公开(公告)号：US20080203071A1

公开(公告)日：2008-08-28

申请号：US12052577

申请日：2008-03-20

Applicant: Yunlong Sun ,  Richard Harris ,  Ho Wai Lo ,  Brian Baird ,  Jay Johnson ,  Robert F. Hainsey

Inventor： Yunlong Sun ,  Richard Harris ,  Ho Wai Lo ,  Brian Baird ,  Jay Johnson ,  Robert F. Hainsey

IPC: B23K26/00

CPC classification number: H01L23/5258 ,  B23K26/0613 ,  B23K26/0622 ,  B23K2101/40 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.

Abstract translation: 具有特别定制的时间功率分布的激光脉冲代替传统的时间形状或基本上正方形的形状来切断IC连接。 特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲，或者在激光脉冲的持续时间内具有尖峰​​。 尖峰的定时优先设置在链路被大部分去除的时间之前。 特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长（例如绿色和紫外线）来切断连接，而不会对基板和钝化结构材料的任何一侧和底层 链接。

公开(公告)号：US20060138106A1

公开(公告)日：2006-06-29

申请号：US11359642

申请日：2006-02-21

Applicant: Yunlong Sun ,  Edward Swenson ,  Richard Harris

Inventor： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC: B23K26/16

CPC classification number: B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20060138096A1

公开(公告)日：2006-06-29

申请号：US11291523

申请日：2005-11-30

Applicant: Yunlong Sun ,  Edward Swenson ,  Richard Harris

Inventor： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC: B23K26/00

CPC classification number: B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20060131287A1

公开(公告)日：2006-06-22

申请号：US11292297

申请日：2005-11-30

Applicant: Yunlong Sun ,  Edward Swenson ,  Richard Harris

Inventor： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC: B23K26/16

CPC classification number: B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20060131285A1

公开(公告)日：2006-06-22

申请号：US11286132

申请日：2005-11-23

Applicant: Yunlong Sun ,  Edward Swenson ,  Richard Harris

Inventor： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC: B23K26/16 ,  B23K26/00

CPC classification number: B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20060128073A1

公开(公告)日：2006-06-15

申请号：US11067464

申请日：2005-02-25

Applicant: Yunlong Sun ,  Richard Harris ,  Kelly Bruland ,  Robert Hainsey ,  Ho Lo ,  Lei Sun

Inventor： Yunlong Sun ,  Richard Harris ,  Kelly Bruland ,  Robert Hainsey ,  Ho Lo ,  Lei Sun

IPC: H01L21/82 ,  B23K26/16

CPC classification number: H01L23/5258 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/067 ,  B23K26/361 ,  B23K26/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/172 ,  B23K2103/26 ,  B23K2103/50 ,  H01L2924/0002 ,  H01S3/10046 ,  H01S3/2383 ,  Y10S438/94 ,  H01L2924/00

Abstract: A specially shaped laser pulse energy profile characterized by different laser wavelengths at different times of the profile provides reduced, controlled jitter to enable semiconductor device micromachining that achieves high quality processing and a smaller possible spot size.

Abstract translation: 在轮廓不同时刻，不同激光波长的特殊形状的激光脉冲能量分布提供了减少的受控抖动，从而能够实现高质量处理和较小可能光斑尺寸的半导体器件微机械加工。

公开(公告)号：US20060126674A1

公开(公告)日：2006-06-15

申请号：US11067470

申请日：2005-02-25

Applicant: Yunlong Sun ,  Lei Sun

Inventor： Yunlong Sun ,  Lei Sun

IPC: H01S3/11

CPC classification number: H01S3/082 ,  B23K26/0622 ,  H01S3/07 ,  H01S3/0805 ,  H01S3/08086 ,  H01S3/083 ,  H01S3/10038 ,  H01S3/10046 ,  H01S3/109 ,  H01S3/117 ,  H01S3/127 ,  H01S3/1611

Abstract: A plurality of subresonators (12, 14), having different design configurations, share a common resonator section (18) such that the lasing action can be substantially synchronized to provide coherent laser pulses that merge the different respective pulse energy profile and/or pulse width characteristics imparted by the configurations of the subresonators (12, 14). The subresonators (12, 14) may share a laser medium (42) in the common section, or each distinct subresonator section (28, 36) may have its own laser medium (42). Exemplary long and short subresonators (12, 14) generate specially tailored laser pulses having a short rise time and a long pulse width at one wavelength or two different wavelengths that may be beneficial for a variety of laser and micromachining applications including memory link processing.

Abstract translation: 具有不同设计配置的多个子共振器（12,14）共享公共谐振器部分（18），使得激光作用可以基本上同步，以提供合并不同的相应脉冲能量分布和/或脉冲宽度的相干激光脉冲 通过子共振器（12,14）的构造赋予的特性。 子共振器（12,14）可以在公共部分中共享激光介质（42），或者每个不同的子谐振器部分（28,36）可以具有其自己的激光介质（42）。 示例性的长和短子谐振器（12,14）产生特定定制的激光脉冲，其具有在一个波长或两个不同波长处具有短的上升时间和长脉冲宽度，这可能对于包括存储器链路处理的各种激光和微加工应用有利。

公开(公告)号：US06949449B2

公开(公告)日：2005-09-27

申请号：US10618377

申请日：2003-07-11

Applicant: Edward J. Swenson ,  Yunlong Sun ,  Manoj Kumar Sammi ,  Jay Christopher Johnson

Inventor： Edward J. Swenson ,  Yunlong Sun ,  Manoj Kumar Sammi ,  Jay Christopher Johnson

IPC: B23K26/04 ,  B23K26/06 ,  B23K26/08 ,  B23K26/40 ,  B28D5/00 ,  H01L21/301 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01S20060101

CPC classification number: B23K26/0622 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/52 ,  B28D5/0011 ,  H01L2224/16 ,  H01L2924/0102 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/09701 ,  Y10S438/94

Abstract: A method of forming a scribe line having a sharp snap line entails directing a UV laser beam along a ceramic substrate such that a portion of the thickness of the ceramic substrate is removed. The UV laser beam forms a scribe line in the ceramic substrate in the absence of appreciable ceramic substrate melting so that a clearly defined snap line forms a region of high stress concentration extending into the thickness of the ceramic substrate. Consequently, multiple depthwise fractures propagate into the thickness of the ceramic substrate in the region of high stress concentration in response to a breakage force applied to either side of the scribe line to effect clean breakage of the ceramic substrate into separate circuit components. The formation of this region facilitates higher precision breakage of the ceramic substrate while maintaining the integrity of the interior structure of each component during and after application of the breakage force.

Abstract translation: 形成具有尖锐捕捉线的划线的方法需要沿着陶瓷衬底引导UV激光束，使得陶瓷衬底的厚度的一部分被去除。 UV激光束在不存在可观的陶瓷衬底熔化的情况下在陶瓷衬底中形成划线，使得清晰定义的捕捉线形成延伸到陶瓷衬底的厚度的高应力集中区域。 因此，响应于施加到划线的任一侧的断裂力，多个深度方面的断裂在高应力集中区域中传播到陶瓷基板的厚度中，以使陶瓷基板清洁地破碎成单独的电路部件。 该区域的形成有助于陶瓷衬底的更高精度的破坏，同时在施加破损力的同时保持每个部件的内部结构的完整性。

公开(公告)号：US20050067388A1

公开(公告)日：2005-03-31

申请号：US10921481

申请日：2004-08-18

Applicant: Yunlong Sun ,  Richard Harris ,  Ho Lo ,  Brian Baird ,  Jay Johnson

Inventor： Yunlong Sun ,  Richard Harris ,  Ho Lo ,  Brian Baird ,  Jay Johnson

IPC: B23K20060101 ,  B23K26/06 ,  B23K26/38 ,  H01S20060101 ,  H04J14/02

CPC classification number: H01L23/5258 ,  B23K26/0613 ,  B23K26/0622 ,  B23K2101/40 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.

Abstract translation: 具有特别定制的时间功率分布的激光脉冲代替传统的时间形状或基本上正方形的形状来切断IC连接。 特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲，或者在激光脉冲的持续时间内具有尖峰​​。 尖峰的定时优先设置在链路被大部分去除的时间之前。 特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长（例如绿色和紫外线）来切断连接，而不会对基板和钝化结构材料的任何一侧和底层 链接。

公开(公告)号：US06676878B2

公开(公告)日：2004-01-13

申请号：US10165428

申请日：2002-06-06

Applicant: James N. O'Brien ,  Lian-Cheng Zou ,  Yunlong Sun

Inventor： James N. O'Brien ,  Lian-Cheng Zou ,  Yunlong Sun

IPC: B23K2604

CPC classification number: B23K26/0622 ,  B23K26/032 ,  B23K26/066 ,  B23K26/073 ,  B23K26/083 ,  B23K26/0869 ,  B23K26/364 ,  B23K26/38 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50

Abstract: UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 &mgr;m to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned within a second short segment (122) for a predetermined number of passes. The bite size, segment size (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path 112 where the cut is already completed. Polarization direction of the laser output (32) is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths.

Abstract translation: 通过将长切割路径（112）分成短片段（122），从大约10um到1mm来改进通过硅和类似材料的UV激光切割吞吐量。 激光输出（32）在第一短段（122）内扫描预定数量的通过，然后移动到第二短段（122）内并在第二短段（122）内扫描预定次数的通过次数。 可以操纵咬合尺寸，段尺寸（126）和段重叠（136）以最小化沟槽回填的数量和类型。 采用实时监控来减少已经完成切割的切割路径112的重新扫描部分。 激光输出（32）的极化方向也与切割方向相关，以进一步提高吞吐量。 该技术可用于切割具有各种不同激光和波长的各种材料。