Monolithic multi-functional integrated sensor and method for fabricating the same
    51.
    发明授权
    Monolithic multi-functional integrated sensor and method for fabricating the same 有权
    单片多功能集成传感器及其制造方法

    公开(公告)号:US07051595B2

    公开(公告)日:2006-05-30

    申请号:US11150212

    申请日:2005-06-13

    IPC分类号: G01L19/04 G01L9/06

    CPC分类号: G01L9/0054 G01L9/065

    摘要: A monolithic multi-functional integrated sensor and method for making the monolithic multi-functional integrated sensor. The monolithic multi-functional integrated sensor includes: a pressure sensor including a plurality of piezoresistors having resistance values which vary with a change in external pressure, the piezoresistors being disposed in a direction so as to be subject to a piezoresistive effect produced by the external pressure at or beyond a predetermined first level; and a temperature sensor including a resistor having a resistance value which varies with a change in temperature, the resistor being disposed in a direction so as to be subject to a piezoresistive effect produced by the external pressure below a predetermined second level.

    摘要翻译: 一种用于制造单片多功能集成传感器的单片多功能集成传感器和方法。 单片多功能集成传感器包括:压力传感器,其包括具有随着外部压力变化而变化的电阻值的多个压敏电阻器,压电电阻器设置在受到外部压力产生的压阻效应的方向上 处于或超过预定的第一级; 以及温度传感器,其具有电阻值随温度变化而变化的电阻器,所述电阻器设置在使所述外部压力低于规定的第二电平而产生的压阻效应的方向上。

    Resonator for wireless power transmission
    52.
    发明授权
    Resonator for wireless power transmission 有权
    谐振器用于无线电力传输

    公开(公告)号:US08299877B2

    公开(公告)日:2012-10-30

    申请号:US12654367

    申请日:2009-12-17

    IPC分类号: H01P7/08

    CPC分类号: H01P7/084 H01P1/218

    摘要: Disclosed is a resonator for wireless power transmission used in a mobile device. The resonator includes a substrate, at least one microstrip line, and a magnetic core. The microstrip line is formed on the substrate and is provided at one side thereof with a slit to have an open-loop shape. The magnetic core is formed on the substrate and is disposed on a space defined by the microstrip line to increase coupling strength.

    摘要翻译: 公开了一种用于移动设备中的用于无线电力传输的谐振器。 谐振器包括衬底,至少一条微带线和磁芯。 微带线形成在基板上,并且在其一侧设置有具有开环形状的狭缝。 磁芯形成在基板上,并且设置在由微带线限定的空间上以增加耦合强度。

    Temperature measurement apparatus and method for measuring temperatures by using RF signals of different frequencies
    53.
    发明授权
    Temperature measurement apparatus and method for measuring temperatures by using RF signals of different frequencies 失效
    通过使用不同频率的RF信号测量温度的温度测量装置和方法

    公开(公告)号:US07503690B2

    公开(公告)日:2009-03-17

    申请号:US11148304

    申请日:2005-06-09

    IPC分类号: G01J5/00

    CPC分类号: G01K13/00 G01K1/024 G01K7/01

    摘要: Disclosed are a temperature measurement apparatus and method for measuring temperature by using RF signals having different frequencies. The temperature measurement apparatus includes a parameter generation unit for generating a first parameter based on a radio frequency (RF) signal having a first frequency and a second parameter based on an RF signal having a second frequency; a parameter detection unit for detecting the generated first and second parameters; and a control unit for calculating a temperature value based on the detected first and second parameters. Accordingly, the temperature measurement apparatus can measure temperature by use of existing components and received RF signals without any addition of a temperature sensor, as well as measure temperature precisely without having any influence on the intensities of RF signals that can vary due to the changes of transmission distances and signal-receiving environments.

    摘要翻译: 公开了通过使用具有不同频率的RF信号来测量温度的温度测量装置和方法。 温度测量装置包括参数产生单元,用于基于具有第二频率的RF信号的具有第一频率和第二参数的射频(RF)信号产生第一参数; 参数检测单元,用于检测所生成的第一和第二参数; 以及控制单元,用于基于检测到的第一和第二参数来计算温度值。 因此,温度测量装置可以通过使用现有部件和接收的RF信号来测量温度,而不需要任何温度传感器的添加,以及精确地测量温度,而不会对RF信号的强度产生任何影响,RF信号的强度可能由于 传输距离和信号接收环境。

    Capacitive type temperature sensor
    55.
    发明申请
    Capacitive type temperature sensor 审中-公开
    电容式温度传感器

    公开(公告)号:US20070237204A1

    公开(公告)日:2007-10-11

    申请号:US11217433

    申请日:2005-09-02

    IPC分类号: G01K7/00

    摘要: A capacitive type temperature sensor includes a first electrode layer, a second electrode layer, a dielectric layer positioned between the first and second electrode layers and having a dielectric of which a volume is changed in response to a temperature change, and a temperature calculation unit calculating a temperature corresponding to an electric potential difference between the first and second electrode layers. Accordingly, the capacitive type temperature sensor has a good sensitivity of measuring the temperature and a good accuracy, does not consume a large amount of power, and allows a process of fabricating the same to be simplified.

    摘要翻译: 电容式温度传感器包括第一电极层,第二电极层,位于第一和第二电极层之间的电介质层,并且具有响应于温度变化而体积变化的电介质,温度计算单元计算 对应于第一和第二电极层之间的电位差的温度。 因此,电容型温度传感器具有良好的测量温度和良好的精度的灵敏度,不消耗大量的功率,并且允许简化其制造工艺。

    STRUCTURE FOR REALIZING INTEGRATED CIRCUIT HAVING SCHOTTKY DIODE AND METHOD OF FABRICATING THE SAME
    56.
    发明申请
    STRUCTURE FOR REALIZING INTEGRATED CIRCUIT HAVING SCHOTTKY DIODE AND METHOD OF FABRICATING THE SAME 有权
    用于实现具有肖特基二极管的集成电路的结构及其制造方法

    公开(公告)号:US20080096361A1

    公开(公告)日:2008-04-24

    申请号:US11963354

    申请日:2007-12-21

    IPC分类号: H01L21/20

    CPC分类号: H01L29/872 H01L27/0788

    摘要: An integrated circuit structure in which a plurality of Schottky diodes and a capacitor are integrally formed. The integrated circuit structure includes a substrate including an N-type semiconductor doped with N-type impurities and a P-type semiconductor doped with P-type impurities; a first conductive layer laminated on the substrate so that the first conductive layer is electrically connected to the N-type semiconductor and the P-type semiconductor; a dielectric layer laminated on an upper surface of the first conductive layer; and a second conductive layer laminated on an upper surface of the dielectric layer so that the second conductive layer forms a capacitor together with the first conductive layer and the dielectric layer. Accordingly, when the integrated circuit structure is used in a rectification circuit, the size of an entire circuit can be reduced.

    摘要翻译: 一体形成多个肖特基二极管和电容器的集成电路结构。 集成电路结构包括:衬底,其包括掺杂有N型杂质的N型半导体和掺杂有P型杂质的P型半导体; 层叠在所述基板上的第一导电层,使得所述第一导电层与所述N型半导体和所述P型半导体电连接; 层压在所述第一导电层的上表面上的电介质层; 以及层叠在电介质层的上表面上的第二导电层,使得第二导电层与第一导电层和电介质层一起形成电容器。 因此,当在整流电路中使用集成电路结构时,可以减小整个电路的尺寸。

    Structure for realizing integrated circuit having schottky biode and method of fabricating the same
    57.
    发明申请
    Structure for realizing integrated circuit having schottky biode and method of fabricating the same 有权
    用于实现具有肖特基生物体的集成电路的结构及其制造方法

    公开(公告)号:US20050269658A1

    公开(公告)日:2005-12-08

    申请号:US11147164

    申请日:2005-06-08

    CPC分类号: H01L29/872 H01L27/0788

    摘要: An integrated circuit structure in which a plurality of Schottky diodes and a capacitor are integrally formed. The integrated circuit structure includes a substrate including an N-type semiconductor doped with N-type impurities and a P-type semiconductor doped with P-type impurities; a first conductive layer laminated on the substrate so that the first conductive layer is electrically connected to the N-type semiconductor and the P-type semiconductor; a dielectric layer laminated on an upper surface of the first conductive layer; and a second conductive layer laminated on an upper surface of the dielectric layer so that the second conductive layer forms a capacitor together with the first conductive layer and the dielectric layer. Accordingly, when the integrated circuit structure is used in a rectification circuit, the size of an entire circuit can be reduced.

    摘要翻译: 一体形成多个肖特基二极管和电容器的集成电路结构。 集成电路结构包括:衬底,其包括掺杂有N型杂质的N型半导体和掺杂有P型杂质的P型半导体; 层叠在所述基板上的第一导电层,使得所述第一导电层与所述N型半导体和所述P型半导体电连接; 层压在所述第一导电层的上表面上的电介质层; 以及层叠在电介质层的上表面上的第二导电层,使得第二导电层与第一导电层和电介质层一起形成电容器。 因此,当在整流电路中使用集成电路结构时,可以减小整个电路的尺寸。

    Structure for realizing integrated circuit having Schottky diode and method of fabricating the same
    58.
    发明授权
    Structure for realizing integrated circuit having Schottky diode and method of fabricating the same 有权
    用于实现具有肖特基二极管的集成电路的结构及其制造方法

    公开(公告)号:US07625804B2

    公开(公告)日:2009-12-01

    申请号:US11963354

    申请日:2007-12-21

    IPC分类号: H01L21/20

    CPC分类号: H01L29/872 H01L27/0788

    摘要: An integrated circuit structure in which a plurality of Schottky diodes and a capacitor are integrally formed. The integrated circuit structure includes a substrate including an N-type semiconductor doped with N-type impurities and a P-type semiconductor doped with P-type impurities; a first conductive layer laminated on the substrate so that the first conductive layer is electrically connected to the N-type semiconductor and the P-type semiconductor; a dielectric layer laminated on an upper surface of the first conductive layer; and a second conductive layer laminated on an upper surface of the dielectric layer so that the second conductive layer forms a capacitor together with the first conductive layer and the dielectric layer. Accordingly, when the integrated circuit structure is used in a rectification circuit, the size of an entire circuit can be reduced.

    摘要翻译: 一体形成多个肖特基二极管和电容器的集成电路结构。 集成电路结构包括:衬底,其包括掺杂有N型杂质的N型半导体和掺杂有P型杂质的P型半导体; 层叠在所述基板上的第一导电层,使得所述第一导电层与所述N型半导体和所述P型半导体电连接; 层压在所述第一导电层的上表面上的电介质层; 以及层叠在电介质层的上表面上的第二导电层,使得第二导电层与第一导电层和电介质层一起形成电容器。 因此,当在整流电路中使用集成电路结构时,可以减小整个电路的尺寸。

    Temperature measurement apparatus and method for measuring temperatures by using RF signals of different frequencies
    60.
    发明申请
    Temperature measurement apparatus and method for measuring temperatures by using RF signals of different frequencies 失效
    通过使用不同频率的RF信号测量温度的温度测量装置和方法

    公开(公告)号:US20050276307A1

    公开(公告)日:2005-12-15

    申请号:US11148304

    申请日:2005-06-09

    CPC分类号: G01K13/00 G01K1/024 G01K7/01

    摘要: Disclosed are a temperature measurement apparatus and method for measuring temperature by using RF signals having different frequencies. The temperature measurement apparatus includes a parameter generation unit for generating a first parameter based on a radio frequency (RF) signal having a first frequency and a second parameter based on an RF signal having a second frequency; a parameter detection unit for detecting the generated first and second parameters; and a control unit for calculating a temperature value based on the detected first and second parameters. Accordingly, the temperature measurement apparatus can measure temperature by use of existing components and received RF signals without any addition of a temperature sensor, as well as measure temperature precisely without having any influence on the intensities of RF signals that can vary due to the changes of transmission distances and signal-receiving environments.

    摘要翻译: 公开了通过使用具有不同频率的RF信号来测量温度的温度测量装置和方法。 温度测量装置包括参数产生单元,用于基于具有第二频率的RF信号的具有第一频率和第二参数的射频(RF)信号产生第一参数; 参数检测单元,用于检测所生成的第一和第二参数; 以及控制单元,用于基于检测到的第一和第二参数来计算温度值。 因此,温度测量装置可以通过使用现有部件和接收的RF信号而不加温度传感器来测量温度,并且可以精确地测量温度,而不会对RF信号的强度产生任何影响,RF信号的强度可能由于 传输距离和信号接收环境。