Semiconductor device and method for manufacturing same
    3.
    发明授权
    Semiconductor device and method for manufacturing same 有权
    半导体装置及其制造方法

    公开(公告)号:US07701018B2

    公开(公告)日:2010-04-20

    申请号:US10593300

    申请日:2005-03-22

    IPC分类号: H01L27/088

    摘要: A semiconductor device comprising a first semiconductor region and a second semiconductor region, (a) wherein a field effect transistor is comprised of the first semiconductor region comprising at least one semiconductor layer(s) protruding upward from a substrate, a gate electrode(s) formed via an insulating film such that the gate electrode(s) strides over the semiconductor layer(s) and source/drain regions provided in the semiconductor layer(s) on both sides of the gate electrode(s), whereby a channel region is formed in at least both sides of the semiconductor layer(s), (b) wherein the second semiconductor region comprises semiconductor layers protruding upward from the substrate and placed, at least opposing the first semiconductor region at both ends in the direction perpendicular to a channel current direction and the side surface of the semiconductor layers facing the first semiconductor region is parallel to the channel current direction.

    摘要翻译: 一种包括第一半导体区域和第二半导体区域的半导体器件,(a)其中场效应晶体管由包括从衬底向上突出的至少一个半导体层的第一半导体区域,栅电极, 通过绝缘膜形成,使得栅电极跨越设置在栅电极两侧的半导体层中的半导体层和源极/漏极区,由此沟道区是 形成在所述半导体层的至少两侧,(b),其中所述第二半导体区域包括从所述衬底向上突出的半导体层,并且至少相对于与沟道垂直的方向的两端处的所述第一半导体区域相对 电流方向和面对第一半导体区域的半导体层的侧表面平行于沟道电流方向。

    Semiconductor Device and Method for Manufacturing Same
    5.
    发明申请
    Semiconductor Device and Method for Manufacturing Same 有权
    半导体器件及其制造方法

    公开(公告)号:US20080251849A1

    公开(公告)日:2008-10-16

    申请号:US10593300

    申请日:2005-03-22

    IPC分类号: H01L29/76 H01L21/336

    摘要: A semiconductor device comprising a first semiconductor region and a second semiconductor region, (a) wherein a field effect transistor is comprised of the first semiconductor region comprising at least one semiconductor layer(s) protruding upward from a substrate, a gate electrode(s) formed via an insulating film such that the gate electrode(s) strides over the semiconductor layer(s) and source/drain regions provided in the semiconductor layer(s) on both sides of the gate electrode(s), whereby a channel region is formed in at least both sides of the semiconductor layer(s), (b) wherein the second semiconductor region comprises semiconductor layers protruding upward from the substrate and placed, at least opposing the first semiconductor region at both ends in the direction perpendicular to a channel current direction and the side surface of the semiconductor layers facing the first semiconductor region is parallel to the channel current direction.

    摘要翻译: 一种包括第一半导体区域和第二半导体区域的半导体器件,(a)其中场效应晶体管由包括从衬底向上突出的至少一个半导体层的第一半导体区域,栅电极, 通过绝缘膜形成,使得栅电极跨越设置在栅电极两侧的半导体层中的半导体层和源极/漏极区,由此沟道区是 形成在所述半导体层的至少两侧,(b),其中所述第二半导体区域包括从所述衬底向上突出的半导体层,并且至少相对于与沟道垂直的方向的两端处的所述第一半导体区域相对 电流方向和面对第一半导体区域的半导体层的侧表面平行于沟道电流方向。

    Defect evaluation apparatus utilizing positrons
    8.
    发明授权
    Defect evaluation apparatus utilizing positrons 失效
    利用正电子的缺陷评估装置

    公开(公告)号:US06919563B2

    公开(公告)日:2005-07-19

    申请号:US10649664

    申请日:2003-08-28

    CPC分类号: G01T1/172

    摘要: Disclosed is a defect evaluation apparatus comprising a source section having a source for generating positrons and a moderator for decelerating the positrons, a sample holding section for holding a sample to be measured, a transfer section for transferring the positrons from the source section to the sample holding section, and detection means for detecting γ rays emitted from the sample being measured, characterized in that the apparatus further comprises heating means for heating the moderator in a position where there is a possibility of the source being thermally damaged if there is no protection means mentioned below in the source section, and protection means for protecting the source from the heating means and heated moderator when the moderator is being heated using the heating means.

    摘要翻译: 公开了一种缺陷评估装置,包括:源部分,具有用于产生正电子的源和用于使正电子减速的调节剂;用于保持待测样品的样品保持部分;用于将正电子从源部分转移到样品的转移部分; 保持部,以及检测装置,用于检测被测试样品发射的γ射线,其特征在于,所述装置还包括加热装置,用于在没有保护装置的情况下,在可能发生源受热损坏的位置加热调节剂 以及保护装置,用于当使用加热装置加热调节剂时,保护来自加热装置和加热的慢化剂的源。

    Method of fabricating SOI substrate
    9.
    发明授权
    Method of fabricating SOI substrate 失效
    制造SOI衬底的方法

    公开(公告)号:US6074928A

    公开(公告)日:2000-06-13

    申请号:US23132

    申请日:1998-02-12

    申请人: Atsushi Ogura

    发明人: Atsushi Ogura

    CPC分类号: H01L21/76243

    摘要: An oxygen ion is implanted into a silicon substrate at a dose of 3.times.10.sup.17 (cm.sup.-2) or lower. Then, the silicon substrate is heated at 1250.degree. C. or lower for 40 minute or longer. And the silicon substrate is heated at 1300.degree. C. or higher in an inert gas atmosphere. Further, the silicon substrate is heated at 1300.degree. C. or higher in an atmosphere containing an oxygen gas in an amount of 1% by volume or more.

    摘要翻译: 将氧离子以3×10 17(cm -2)以下的剂量注入到硅衬底中。 然后,将硅衬底在1250℃或更低温度下加热40分钟以上。 并且在惰性气体气氛中将硅衬底加热至1300℃或更高。 此外,在含有1体积%以上的氧气的气氛中,将硅衬底加热至1300℃以上。

    Method of fabricating SOI substrate
    10.
    发明授权
    Method of fabricating SOI substrate 失效
    制造SOI衬底的方法

    公开(公告)号:US5888297A

    公开(公告)日:1999-03-30

    申请号:US570232

    申请日:1995-12-11

    申请人: Atsushi Ogura

    发明人: Atsushi Ogura

    CPC分类号: C30B29/06 C30B31/22 C30B33/00

    摘要: The invention provides a method of fabricating an SOI substrate including the steps of introducing crystal defects at a desired depth in a silicon substrate, and thereafter, implanting oxygen or nitrogen ions into the silicon substrate, and thermally annealing the silicon substrate. The method of the present invention makes it possible to fabricate an SOI substrate with fewer crystal defects and lower fabrication cost than is possible according to the prior art.

    摘要翻译: 本发明提供一种制造SOI衬底的方法,包括以下步骤:在硅衬底中以期望的深度引入晶体缺陷,然后将氧或氮离子注入到硅衬底中,并对硅衬底进行热退火。 与现有技术相比,本发明的方法可以制造出具有较少晶体缺陷和较低制造成本的SOI衬底。