Abstract:
A device for applying a two-part adhesive to a substrate includes a carrier, a first tray coupled to the carrier, a first package disposed in the first tray, and a second package disposed in the first tray. The first package contains a first part of the two-part adhesive and the second package contains a second part of the two-part adhesive. The device further includes a applicator that is in communication with the first package and the second package. The applicator is configured to receive the first part and the second part and mix the first part and the second part to form the two-part adhesive. The device also includes a second tray coupled to the carrier and configured to accommodate a power supply that provides electrical power to operate the device.
Abstract:
A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, a liquid receiving part, and an upper nozzle. The chamber includes a chamber body and a chamber cover, and the chamber cover is moved up and down. While the chamber cover is in contact with the chamber body, a small sealed space is formed and some processings involving pressure reduction or pressurization are performed. When the chamber cover is moved up, an annular opening is formed between the chamber cover and the chamber body. On an outer side relative to the annular opening, positioned are a first cup part and a second cup part. A processing liquid spattering from a substrate is received by the first cup part or the second cup part. In the substrate processing apparatus, it is possible to perform various processings in the small chamber.
Abstract:
Delivery unit for an application system for an industrial application of an adhesive and/or sealant comprising a line system for the adhesive and/or sealant and an input suitable for the connection of a storage container to the delivery unit and an output suitable for the connection of a dispensing means to dispense the adhesive and/or sealant and a feed pump and a measuring unit to collect data especially about the amount of fed adhesive and/or sealant and an interface to tap the data collected by the measuring unit.
Abstract:
A hot melt system includes a melt system, a feed system, and a dispensing system. Unlike traditional hot melt systems, the melt system is directly connected to a motor-driven pump of the dispensing system, without an intervening accumulation device.
Abstract:
A system for applying a two-part adhesive to a substrate includes a prime mover for providing an output torque, a first pump connected to the prime mover for receiving the output torque, the first pump having an inlet and an outlet, a second pump connected to the prime mover for receiving the output torque, the second pump having an inlet and an outlet, a first compound in communication with the inlet of the first pump, a second compound in communication with the inlet of the second pump, a first accumulator in communication with the outlet of the first pump, a second accumulator in communication with the outlet of the second pump, a first manifold in communication with the outlet of the first pump, and a second manifold in communication with the outlet of the second pump. A plurality of applicators is included.
Abstract:
A dispensing unit for a hot melt adhesive system has a manifold centrally located within the dispensing unit to permit commonality between heated hoses of substantially the same length used to supply adhesive guns at either side of the dispensing unit. The dispensing unit also includes a manifold that is thermally isolated from the adhesive tank. The manifold has a heater that is independent of the tank heater for more precise temperature control of adhesive flowing through the manifold. A pump coupled to the manifold is located external to the tank and is heated by the manifold heater.
Abstract:
A system manages the temperature of thermoplastic material by initiating a default heating cycle in response to a sensor failure. The system may thus continue to heat the thermoplastic material according to the default heating cycle until the sensor can be repaired or replaced. A system controller implements the default heating cycle using a stored profile. That is, the controller causes a heating element to generate heat according to a default heating profile retrieved from a memory. The profile may be determined using historical heating data, user input and/or a factory setting.
Abstract:
A meltblowing method and system for dispensing first and second fluids from corresponding first and second orifices of a die assembly to form a meltblown first fluid filament. The die assembly directs the first and second fluid flows parallelly, or divergently, or directs two second fluid flows convergently toward a common first fluid flow, whereby the first and second fluids are dispensed from orifices at equal first fluid flow rates and equal second fluid flow rates. The die assembly is compressably retained between opposing end plates coupled to an adapter for further coupling to a main manifold having a fluid metering device for supplying first fluid to the die assembly. The meltblown filaments are depositing onto a moving substrate by vacillating the filament non-parallel to a direction of substrate movement, whereby vacillation a first fluid flow is controllable by an angle between the first fluid flow and one or more flanking second fluid flows, among other variables.
Abstract:
The invention provides an adhesive applying method which makes it possible to perform a stabilized adhesive applying operation and to reduce the overall production time. In detecting the amount of adhesive applied and performing a corrective operation so as to ensure application of a predetermined amount of adhesive, a corrected value obtained by a corrective operation is stored at step #5. At step #7, an infinitesimal correction formula which shows the relationship of the corrected value with respect to the amount of adhesive used is found on the basis of the corrected values stored last time and this time and on the basis of the amount of adhesive used during the time from the preceding corrective operation and the current corrective operation. And a productive corrected value found by the infinitesimal correction formula is used for adhesive application from the next time on.
Abstract:
A resin coating system having an endless conveyor for passing components to be coated with resin successively through a preheating station, a resin coating station, and a gelification station. Coated components are exchanged with uncoated components at a transfer station along the conveyor between the gelification station and the preheating station. If an uncoated component is not ready to be transferred into the coating system or later processing machines are not ready to receive a coated component, then exchange of coated and uncoated components does not take place at the transfer station, and the coated component reapproaches the preheating and coating stations. A system and method for allowing coating of uncoated components to be completed while coated components passing through the coating station are prevented from being recoated is also provided.