公开(公告)号：US5189261A

公开(公告)日：1993-02-23

申请号：US598466

申请日：1990-10-09

申请人： Lawrence C. Alexander ,  Bernd K. Appelt ,  David K. Balkin ,  James J. Hansen ,  Joseph Hromek ,  Ronald A. Kaschak ,  John M. Lauffer ,  Irving Memis ,  Magan S. Patel ,  Andrew M. Seman ,  Robin A. Susko

发明人： Lawrence C. Alexander ,  Bernd K. Appelt ,  David K. Balkin ,  James J. Hansen ,  Joseph Hromek ,  Ronald A. Kaschak ,  John M. Lauffer ,  Irving Memis ,  Magan S. Patel ,  Andrew M. Seman ,  Robin A. Susko

IPC分类号： H05K1/11 ,  H01L23/538 ,  H05K1/02 ,  H05K3/00 ,  H05K3/40 ,  H05K3/44 ,  H05K7/20

CPC分类号： H01L23/5384 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/44 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K2201/09554 ,  H05K2201/10234 ,  H05K2201/10303 ,  H05K2201/10401 ,  H05K2201/10871 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/128 ,  H05K3/0035 ,  Y10S428/901 ,  Y10T29/49155

摘要： Circuit boards or cards containing metallic layers on opposite major surfaces of a dielectric substrate whereby electrical and/or thermal interconnection between the metallic layers is provided in vias that extend through one of the metallic layers, and the dielectric substrate and into the other metallic layer.

摘要翻译： 电介质基板的相对的主表面上包含金属层的电路板或卡片，从而在金属层之间提供电和/或热互连，其通孔延伸穿过金属层之一以及电介质基板并进入另一金属层。

公开(公告)号：US4971894A

公开(公告)日：1990-11-20

申请号：US309575

申请日：1989-02-13

申请人： Irving Memis ,  Frederick M. Rovente

发明人： Irving Memis ,  Frederick M. Rovente

IPC分类号： C23F1/00 ,  G03F7/11 ,  G03F7/20 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38

CPC分类号： B32B37/0038 ,  B32B38/0012 ,  H05K3/064 ,  H05K3/382 ,  H05K2203/068 ,  H05K2203/0776 ,  H05K2203/1152 ,  H05K3/0079 ,  Y10S430/136

摘要： A method and structure which will prevent wet etchant penetration at the interface region of a masked metal layer during etching of an exposed portion of the metal adjacent thereto is provided. The metal is provided with a matte finish of 0.1 and 0.5 mils peak to valley. The metal is covered with a dry film photoresist material which has been plasticized to have a surface deflection of at least 0.5 mils without losing its plasticity and conforms to the surface pattern of the metal. The photoresist is imagewise patterned and developed, and the exposed or revealed regions of the metal are subject to a wet etching process. The conformed coating of the resist prevents wet etchant penetration.