摘要:
A semiconductor device including a first semiconductor layer formed on a semiconductor substrate, a second semiconductor layer surrounding the first semiconductor layer, the second semiconductor layer being formed on the semiconductor substrate with one of an insulating film and a cavity, and a third semiconductor layer surrounding the second semiconductor layer, the third semiconductor layer being formed on the semiconductor substrate.
摘要:
A primer (16) for forming a resin frame (17) is formed on an outer end portion (16p) of a separator (1) of a fuel cell. An electrodeposition coating device (2) includes an upper frame (21) and a lower frame (22), and covers only the outer end portion (16p) of the substrate (11) with a center portion (12) of the substrate (11) left uncovered. When the substrate (11) is sandwiched between the upper frame (21) and the lower frame (22) of the electrodeposition coating device (2), an annular electrodeposition chamber (31) is formed with the outer end portion (16p) of the substrate (11) located in the electrodeposition chamber (31). Then, the electrodeposition chamber (31) is filled with an electrodeposition coating solution (32), and electrodeposition coating is performed. Then, cleaning is performed by using purified water, and drying is performed by using high temperature air.
摘要:
An engine electronic remote control system is provided that can include an engine electronic control unit for controlling an operating state of the engine and a remote controller having a control lever capable of transmitting a control signal to the engine electronic control unit to achieve a target operating state. The system can comprise an operating state determination subsystem, a shift actuator, a shift position detector, and a lever position detector. In an embodiment, the shift actuator can drive a shiftable component to a neutral when a main switch being switched on is switched off while the control lever is in a position other than a neutral position.
摘要:
A remote control operation unit can have a remote control shift lever through which a boat operator can remotely control a forward drive mode, a neutral mode, and a reverse drive mode. A boat propulsion unit can have a shift switching device for shifting and a shift actuator for operating the shift switching device. A controller can be used to control the operation of the shift actuator in response to the operation amount of the remote control shift lever. The controller can also be configured to control the shift actuator such that in the case where the remote control shift lever has been shifted between a neutral position and a forward position or reverse position, when an engine is stopped and when shifting is not completed within a certain period of time, the shift actuator stops shifting operation.
摘要:
A method of manufacturing a semiconductor device substrate is disclosed, which comprises forming a mask layer patterned on a semiconductor layer insulated from a surface of a semiconductor substrate by an electrically insulating layer, etching the semiconductor layer according to the pattern of the mask layer to form a trench leading to the insulating layer, etching a protective layer deposited thinner on the semiconductor substrate than the thickness of the insulating layer to form a sidewall protective film which covers a side surface of the trench, etching the insulating layer from a bottom surface of the trench to the semiconductor substrate; and growing a single-crystalline layer from the surface of the semiconductor substrate exposed as a result of etching the insulating layer.
摘要:
An optical module controls its output characteristics electrically and an optical switch constitutes the optical module. An optical waveguide circuit (PLC) and an electronic circuit (IC) for driving the PLC are mounted on the same substrate. The IC is composed of a bare chip to be molded afterward. Wiring of the IC is grouped and integrated on the PLC substrate to achieve higher density and miniaturization of the optical module.
摘要:
An optical disc cartridge is provided, which can accommodate an optical disc having a substrate and a light-transmitting layer thinner than the substrate and can suppress warpage of the optical disc within a predetermined limit value. The optical disc cartridge 32 is provided with an opening 20 on one side in a thickness direction and an opening 34 on the other side. An area of each opening is set to be ¼ or more of an area of the optical disc 16. Moreover, a ratio of the area of the opening 20 to the area of the opening 34 is set to be larger than ¼ and smaller than 4.
摘要:
A semiconductor chip includes a base substrate, a bulk device region having a bulk growth layer on a part of the base substrate, an SOI device region having a buried insulator on the base substrate and a silicon layer on the buried insulator, and a boundary layer located at the boundary between the bulk device region and the SOI device region. The bulk device region has a first device-fabrication surface in which a bulk device is positioned on the bulk growth layer. The SOI device region has a second device-fabrication surface in which an SOI device is positioned on the silicon layer. The first and second device-fabrication surfaces are positioned at a substantially uniform level.
摘要:
An optical recording medium includes a substrate, a protective layer, three or more information recording layers formed between the substrate and the protective layer and transparent intermediate layers each formed between neighboring information recording layers and capable of recording data in the three or more information recording layers and reproducing data recorded in the three or more information recording layers by projecting a laser beam onto the three or more information recording layers via a light incidence plane constituted by the surface of either the substrate or the protective layer, wherein neighboring transparent intermediate layers facing each other across an information recording layer have different thicknesses. According to the thus constituted optical recording medium, it is possible to reduce interlayer cross-talk.
摘要:
A method of manufacturing a semiconductor device substrate includes forming a mask layer pattern on a semiconductor layer insulated from a surface of a semiconductor substrate by an electrically insulating layer, etching the semiconductor layer according to the pattern of the mask layer to form a trench leading to the insulating layer, etching a protective layer on the semiconductor substrate having a thickness less than the thickness of the insulating layer to form a sidewall protective film which covers a side surface of the trench, etching the insulating layer from a bottom surface of the trench to the semiconductor substrate; and growing a single-crystalline layer from the surface of the semiconductor substrate exposed as a result of etching the insulating layer.