公开(公告)号：US09040338B2

公开(公告)日：2015-05-26

申请号：US13883348

申请日：2011-10-28

申请人： Ronald Eisele

发明人： Ronald Eisele

IPC分类号： H01L21/00 ,  H01L37/00 ,  G01K7/16 ,  H01L23/15 ,  H01L23/34 ,  H01L23/00

CPC分类号： H01L37/00 ,  G01K7/16 ,  H01L23/15 ,  H01L23/34 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/8384 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/83205

摘要： Method of manufacturing sinterable electrical components for jointly sintering with active components, the components in planar shape being provided with at least one planar lower face meant for sintering, and an electrical contact area on the face opposite to the sintering face being available in the form of a metallic contact face, whose upper side is contactable by means of a commonly known method of the group: wire bonding or soldering or sintering or pressure contacting, the component being a temperature sensor, whose lower face is provided with a sinterable metallization on a ceramic body, said ceramic body having two electrical contact faces for continued electrical connection.

摘要翻译： 制造用于与活性组分共同烧结的可烧结电气部件的方法，平面形状的部件设置有用于烧结的至少一个平面下表面，并且与烧结面相对的表面上的电接触面积可以以 金属接触面，其上侧可通过本发明的公知的方法接触：导线接合或焊接或烧结或压力接触，所述部件是温度传感器，其下表面在陶瓷上设置有可烧结金属化 所述陶瓷体具有两个用于继续电连接的电接触面。

公开(公告)号：US20140225247A1

公开(公告)日：2014-08-14

申请号：US14346458

申请日：2012-09-10

申请人： Martin Becker ,  Ronald Eisele ,  Frank Osterwald ,  Jacek Rudzki

发明人： Martin Becker ,  Ronald Eisele ,  Frank Osterwald ,  Jacek Rudzki

IPC分类号： H01L23/492

CPC分类号： H01L24/85 ,  H01L21/6835 ,  H01L23/4924 ,  H01L23/562 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68372 ,  H01L2224/03013 ,  H01L2224/0311 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/2908 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48491 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/786 ,  H01L2224/83801 ,  H01L2224/8382 ,  H01L2224/8384 ,  H01L2224/85001 ,  H01L2924/00015 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/1203 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/2076 ,  H01L2924/00 ,  H01L2924/00011

摘要： The invention relates to a power semiconductor chip (10) having at least one upper-sided potential surface and contacting thick wires (50) or strips, comprising a connecting layer (I) on the potential surfaces, and at least one metal moulded body (24, 25) on the connecting layer(s), the lower flat side thereof facing the potential surface being provided with a coating to be applied to the connecting layer (I) according to a connection method, and the material composition thereof and the thickness of the related thick wires (50) or strips arranged on the upper side of the moulded body used according to the method for contacting are selected corresponding to the magnitude.

摘要翻译： 本发明涉及一种功率半导体芯片（10），其具有至少一个上侧电位表面，并且接触厚电线（50）或条带，包括在电位表面上的连接层（I）和至少一个金属模制体 24,25），其面向电位表面的下平面侧根据连接方法设置有施加到连接层（I）的涂层，其材料组成和厚度 根据接触方法使用的相关的粗线（50）或布置在模制体的上侧上的条对应于大小来选择。

公开(公告)号：US20120282772A1

公开(公告)日：2012-11-08

申请号：US13460939

申请日：2012-05-01

申请人： Mathias Kock ,  Ronald Eisele

发明人： Mathias Kock ,  Ronald Eisele

IPC分类号： H01L21/283

CPC分类号： H01L21/568 ,  C23C4/01 ,  C23C4/02 ,  C23C4/134 ,  C23C4/18 ,  H01L21/561 ,  H01L21/6836 ,  H01L24/03 ,  H01L24/05 ,  H01L24/93 ,  H01L2221/68327 ,  H01L2224/03002 ,  H01L2224/03418 ,  H01L2224/03442 ,  H01L2224/03444 ,  H01L2224/056 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/00014 ,  H01L2224/03

摘要： A method of manufacturing a semiconductor component includes the steps of manufacturing of a wafer, applying structures of components on the wafer to form a wafer assembly, applying a metal coating on the wafer, removing the metal coating in non-contact areas of the components, applying surrounds on the edge areas of the components, arranging the wafer on a foil held by a clamping ring, separating the components of the wafer compound carried by the foil from one another, arranging a covering mask on the areas of the separated components carried by the foil which are not to be coated, applying a metal coating on the separate components covered with the mask, removal of the mask, and removal of the components from the foil and further processing the separate components wherein that applying a metal coating on the separate components covered by the mask takes place by means of thermal spraying.

摘要翻译： 制造半导体部件的方法包括以下步骤：制造晶片，在晶片上施加部件结构以形成晶片组件，在晶片上施加金属涂层，去除部件非接触区域中的金属涂层， 在组件的边缘区域上施加周围环境，将晶片布置在由夹紧环保持的箔上，将由箔承载的晶片化合物的组分彼此分离，将覆盖掩模布置在由 不要被涂覆的箔，在被掩模覆盖的单独部件上施加金属涂层，去除掩模，以及从箔中去除组分并进一步处理单独的部件，其中在单独的部件上施加金属涂层 掩模覆盖的部件通过热喷涂进行。

公开(公告)号：US20070210445A1

公开(公告)日：2007-09-13

申请号：US11597158

申请日：2005-05-24

申请人： Klaus Olesen ,  Ronald Eisele

发明人： Klaus Olesen ,  Ronald Eisele

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention relates to a power semiconductor module comprising a plurality of power semiconductors that are fixed to a first side of a printed circuit board (26), and a cooling device that acts by means of a coolant, on a second side of the printed circuit board (26), opposite the first side, the cooling device comprising a plurality of cells through which the coolant is guided. The aim of the invention is to minimise the risk of failure of one such power semiconductor module. To this end, a non-cooled region (d, e, f is arranged between at least two cells.

摘要翻译： 本发明涉及一种功率半导体模块，其包括固定到印刷电路板（26）的第一侧的多个功率半导体以及在印刷电路的第二面上借助于冷却剂作用的冷却装置 板（26），与第一侧相对，冷却装置包括多个单元，冷却剂通过该单元被引导。 本发明的目的是最小化一个这样的功率半导体模块故障的风险。 为此，非冷却区域（d，e，f）设置在至少两个单元之间。

公开(公告)号：US09287232B2

公开(公告)日：2016-03-15

申请号：US13148848

申请日：2010-02-04

申请人： Mathias Kock ,  Ronald Eisele

发明人： Mathias Kock ,  Ronald Eisele

IPC分类号： B23K1/20 ,  H01L23/00 ,  H01L25/00

CPC分类号： H01L24/33 ,  H01L24/27 ,  H01L24/29 ,  H01L24/34 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/27505 ,  H01L2224/29101 ,  H01L2224/29339 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/83193 ,  H01L2224/83207 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8484 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/01007 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/37099

摘要： The invention relates to a method for producing a connection between a semiconductor component and semiconductor component and semiconductor module resistant to high temperatures and temperature changes by means of a temperature impinging process, wherein a metal powder suspension is applied to the areas of the semiconductor module to be connected later; the suspension layer is dried, outgassing the volatile components and generating a porous layer; the porous layer is pre-sealed without complete sintering taking place throughout the suspension layer; and, in order to obtain a solid electrically and thermally conductive connection of a semiconductor module to a connection partner from the group of: substrate, further semiconductor or interconnect device, the connection is a sintered connection generated without compression by increasing the temperature and made of a dried metal powder suspension that has undergone a first transport-safe contact with the connection partner in a pre-compression step and has been solidified at zero pressure using temperature sintering.

摘要翻译： 本发明涉及一种用于通过温度冲击工艺制造半导体部件和半导体部件与耐高温和温度变化的半导体组件之间的连接的方法，其中将金属粉末悬浮液施加到半导体模块的区域 稍后连接 将悬浮液层干燥，除去挥发性成分，生成多孔层; 多孔层预先密封，没有完全烧结发生在整个悬浮层中; 并且为了获得半导体模块与基板，另外的半导体或互连装置的连接伙伴的固体导电和导热连接，该连接是通过增加温度而不压缩产生的烧结连接，并由 在预压缩步骤中已经与连接伙伴进行第一次运输安全接触并在零压力下使用温度烧结固化的干燥的金属粉末悬浮液。

公开(公告)号：US08802564B2

公开(公告)日：2014-08-12

申请号：US13460939

申请日：2012-05-01

申请人： Mathias Kock ,  Ronald Eisele

发明人： Mathias Kock ,  Ronald Eisele

IPC分类号： H01L21/44

CPC分类号： H01L21/568 ,  C23C4/01 ,  C23C4/02 ,  C23C4/134 ,  C23C4/18 ,  H01L21/561 ,  H01L21/6836 ,  H01L24/03 ,  H01L24/05 ,  H01L24/93 ,  H01L2221/68327 ,  H01L2224/03002 ,  H01L2224/03418 ,  H01L2224/03442 ,  H01L2224/03444 ,  H01L2224/056 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/00014 ,  H01L2224/03

摘要： A method of manufacturing a semiconductor component includes the steps of manufacturing of a wafer, applying structures of components on the wafer to form a wafer assembly, applying a metal coating on the wafer, removing the metal coating in non-contact areas of the components, applying surrounds on the edge areas of the components, arranging the wafer on a foil held by a clamping ring, separating the components of the wafer compound carried by the foil from one another, arranging a covering mask on the areas of the separated components carried by the foil which are not to be coated, applying a metal coating on the separate components covered with the mask, removal of the mask, and removal of the components from the foil and further processing the separate components wherein that applying a metal coating on the separate components covered by the mask takes place by means of thermal spraying.

摘要翻译： 制造半导体部件的方法包括以下步骤：制造晶片，在晶片上施加部件结构以形成晶片组件，在晶片上施加金属涂层，去除部件非接触区域中的金属涂层， 在组件的边缘区域上施加周围环境，将晶片布置在由夹紧环保持的箔上，将由箔承载的晶片化合物的组分彼此分离，将覆盖掩模布置在由 不要被涂覆的箔，在被掩模覆盖的单独部件上施加金属涂层，去除掩模，以及从箔中去除组分并进一步处理单独的部件，其中在单独的部件上施加金属涂层 掩模覆盖的部件通过热喷涂进行。

公开(公告)号：US20130228890A1

公开(公告)日：2013-09-05

申请号：US13883348

申请日：2011-10-28

申请人： Ronald Eisele

发明人： Ronald Eisele

IPC分类号： H01L37/00

CPC分类号： H01L37/00 ,  G01K7/16 ,  H01L23/15 ,  H01L23/34 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/8384 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/83205

摘要： Method of manufacturing sinterable electrical components for jointly sintering with active components, the components in planar shape being provided with at least one planar lower face meant for sintering, and an electrical contact area on the face opposite to the sintering face being available in the form of a metallic contact face, whose upper side is contactable by means of a commonly known method of the group: wire bonding or soldering or sintering or pressure contacting, the component being a temperature sensor, whose lower face is provided with a sinterable metallisation on a ceramic body, said ceramic body having two electrical contact faces for continued electrical connection.

摘要翻译： 制造用于与活性组分共同烧结的可烧结电气部件的方法，平面形状的部件设置有用于烧结的至少一个平面下表面，并且与烧结面相对的表面上的电接触面积可以以 金属接触面，其上侧可以通过本发明的一般公知的方法接触：引线接合或焊接或烧结或压力接触，所述部件是温度传感器，其下表面在陶瓷上设置可烧结金属化 所述陶瓷体具有两个用于继续电连接的电接触面。

公开(公告)号：US20120037688A1

公开(公告)日：2012-02-16

申请号：US13148848

申请日：2010-02-04

申请人： Mathias Kock ,  Ronald Eisele

发明人： Mathias Kock ,  Ronald Eisele

IPC分类号： B23K1/20 ,  B23K31/02

CPC分类号： H01L24/33 ,  H01L24/27 ,  H01L24/29 ,  H01L24/34 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/27505 ,  H01L2224/29101 ,  H01L2224/29339 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/83193 ,  H01L2224/83207 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8484 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/01007 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/37099

摘要： The invention relates to a method for producing a connection between a semiconductor component and semiconductor component and semiconductor module resistant to high temperatures and temperature changes by means of a temperature impinging process, wherein a metal powder suspension is applied to the areas of the semiconductor module to be connected later; the suspension layer is dried, outgassing the volatile components and generating a porous layer; the porous layer is pre-sealed without complete sintering taking place throughout the suspension layer; and, in order to obtain a solid electrically and thermally conductive connection of a semiconductor module to a connection partner from the group of: substrate, further semiconductor or interconnect device, the connection is a sintered connection generated without compression by increasing the temperature and made of a dried metal powder suspension that has undergone a first transport-safe contact with the connection partner in a pre-compression step and has been solidified at zero pressure using temperature sintering.

摘要翻译： 本发明涉及一种用于通过温度冲击工艺制造半导体部件和半导体部件与耐高温和温度变化的半导体组件之间的连接的方法，其中将金属粉末悬浮液施加到半导体模块的区域 稍后连接 将悬浮液层干燥，除去挥发性成分，生成多孔层; 多孔层预先密封，没有完全烧结发生在整个悬浮层中; 并且为了获得半导体模块与基板，另外的半导体或互连装置的连接伙伴的固体导电和导热连接，该连接是通过增加温度而不压缩而产生的烧结连接，并由 在预压缩步骤中已经与连接伙伴进行第一次运输安全接触并在零压力下使用温度烧结固化的干燥的金属粉末悬浮液。

公开(公告)号：US09318421B2

公开(公告)日：2016-04-19

申请号：US14346458

申请日：2012-09-10

申请人： Martin Becker ,  Ronald Eisele ,  Frank Osterwald ,  Jacek Rudzki

发明人： Martin Becker ,  Ronald Eisele ,  Frank Osterwald ,  Jacek Rudzki

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/492 ,  H01L23/00

CPC分类号： H01L24/85 ,  H01L21/6835 ,  H01L23/4924 ,  H01L23/562 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68372 ,  H01L2224/03013 ,  H01L2224/0311 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/2908 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48491 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/786 ,  H01L2224/83801 ,  H01L2224/8382 ,  H01L2224/8384 ,  H01L2224/85001 ,  H01L2924/00015 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/1203 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/2076 ,  H01L2924/00 ,  H01L2924/00011

摘要： The invention relates to a power semiconductor chip (10) having at least one upper-sided potential surface and contacting thick wires (50) or strips, comprising a connecting layer (I) on the potential surfaces, and at least one metal molded body (24, 25) on the connecting layer(s), the lower flat side thereof facing the potential surface being provided with a coating to be applied to the connecting layer (I) according to a connection method, and the material composition thereof and the thickness of the related thick wires (50) or strips arranged on the upper side of the molded body used according to the method for contacting are selected corresponding to the magnitude.

摘要翻译： 本发明涉及一种功率半导体芯片（10），其具有至少一个上侧电位表面，并且接触厚电线（50）或条带，包括在电位表面上的连接层（I）和至少一个金属模制体 24,25），其面向电位表面的下平面侧根据连接方法设置有施加到连接层（I）的涂层，其材料组成和厚度 根据接触方法使用的相关的粗线（50）或布置在模制体的上侧上的条对应于大小来选择。

公开(公告)号：US08546923B2

公开(公告)日：2013-10-01

申请号：US13169200

申请日：2011-06-27

申请人： Ronald Eisele ,  Mathias Kock ,  Teoman Senyildiz

发明人： Ronald Eisele ,  Mathias Kock ,  Teoman Senyildiz

IPC分类号： H01L23/495

CPC分类号： H01L23/49568 ,  H01L23/49586 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Method for manufacturing a rigid power module with a layer that is electrically insulating and conducts well thermally and has been deposited as a coating, the structure having sprayed-on particles that are fused to each other, of at least one material that is electrically insulating and conducts well thermally, having the following steps: manufacturing a one-piece lead frame; populating the lead frame with semiconductor devices, possible passive components, and bonding corresponding connections, inserting the thus populated lead frame into a compression mold so that accessibility of part areas of the lead frame is ensured, pressing a thermosetting compression molding compound into the mold while enclosing the populated lead frame, coating the underside of the thus populated lead frame by thermal spraying in at least the electrically conducting areas and overlapping also the predominant areas of the spaces, filled with mold compound.

摘要翻译： 一种用于制造刚性功率模块的方法，所述刚性功率模块具有电绝缘并且导热良好且已经作为涂层沉积的层，所述结构具有彼此熔合的喷涂颗粒，所述至少一种彼此熔合的至少一种电绝缘材料， 具有良好的热效应，具有以下步骤：制造单件引线框架; 将引线框架与半导体器件，可能的无源部件和粘合相应的连接件相结合，将如此填充的引线框架插入压缩模具中，以便确保引线框架的部分区域的可接近性，将热固性压缩模塑料压入模具中 封闭填充的引线框架，通过在至少导电区域中的热喷涂涂覆如此填充的引线框架的下侧，并且还重叠填充有模具化合物的空间的主要区域。