Semiconductor device and manufacturing method thereof
    53.
    发明授权
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US07830703B2

    公开(公告)日:2010-11-09

    申请号:US11570037

    申请日:2005-05-25

    IPC分类号: G11C11/00

    摘要: A semiconductor device having SRAM cell units each comprising a pair of a first driving transistor and a second driving transistor, a pair of a first load transistor and a second load transistor, and a pair of a first access transistor and a second access transistor, wherein each of the transistors comprises a semiconductor layer projecting upward from a substrate plane, a gate electrode extending on opposite sides of the semiconductor layer so as to stride over a top of the semiconductor layer, a gate insulating film interposed between the gate electrode and the semiconductor layer, and a pair of source/drain areas formed in the semiconductor layer; and the first and second driving transistors each have a channel width larger than that of at least either each of the load transistors or each of the access transistors.

    摘要翻译: 一种具有SRAM单元单元的半导体器件,每个SRAM单元包括一对第一驱动晶体管和第二驱动晶体管,一对第一负载晶体管和第二负载晶体管,以及一对第一存取晶体管和第二存取晶体管,其中 每个晶体管包括从衬底平面向上突出的半导体层,在半导体层的相对侧上延伸以跨越半导体层的顶部的栅极电极,插入在栅极电极和半导体之间的栅极绝缘膜 层,以及形成在半导体层中的一对源极/漏极区域; 并且第一和第二驱动晶体管的沟道宽度均大于至少任一个负载晶体管或每个存取晶体管的沟道宽度。

    Semiconductor Device and Method for Manufacturing Same
    54.
    发明申请
    Semiconductor Device and Method for Manufacturing Same 有权
    半导体器件及其制造方法

    公开(公告)号:US20080251849A1

    公开(公告)日:2008-10-16

    申请号:US10593300

    申请日:2005-03-22

    IPC分类号: H01L29/76 H01L21/336

    摘要: A semiconductor device comprising a first semiconductor region and a second semiconductor region, (a) wherein a field effect transistor is comprised of the first semiconductor region comprising at least one semiconductor layer(s) protruding upward from a substrate, a gate electrode(s) formed via an insulating film such that the gate electrode(s) strides over the semiconductor layer(s) and source/drain regions provided in the semiconductor layer(s) on both sides of the gate electrode(s), whereby a channel region is formed in at least both sides of the semiconductor layer(s), (b) wherein the second semiconductor region comprises semiconductor layers protruding upward from the substrate and placed, at least opposing the first semiconductor region at both ends in the direction perpendicular to a channel current direction and the side surface of the semiconductor layers facing the first semiconductor region is parallel to the channel current direction.

    摘要翻译: 一种包括第一半导体区域和第二半导体区域的半导体器件,(a)其中场效应晶体管由包括从衬底向上突出的至少一个半导体层的第一半导体区域,栅电极, 通过绝缘膜形成,使得栅电极跨越设置在栅电极两侧的半导体层中的半导体层和源极/漏极区,由此沟道区是 形成在所述半导体层的至少两侧,(b),其中所述第二半导体区域包括从所述衬底向上突出的半导体层,并且至少相对于与沟道垂直的方向的两端处的所述第一半导体区域相对 电流方向和面对第一半导体区域的半导体层的侧表面平行于沟道电流方向。

    Semiconductor Device And Manufacturing Method Thereof
    55.
    发明申请
    Semiconductor Device And Manufacturing Method Thereof 有权
    半导体器件及其制造方法

    公开(公告)号:US20080079077A1

    公开(公告)日:2008-04-03

    申请号:US11570037

    申请日:2005-05-25

    IPC分类号: H01L27/12 H01L21/84

    摘要: A semiconductor device having SRAM cell units each comprising a pair of a first driving transistor and a second driving transistor, a pair of a first load transistor and a second load transistor, and a pair of a first access transistor and a second access transistor, wherein each of the transistors comprises a semiconductor layer projecting upward from a substrate plane, a gate electrode extending on opposite sides of the semiconductor layer so as to stride over a top of the semiconductor layer, a gate insulating film interposed between the gate electrode and the semiconductor layer, and a pair of source/drain areas formed in the semiconductor layer; and the first and second driving transistors each have a channel width larger than that of at least either each of the load transistors or each of the access transistors.

    摘要翻译: 一种具有SRAM单元单元的半导体器件,每个SRAM单元包括一对第一驱动晶体管和第二驱动晶体管,一对第一负载晶体管和第二负载晶体管,以及一对第一存取晶体管和第二存取晶体管,其中 每个晶体管包括从衬底平面向上突出的半导体层,在半导体层的相对侧上延伸以跨越半导体层的顶部的栅极电极,插入在栅极电极和半导体之间的栅极绝缘膜 层,以及形成在半导体层中的一对源极/漏极区域; 并且第一和第二驱动晶体管的沟道宽度均大于至少任一个负载晶体管或每个存取晶体管的沟道宽度。

    Semiconductor device with fin-type field effect transistor and manufacturing method thereof.
    57.
    发明授权
    Semiconductor device with fin-type field effect transistor and manufacturing method thereof. 失效
    具有鳍式场效应晶体管的半导体器件及其制造方法。

    公开(公告)号:US07719043B2

    公开(公告)日:2010-05-18

    申请号:US11632352

    申请日:2005-07-04

    IPC分类号: H01L27/108 H01L29/94

    摘要: The present invention relates to a semiconductor device including a Fin type field effect transistor (FET) having a protrusive semiconductor layer protruding from a substrate plane, a gate electrode formed so as to straddle the protrusive semiconductor layer, a gate insulating film between the gate electrode and the protrusive semiconductor layer, and source and drain regions provided in the protrusive semiconductor layer, wherein the semiconductor device has on a semiconductor substrate an element forming region having a Fin type FET, a trench provided on the semiconductor substrate for separating the element forming region from another element forming region, and an element isolation insulating film in the trench; the element forming region has a shallow substrate flat surface formed by digging to a depth shallower than the bottom surface of the trench and deeper than the upper surface of the semiconductor substrate, a semiconductor raised portion protruding from the substrate flat surface and formed of a part of the semiconductor substrate, and an insulating film on the shallow substrate flat surface; and the protrusive semiconductor layer of the Fin type FET is formed of a portion protruding from the insulating film of the semiconductor raised portion.

    摘要翻译: 本发明涉及一种半导体器件,其包括具有从衬底平面突出的突出半导体层的鳍型场效应晶体管(FET),形成为跨越突出半导体层的栅极电极,栅极电极 所述突出半导体层以及设置在所述突出半导体层中的源极和漏极区域,其中所述半导体器件在半导体衬底上具有具有鳍型FET的元件形成区域,设置在所述半导体衬底上的沟槽,用于将所述元件形成区域 来自另一个元件形成区域,以及沟槽中的元件隔离绝缘膜; 元件形成区域具有通过挖掘到比沟槽的底表面浅的深度而比半导体衬底的上表面更深的深浅的衬底平坦表面,从衬底平坦表面突出并形成的半导体凸起部分 的半导体衬底,以及在浅衬底平面上的绝缘膜; 并且鳍式FET的突出半导体层由从半导体凸起部分的绝缘膜突出的部分形成。

    Semiconductor device and method for manufacturing same
    58.
    发明授权
    Semiconductor device and method for manufacturing same 有权
    半导体装置及其制造方法

    公开(公告)号:US07701018B2

    公开(公告)日:2010-04-20

    申请号:US10593300

    申请日:2005-03-22

    IPC分类号: H01L27/088

    摘要: A semiconductor device comprising a first semiconductor region and a second semiconductor region, (a) wherein a field effect transistor is comprised of the first semiconductor region comprising at least one semiconductor layer(s) protruding upward from a substrate, a gate electrode(s) formed via an insulating film such that the gate electrode(s) strides over the semiconductor layer(s) and source/drain regions provided in the semiconductor layer(s) on both sides of the gate electrode(s), whereby a channel region is formed in at least both sides of the semiconductor layer(s), (b) wherein the second semiconductor region comprises semiconductor layers protruding upward from the substrate and placed, at least opposing the first semiconductor region at both ends in the direction perpendicular to a channel current direction and the side surface of the semiconductor layers facing the first semiconductor region is parallel to the channel current direction.

    摘要翻译: 一种包括第一半导体区域和第二半导体区域的半导体器件,(a)其中场效应晶体管由包括从衬底向上突出的至少一个半导体层的第一半导体区域,栅电极, 通过绝缘膜形成,使得栅电极跨越设置在栅电极两侧的半导体层中的半导体层和源极/漏极区,由此沟道区是 形成在所述半导体层的至少两侧,(b),其中所述第二半导体区域包括从所述衬底向上突出的半导体层,并且至少相对于与沟道垂直的方向的两端处的所述第一半导体区域相对 电流方向和面对第一半导体区域的半导体层的侧表面平行于沟道电流方向。

    Semiconductor Device and Method for Production Thereof
    60.
    发明申请
    Semiconductor Device and Method for Production Thereof 失效
    半导体器件及其制造方法

    公开(公告)号:US20080029821A1

    公开(公告)日:2008-02-07

    申请号:US11632352

    申请日:2005-07-04

    IPC分类号: H01L29/78 H01L21/336

    摘要: The present invention relates to a semiconductor device including a Fin type field effect transistor (FET) having a protrusive semiconductor layer protruding from a substrate plane, a gate electrode formed so as to straddle the protrusive semiconductor layer, a gate insulating film between the gate electrode and the protrusive semiconductor layer, and source and drain regions provided in the protrusive semiconductor layer, wherein the semiconductor device has on a semiconductor substrate an element forming region having a Fin type FET, a trench provided on the semiconductor substrate for separating the element forming region from another element forming region, and an element isolation insulating film in the trench; the element forming region has a shallow substrate flat surface formed by digging to a depth shallower than the bottom surface of the trench and deeper than the upper surface of the semiconductor substrate, a semiconductor raised portion protruding from the substrate flat surface and formed of a part of the semiconductor substrate, and an insulating film on the shallow substrate flat surface; and the protrusive semiconductor layer of the Fin type FET is formed of a portion protruding from the insulating film of the semiconductor raised portion.

    摘要翻译: 本发明涉及一种半导体器件,其包括具有从衬底平面突出的突出半导体层的鳍型场效应晶体管(FET),形成为跨越突出半导体层的栅极电极,栅极电极 所述突出半导体层以及设置在所述突出半导体层中的源极和漏极区域,其中所述半导体器件在半导体衬底上具有具有鳍型FET的元件形成区域,设置在所述半导体衬底上的沟槽,用于将所述元件形成区域 来自另一个元件形成区域,以及沟槽中的元件隔离绝缘膜; 元件形成区域具有通过挖掘到比沟槽的底表面浅的深度而比半导体衬底的上表面更深的深浅的衬底平坦表面,从衬底平坦表面突出并形成的半导体凸起部分 的半导体衬底,以及在浅衬底平面上的绝缘膜; 并且鳍式FET的突出半导体层由从半导体凸起部分的绝缘膜突出的部分形成。