公开(公告)号：US20030209466A1

公开(公告)日：2003-11-13

申请号：US10420846

申请日：2003-04-23

申请人： Kabushiki Kaisha Toshiba

发明人： Hisayoshi Kunii ,  Koji Koga ,  Reikichi Hatori

IPC分类号： B65D085/90

CPC分类号： H01L21/67333 ,  B65D21/00 ,  H01L2221/68313 ,  Y10S206/832

摘要： A first construction of a tray for electronic parts according to the present invention is provided with an engaging cut-out corner portion which is formed by cutting a corner portion of a table-like flat portion which is arranged diagonally with respect to a-cut-out corner portion. A second construction of a tray for electronic parts according to the present invention is provided with a pawl engaging protruding portion which is formed on a step-like peripheral edge portion above a cut-out portion. In a third construction of a tray for electronic parts according to the present invention, when two trays are stacked up so that the top faces thereof face each other, an engaging first-shaped protrusion which is formed around a predetermined pocket of one tray engages an engaging second-shaped protrusion which is formed around a predetermined pocket of the other tray.

摘要翻译： 根据本发明的用于电子部件的托盘的第一结构设置有接合切口角部，其通过切割相对于切口部分对角地布置的台状平坦部分的角部而形成， 外角部分。 根据本发明的用于电子部件的托盘的第二结构设置有形成在切口部分上方的台阶状周边部分上的棘爪接合突出部分。 在根据本发明的用于电子部件的托盘的第三结构中，当两个托盘堆叠成使得其顶面彼此面对时，形成在一个托盘的预定凹部周围的接合的第一形状的突起与 接合在另一个托盘的预定袋周围形成的第二形突起。

公开(公告)号：US20030147229A1

公开(公告)日：2003-08-07

申请号：US10140089

申请日：2002-05-07

发明人： Song Ping Chen ,  Ru Zheng Liu ,  Joo Yam Lau

IPC分类号： H05K007/02 ,  H05K007/04

CPC分类号： H01L21/67333 ,  H01L2221/68313

摘要： A carrier for handling integrated circuit components during storage and shipping includes a plurality of pocket portions each for supporting an individual component. The pocket portions include a base surface and a plurality of sidewalls defining the pocket generally. The sidewalls include support surfaces arranged at a first, oblique angle relative to the base surface. A plurality of retainer surfaces are associated with at least some of the support surfaces. The retainer surfaces extend at a second angle relative to the base surface. The retainer surfaces cooperate with the support surfaces to maintain the integrated circuit components within the pockets in a desired alignment throughout handling. One example includes guide surfaces that facilitate inserting the components into the pockets.

摘要翻译： 用于在存储和运输期间处理集成电路部件的载体包括多个用于支撑单个部件的袋部。 袋部分包括基部表面和大体上限定袋的多个侧壁。 侧壁包括相对于基面以第一倾斜角布置的支撑表面。 多个保持器表面与至少一些支撑表面相关联。 保持器表面相对于基面以第二角度延伸。 保持器表面与支撑表面配合，以便在整个处理期间将集成电路部件保持在凹槽内期望的对准。 一个例子包括便于将部件插入袋中的引导表面。

公开(公告)号：US06488158B1

公开(公告)日：2002-12-03

申请号：US09659826

申请日：2000-09-11

申请人： Mohammad Khan ,  Raj N. Master ,  Maria G. Guardado ,  Loo L. Teoh ,  Ahmad Juwanda

发明人： Mohammad Khan ,  Raj N. Master ,  Maria G. Guardado ,  Loo L. Teoh ,  Ahmad Juwanda

IPC分类号： A47G1908

CPC分类号： H01L21/67333 ,  H01L21/67336 ,  H01L21/6835 ,  H01L2221/68313

摘要： A boat is formed with a plurality of through-holes sized to securely maintain ceramic or organic flip chip semiconductor packages in place during assembly. Embodiments comprises a boat having a bottom layer with an array of four-sided through-holes and a top layer with an array of through-holes and tabs extending from the sides of the through-hole. Embodiments further include a boat having a bottom layer with through-holes smaller than substantially aligned overlying through-holes in the top layer, the substantially aligned through-holes forming flip chip package holding pockets. An alignment mechanism ensures that components are accurately positioned on flip chip packages held in the boat during assembly.

摘要翻译： 船形成有多个通孔，其尺寸设计成在组装期间可靠地将陶瓷或有机倒装芯片半导体封装保持在适当的位置。 实施例包括具有具有四面通孔阵列的底层和具有从通孔侧面延伸的通孔阵列的顶层的船。 实施例还包括具有底层的船，该底层具有通孔小于顶层中的基本上对准的覆盖通孔，基本对准的通孔形成倒装芯片封装保持袋。 对准机构确保组件准确地定位在组装期间保持在船中的倒装芯片封装上。

公开(公告)号：US06488154B1

公开(公告)日：2002-12-03

申请号：US09688896

申请日：2000-10-16

申请人： Ming-Chuan Yeh

发明人： Ming-Chuan Yeh

IPC分类号： B65D7302

CPC分类号： H01L21/67333 ,  H01L2221/68313

摘要： A chip tray has a rectangular base and a protruded area integrally formed on a top face of the base. The base has a concave area defined in a bottom face of the base, a truncated corner defined to facilitate the alignment with another one and at least one cutout defined in an edge of the base. When multiple chip trays are stacked together with the assistance of the truncated corner and the concave area, the cutouts of multiple chip trays form a slot and thus mistakes such as wrong size or wrong feature of the chips are able to be identified easily.

摘要翻译： 芯片托盘具有矩形基部和一体地形成在基部的顶面上的突出区域。 基部具有限定在基部的底面中的凹入区域，被限定为有助于与另一个基部对准的截顶角和限定在基部的边缘中的至少一个切口的凹陷区域。 当多个芯片托盘在截顶角和凹陷区域的协助下堆叠在一起时，多个芯片托盘的切口形成一个槽，因此能够容易地识别出错误的尺寸或错误特征的错误。

公开(公告)号：US06367635B1

公开(公告)日：2002-04-09

申请号：US09409941

申请日：1999-09-30

申请人： Carl Auer

发明人： Carl Auer

IPC分类号： A47G1908

CPC分类号： H01L21/67333 ,  H01L21/67336 ,  H01L21/6835 ,  H01L2223/54473

摘要： An ultra precision stamped process carrier frame for use in the manufacture of microelectronic devices comprises a frame into which a plurality of precision-stamped apertures are made. Each of the coupon carrying apertures in the frame has a serrated side wall comprising a plurality of fingers extending into the aperture. The ends of the fingers are precision punched to define the aperture that registers the semiconductor coupon simultaneously with the punching of the reference fiducials. Since only the ends of the fingers are punched in the final process operation, the coupon-registering apertures can be held to a tighter tolerance relative to the fidicuals and relative to each other than is possible when the entire side wall of the aperture is punched.

摘要翻译： 用于制造微电子器件的超精密冲压工艺承载架包括一个制成多个精密冲压孔的框架。 框架中的每个优惠券承载孔具有锯齿形侧壁，其包括延伸到孔中的多个指状物。 手指的端部被精确地冲压以限定与参考基准的冲压同时登记半导体试样的孔。 由于在最后的处理操作中仅仅敲打手指的端部，因此可以相对于这些机构并且相对于彼此而保持优惠券对准孔的宽度，而不是在打孔的整个侧壁处可能。

公开(公告)号：US06354792B1

公开(公告)日：2002-03-12

申请号：US09427036

申请日：1999-10-26

申请人： Yoshito Kobayashi ,  Hiroto Nakamura

发明人： Yoshito Kobayashi ,  Hiroto Nakamura

IPC分类号： B65G5900

CPC分类号： H01L21/67333 ,  G01R31/316 ,  H01L21/67294 ,  H01L21/6734 ,  H01L21/67346 ,  H01L21/67769 ,  H01L21/67778 ,  H01L21/68 ,  H01L21/6835 ,  H01L23/544 ,  H01L2221/68313 ,  H01L2223/54473 ,  H01L2924/0002 ,  Y10S414/14 ,  H01L2924/00

摘要： An IC receiving tray storage device is provided which is capable of securedly identifying the category of the tested ICs sorted for each category and received in the corresponding tray in the unloader section after end of test. Mounted to the tray storage is a casing comprising a generally rectangular base plate and a plurality of outer walls standing substantially upright and separately from each other on the base plate. A category identifying indicator is attached to at least one outer wall of the casing. This category identifying indicator indicates the category of ICs received in the tray. Also, in the base plate of the casing is formed an opening through which vertically movable unit is free to move. By the category identifying indicator, the category of the tested ICs received in the tray can be easily confirmed after the tray storage device has been taken out from the IC handler.

摘要翻译： 提供一种IC接收托盘存储装置，其能够在测试结束后确定地识别针对每个类别分类并在卸载器部分中的相应托盘中接收的被测IC的类别。 安装到托盘存储器的是壳体，其包括基本上矩形的基板和在基板上基本上竖立并且彼此分开地站立的多个外壁。 类别识别指示器附接到壳体的至少一个外壁。 该类别识别指示符表示托盘中接收到的IC的类别。 此外，在壳体的基板中形成有可垂直移动的单元自由移动的开口。 通过类别识别指示器，可以在托盘存储装置从IC处理器中取出之后容易地确认在托盘中接收到的被测IC的类别。

公开(公告)号：US06334574B1

公开(公告)日：2002-01-01

申请号：US09678786

申请日：2000-10-04

申请人： Teung-Lin Huang

发明人： Teung-Lin Huang

IPC分类号： G06K700

CPC分类号： H01L21/67333 ,  H01L21/67294

摘要： The present invention relates to an identification device for IC (Integrated Circuit) loading tray, and in particular, to an identification card mounted to protruded edges provided alternatively at the side of the IC loading tray. The identification device employs words, colors or the combination thereof or other methods to identify the marking/indication of IC specification so as to facilitate the identification of the IC loading tray. The identification device can be easily operated and will not be dislocated therefrom.

摘要翻译： 本发明涉及一种用于IC（集成电路）装载盘的识别装置，特别涉及安装在交替设置在IC装载盘一侧的突出边缘的识别卡。 识别装置使用单词，颜色或其组合或其他方法来识别IC规范的标记/指示，以便于识别IC装载盘。 识别装置可以容易地操作并且不会从其脱位。

公开(公告)号：US20010027933A1

公开(公告)日：2001-10-11

申请号：US09318731

申请日：1999-05-26

发明人： KEIICHI SASAMURA ,  HIDEYASU HASHIBA ,  YUKIO ANDO ,  SHIGEO SUZUKI ,  YUUKI KANAZAWA

IPC分类号： B65D085/00 ,  B65D085/30 ,  B65D085/48

CPC分类号： H01L21/67333 ,  H01L21/67336 ,  H01L21/67356 ,  H01L2221/68309 ,  H01L2221/68313

摘要： An accommodation container including: at least one first container body and at least one second container body which can be stacked onto the at least one first container body, respectively, and at least one accommodation part provided between the at least one first container body and the at least one second container body, the accommodation part being capable of accommodating a semiconductor device having a plurality of external connection terminals. The accommodation part is made of a soft material at least at a portion to be in contact with the external connection terminals of the semiconductor device.

摘要翻译： 一种容纳容器，包括：分别至少一个第一容器主体和至少一个第二容器主体，所述至少一个第二容器主体可以分别堆叠在所述至少一个第一容器主体上;以及至少一个容纳部分，设置在所述至少一个第一容器主体和 至少一个第二容器主体，所述容纳部能够容纳具有多个外部连接端子的半导体器件。 容纳部分至少在与半导体器件的外部连接端子接触的部分处由柔软的材料制成。

公开(公告)号：US20010023839A1

公开(公告)日：2001-09-27

申请号：US09805172

申请日：2001-03-14

申请人： Kabushiki Kaisha Toshiba

发明人： Hisayoshi Kunii ,  Koji Koga ,  Reikichi Hatori

IPC分类号： B65D021/00 ,  B65D085/62 ,  B65D085/00

CPC分类号： H01L21/67333 ,  B65D21/00 ,  H01L2221/68313 ,  Y10S206/832

摘要： A first construction of a tray for electronic parts according to the present invention is provided with an engaging cut-out corner portion which is formed by cutting a corner portion of a table-like flat portion which is arranged diagonally with respect to a cut-out corner portion. A second construction of a tray for electronic parts according to the present invention is provided with a pawl engaging protruding portion which is formed on a step-like peripheral edge portion above a cut-out portion. In a third construction of a tray for electronic parts according to the present invention, when two trays are stacked up so that the top faces thereof face each other, an engaging first-shaped protrusion which is formed around a predetermined pocket of one tray engages an engaging second-shaped protrusion which is formed around a predetermined pocket of the other tray.

摘要翻译： 根据本发明的用于电子部件的托盘的第一构造设置有接合切口角部，其通过切割相对于切口对角地布置的台状平坦部的角部而形成 角部分。 根据本发明的用于电子部件的托盘的第二结构设置有形成在切口部分上方的台阶状周边部分上的棘爪接合突出部分。 在根据本发明的用于电子部件的托盘的第三结构中，当两个托盘堆叠成使得其顶面彼此面对时，形成在一个托盘的预定凹部周围的接合的第一形状的突起与 接合在另一个托盘的预定袋周围形成的第二形突起。

公开(公告)号：US06264037B1

公开(公告)日：2001-07-24

申请号：US09559770

申请日：2000-04-27

申请人： Roy E. Maston, III ,  Robert H. Murphy

发明人： Roy E. Maston, III ,  Robert H. Murphy

IPC分类号： B65D7302

CPC分类号： H01L21/67333 ,  H01L2221/68313 ,  H05K13/0084

摘要： A tray for ball grid array integrated circuits includes a storage pocket with a transverse structure. The transverse structure carries a plurality of columnar structures at spaced positions on and extending normally from the surface of the transverse structure. Each columnar support structure includes parallel columns that terminate in coplanar free ends that engage the terminal surface of one ball grid array integrated circuit to support it in a terminals down position within the storage pocket.

摘要翻译： 用于球栅阵列集成电路的托盘包括具有横向结构的存储袋。 横向结构在横向结构的表面上分开位置并且正常地从横向结构的表面延伸出多个柱状结构。 每个柱状支撑结构包括平行的柱，其终止于共面自由端，其接合一个球栅阵列集成电路的端子表面，以将其支撑在存储口袋内的端子向下位置。