摘要:
An Assisted Charge (AC) Memory cell comprises a transistor that includes, for example, a p-type substrate with an n+ source region and an n+ drain region implanted on the p-type substrate. A gate electrode can be formed over the substrate and portions of the source and drain regions. The gate electrode can comprise a trapping structure. The trapping structure can be treated as electrically split into two sides. One side can be referred to as the “AC-side” and can be fixed at a high voltage by trapping electrons within the structure. The electrons are referred to as assisted charges. The other side of can be used to store data and is referred to as the “data-side.” The abrupt electric field between AC-side and the data-side can enhance programming efficiency. The memory cell can comprise a dual gate structure, such that the cell is a 2-bit cell.
摘要:
A method for fabricating a non-volatile memory is provided. The method includes a stacked structure and a consuming layer are formed in sequence over a substrate. A converting process is performed at a peripheral region of the consuming layer to form a first insulating layer. A conductive layer is formed over the stacked layer and the first insulating layer.
摘要:
A memory operating method includes the following steps. First, a memory including a charge storage structure is provided. Next, first type charges are injected into the charge storage structure such that a threshold level of the memory is higher than an erase level. Then, second type charges are injected into the charge storage structure such that the threshold level of the memory is lower than a predetermined bit level. Next, first type charges are injected into the charge storage structure such that the threshold level of the memory approximates to or is equal to the predetermined bit level.
摘要:
A method of fabrication a non-volatile memory is provided. A stacked structure is formed on a substrate, the stacked structure including a gate dielectric layer and a control gate. Then, a first dielectric layer, a second dielectric layer and a third dielectric layer are respectively formed on the top and sidewalls of the stacked structure and the exposed substrate. Thereafter, a pair of charge storage layers are formed over the substrate to respectively cover a portion of the top and sidewalls of the stacked structure, and a gap exists between each of the charge storage layers.
摘要:
A method of fabrication a non-volatile memory is provided. A stacked structure is formed on a substrate, the stacked structure including a gate dielectric layer and a control gate. Then, a first dielectric layer, a second dielectric layer and a third dielectric layer are respectively formed on the top and sidewalls of the stacked structure and the exposed substrate. Thereafter, a pair of charge storage layers are formed over the substrate to respectively cover a portion of the top and sidewalls of the stacked structure, and a gap exists between each of the charge storage layers.
摘要:
An electronic apparatus includes a main body and a projection mechanism. The main body is used for providing video signals. The projection mechanism includes a built-in mini-projector that can either be stored in the electronic apparatus or extended out of the electronic apparatus for use. The mini-projector is capable of receiving video signals and projecting corresponding images when the projection mechanism is extended, and stops the projection of images when retracted.
摘要:
A method of making a relay includes: preparing a relay core member; coupling first, second and third terminals to the relay core member by moving the same horizontally relative to the relay core member such that terminal portions of the first, second and third terminals enter notches formed in the relay core member in a horizontal direction; and enclosing the relay core member, the first terminal, the second terminal, and the third terminal within a housing, and sealing the housing with resin.
摘要:
Methods and apparatuses are discussed which operate a nonvolatile memory cell or at least one cell in an array of such cells, such that a drain region or a source region is floating while adding charge to the charge storage structure.
摘要:
A three-dimensional (3D) semiconductor structure with high density and method of fabricating the same are disclosed. The 3D semiconductor structure comprises at least a first memory cell and a second memory cell stacked on the first memory cell. The first memory cell comprises a first conductive line and a second conductive line. The second memory cell comprises another first conductive line opposite to the first conductive line of the first memory cell, and the second conductive line formed between said two first conductive lines of the first and second memory cells. The first and second memory cells share the second conductive line when the 3D semiconductor structure is programming and erasing, and each of the first and second memory cells has a diode.
摘要:
A memory device is provided. The memory device includes a first control gate, a second control gate, a plurality of first charge storage elements, a plurality of second charge storage elements and a semiconductor. The plurality of first charge storage elements is beside the first control gate, and each of the first charge storage elements is located on the different side of the first control gate. The plurality of second charge storage elements is beside the second control gate. The semiconductor is located between the first and second control gates.