公开(公告)号：US08118211B2

公开(公告)日：2012-02-21

申请号：US12866121

申请日：2009-01-16

申请人： Ronald Eisele ,  Mathias Kock

发明人： Ronald Eisele ,  Mathias Kock

IPC分类号： B23K31/00 ,  B23K31/02

CPC分类号： H01L21/50 ,  H01L23/3735 ,  H01L23/49531 ,  H01L24/48 ,  H01L25/165 ,  H01L2224/29339 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/8384 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/83205 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for the low-temperature pressure sintering of at least one electronic unit to be contacted thermally, firmly connected mechanically, and located on a substrate, comprising the following steps: pressing the electronic unit using a mold enveloping matrix while sparing a connecting surface of the substrate for a heat sink connection, providing a heat sink plate, applying a sintering connecting layer onto the spared region of the connecting surface and/or onto to the region of the heat sink plate provided for contacting, and bonding of the heat sink plate to the substrate of the electronic unit in the region of the connecting surface using silver low-temperature pressure sintering technology.

摘要翻译： 一种用于低温加压烧结的至少一个待接触的电子单元的方法，机械地牢固地连接并位于基板上，包括以下步骤：使用模具包封基体压制电子单元，同时节省 用于散热器连接的基板，提供散热板，将烧结连接层施加到连接表面的剩余区域上和/或到达散热板的区域，所述区域设置用于接触和结合散热板 使用银低温压力烧结技术在连接面的区域中的电子单元的基板。

公开(公告)号：US08066057B2

公开(公告)日：2011-11-29

申请号：US10577140

申请日：2004-10-26

申请人： Klaus Kristen Olesen

发明人： Klaus Kristen Olesen

IPC分类号： F28F7/00 ,  F28D15/00

CPC分类号： F28F9/0268 ,  F28F3/12 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A distributor (1) for distributing a flow of cooling fluid over one or more surface(s) (3) to be cooled has a housing (13) that may be manufactured in a single piece together with inlet (8) and outlet (9) manifolds and a plurality of flow cells (26, 27, 28, 29). The flow cells (26, 27, 28, 29) may be connected in parallel between the manifolds (8, 9), and may be adapted to cool multiple surfaces (3) simultaneously. The present invention is also directed to a fluid-coolable unit comprising a distributor (1) for removing heat from an electronic circuit, such as integrated circuit or CPU.

摘要翻译： 用于将冷却流体流分配在要冷却的一个或多个表面（3）上的分配器（1）具有壳体（13），其可以与入口（8）和出口（9）一起制成单件 ）歧管和多个流动池（26,27,28,29）。 流动池（26,27,28,29）可以在歧管（8,9）之间并联连接，并且可以适于同时冷却多个表面（3）。 本发明还涉及一种流体冷却单元，其包括用于从诸如集成电路或CPU的电子电路移除热量的分配器（1）。

公开(公告)号：US07360582B2

公开(公告)日：2008-04-22

申请号：US10577027

申请日：2004-10-26

申请人： Klaus Kristen Olesen

发明人： Klaus Kristen Olesen

IPC分类号： F28F7/02

CPC分类号： F28F9/0268 ,  F28F3/12 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling unit for cooling in particular power semiconductors contains a distributor for guiding liquid across a surface to be cooled. The distributor comprises an inlet manifold (8) and outlet manifold (9), whereby the inlet and outlet manifolds are connected through a flow cell, which has a main flow channel (50). The main channel is formed as a meandering sequence of channel segments (61,62,63,64). It has been found, that the transfer of heat by the liquid in the main flow channel can be improved by introducing a bypass flow channel (71,72,73) which allows the flow of liquid from the cell inlet to the cell outlet, wherein the bypass flow channel interconnects the channel segments of the main flow channel.

摘要翻译： 用于冷却特定功率半导体的冷却单元包含用于引导液体穿过待冷却表面的分配器。 分配器包括入口歧管（8）和出口歧管（9），由此入口歧管和出口歧管通过具有主流动通道（50）的流动池连接。 主通道形成为通道段的曲折序列（61,62,63,64）。 已经发现，可以通过引入允许液体从细胞入口流到细胞出口的旁路流动通道（71,72,73）来改善主流道中的液体的热传递，其中 旁通流动通道将主流动通道的通道段相互连接。

公开(公告)号：US07339788B2

公开(公告)日：2008-03-04

申请号：US10512902

申请日：2003-05-07

申请人： Klaus Kristen Olesen ,  Ronald Eisele ,  Steen Lauridsen

发明人： Klaus Kristen Olesen ,  Ronald Eisele ,  Steen Lauridsen

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： F28F9/0268 ,  F28D2021/0029 ,  F28F3/12 ,  F28F13/06 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20927 ,  H01L2924/00

摘要： A liquid-cooled power semiconductor unit has components to be cooled arranged on the upper side of a plate. The bottom side of the plate is cooled by liquid, which is guided along the plate by means of a distributing element, and the liquid inlet and the liquid outlet of the distributing element are preferably arranged perpendicular to the plate. The distributing element is divided into cells, where each cell has a liquid inlet and a liquid outlet perpendicular to the cooled plate, and the distributing element has multiple cells along the plate.

摘要翻译： 液冷功率半导体单元具有布置在板的上侧的要冷却的部件。 板的底侧由液体冷却，液体通过分配元件沿着板引导，分配元件的液体入口和液体出口优选地垂直于板布置。 分配元件分为单元，其中每个单元具有液体入口和垂直于冷却板的液体出口，并且分配元件沿着该板具有多个单元。

公开(公告)号：US20070215332A1

公开(公告)日：2007-09-20

申请号：US10592249

申请日：2005-03-09

申请人： Ronald Eisele ,  Klaus Olesen

发明人： Ronald Eisele ,  Klaus Olesen

IPC分类号： F28F3/12

CPC分类号： F28F3/12 ,  F28F9/0268 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention provides a fluid cooling system comprising a heat exchanger with an outer wall forming a chamber with an inlet and an outlet for circulating a heat exchange medium in the chamber. The chamber has an opening towards the component which is to be cooled, and to protect the component, the opening is closed by a flexible wall which is attached to the outer wall. To protect the cover and the component against overload, the flexible wall is attached to an inner wall inside the chamber. The cooling system could be applied to electronic systems, e.g. for cooling a DCB substrate or similar electronic components.

摘要翻译： 本发明提供了一种流体冷却系统，其包括具有外壁的热交换器，所述外壁形成具有用于使所述室中的热交换介质循环的入口和出口的室。 腔室具有朝向要被冷却的部件的开口，并且为了保护部件，开口被附接到外壁的柔性壁封闭。 为了保护盖和部件免受过载，柔性壁附接到室内的内壁。 冷却系统可以应用于电子系统，例如， 用于冷却DCB基板或类似的电子部件。

公开(公告)号：US20070119574A1

公开(公告)日：2007-05-31

申请号：US10577027

申请日：2004-10-26

申请人： Klaus Olesen

发明人： Klaus Olesen

IPC分类号： F28F27/02 ,  F28D1/02

CPC分类号： F28F9/0268 ,  F28F3/12 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling unit for cooling in particular power semiconductors contains a distributor for guiding liquid across a surface to be cooled. The distributor comprises an inlet manifold (8) and outlet manifold (9), whereby the inlet and outlet manifolds are connected through a flow cell, which has a main flow channel (50). The main channel is formed as a meandering sequence of channel segments (61,62,63,64). It has been found, that the transfer of heat by the liquid in the main flow channel can be improved by introducing a bypass flow channel (71,72,73) which allows the flow of liquid from the cell inlet to the cell outlet, wherein the bypass flow channel interconnects the channel segments of the main flow channel.

摘要翻译： 用于冷却特定功率半导体的冷却单元包含用于引导液体穿过待冷却表面的分配器。 分配器包括入口歧管（8）和出口歧管（9），由此入口歧管和出口歧管通过具有主流动通道（50）的流动池连接。 主通道形成为通道段的曲折序列（61,62,63,64）。 已经发现，可以通过引入允许液体从细胞入口流到细胞出口的旁路流动通道（71,72,73）来改善主流道中的液体的热传递，其中 旁通流动通道将主流动通道的通道段相互连接。

公开(公告)号：US20070062673A1

公开(公告)日：2007-03-22

申请号：US10577140

申请日：2004-10-26

申请人： Klaus Olesen

发明人： Klaus Olesen

IPC分类号： H05K7/20

CPC分类号： F28F9/0268 ,  F28F3/12 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A distributor (1) for distributing a flow of cooling fluid over surface(s) (3) to be cooled. Has a housing (13) manufactured in a single piece with inlet (8) and outlet (9) manifolds and a plurality of flow cells (26, 27, 28, 29). Makes it easier and more cost effective to manufacture the distributor (1). The flow cells (26, 27, 28, 29) may be connected in parallel between the manifolds (8, 9). May be adapted to cool two or more surfaces (3) simultaneously. Also a fluid-coolable unit comprising the distributor (1). Suitable for removing heat from an electronic circuit, such as integrated circuit or CPU.

摘要翻译： 一种用于在要冷却的表面（3）上分配冷却流体流的分配器（1）。 具有制造成具有入口（8）和出口（9）歧管的单件的壳体（13）和多个流动池（26,27,28,29）。 制造分配器（1）使其变得更容易和更具成本效益。 流通池（26,27,28,29）可以在歧管（8,9）之间并联连接。 可以适应同时冷却两个或多个表面（3）。 也是包括分配器（1）的流体可冷却单元。 适用于从电子电路（如集成电路或CPU）中除去热量。

公开(公告)号：US20050143000A1

公开(公告)日：2005-06-30

申请号：US10502146

申请日：2003-01-22

申请人： Ronald Eisele ,  Klaus Olesen

发明人： Ronald Eisele ,  Klaus Olesen

IPC分类号： F28F3/08 ,  F28F13/02 ,  H01L23/367 ,  H01L23/473 ,  H05K7/20

CPC分类号： H05K7/20927 ,  F28F3/086 ,  F28F13/02 ,  H01L23/3677 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20345 ,  H05K7/20918 ,  H01L2924/00

摘要： The invention relates to a cooling device comprising a heat-conducting cooling plate on the side of the electronic power components to be cooled and a platelike cooling fluid distributing device. The distributing device has cooling fluid outlets on the side facing the cooling plate, said outlets being arranged at a distance from and pointing towards the cooling plate. The distributing device also comprises at least one drain outlet for the cooling fluid. The invention aims at providing a cooling device which is suitable for different forms and number of power components and ensures even cooling throughout the entire cooling surface for different forms and number of power components while simplifying the production of said cooling device. In order to achieve said aims, the cooling device comprises a first plate in which outlets and a plurality of drain outlets are evenly distributed and a second plate and a third plate which are superimposed, wherein two plates define a feed channel that is connected to all outlets and a drain channel that is connected to all drain outlets.

摘要翻译： 本发明涉及一种冷却装置，其包括在要冷却的电子功率部件侧的导热冷却板和板状冷却流体分配装置。 分配装置在面向冷却板的一侧具有冷却流体出口，所述出口布置成与冷却板相距一定距离。 分配装置还包括用于冷却流体的至少一个排出口。 本发明旨在提供一种适用于不同形式和数量的功率部件的冷却装置，并且确保了在整个冷却表面中的均匀冷却，用于不同形式和数量的功率部件，同时简化了所述冷却装置的生产。 为了实现上述目的，冷却装置包括：第一板，其中出口和多个排出口均匀分布，第二板和第三板重叠，其中两个板限定一个连接到所有的进料通道 出口和连接到所有排水出口的排水通道。

公开(公告)号：US20230120927A1

公开(公告)日：2023-04-20

申请号：US17766560

申请日：2020-10-07

申请人： Danfoss Silicon Power GmbH

发明人： Henning STRÖBEL-MAIER ,  Klaus OLESEN

IPC分类号： H01L23/473

摘要： A cooling system (26) comprising a cooling arrangement (24, 24′, 24″) having a serpentine passageway (20) for a circulating fluid coolant is disclosed. The serpentine passageway (20) is provided between a plurality of walls (6, 8) displaced from each other. A series of baffles (10) each having a proximal portion (12) and a distal portion (14) are disposed within the passageway (20). The baffles (10) extend from one of the walls into the passageway (20). The distal portion (14) has a width (W2) that is larger than the width (W1) of the proximal portion (12).

公开(公告)号：US20230114396A1

公开(公告)日：2023-04-13

申请号：US17909471

申请日：2021-03-08

申请人： Danfoss Silicon Power GmbH

发明人： Ole MÜHLFELD ,  Klaus OLESEN ,  Matthias BECK ,  Holger ULRICH ,  Martin BECKER

IPC分类号： H01L23/498 ,  H01L23/373

摘要： A power module (2) including a rigid insulated substrate (10) mounted on a baseplate (4) is disclosed. An additional circuit carrier (6, 8) is mounted on the baseplate (4) adjacent to the rigid insulated substrate (10). The additional circuit carrier (6, 8) has a rigidity which is less than that of the rigid insulated substrate (10).