囱热耦合到电子部件。 第二电绝缘非金属层将热输出块热耦合到底盘热输入区域。