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    SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM
    601.
    发明申请
    SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM 有权

    公开(公告)号：US20250087585A1

    公开(公告)日：2025-03-13

    申请号：US18731176

    申请日：2024-05-31

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Youngjin Jung ,  Jaehwang Sim

    IPC: H01L23/528 ,  H01L25/065 ,  H10B43/10 ,  H10B43/27 ,  H10B43/35 ,  H10B43/40 ,  H10B80/00

    Abstract: A semiconductor device includes a first word line having a first electrode portion and a first extension portion extending from the first electrode portion, a second word line having a second electrode portion disposed at a higher level than the first electrode portion and a second extension portion extending from the second electrode portion, a first vertical memory structure penetrating through the first and second electrode portions in a vertical direction, and a first interconnection structure electrically connected to the first extension portion. The first extension portion includes a first lower portion extending from the first electrode portion and a first plug portion extending upwardly from at least one side of the first lower portion and connected to the first interconnection structure. At least a portion of the first lower portion has a thickness greater than a thickness of the first electrode portion.

    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
    602.
    发明申请
    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME 有权

    公开(公告)号：US20250087570A1

    公开(公告)日：2025-03-13

    申请号：US18626700

    申请日：2024-04-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： HYUNSOO CHUNG ,  KWANG-SOO KIM ,  CHI WOO LEE

    IPC: H01L23/498 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065

    Abstract: A semiconductor package includes a redistribution layer structure, a first sub-package positioned on the redistribution layer structure, a second sub-package positioned on the first sub-package, and a first encapsulant positioned on the first sub-package and encapsulating the second sub-package. The first sub-package includes a first semiconductor chip including a first chip through via and a dielectric through via electrically connected to the redistribution layer structure. The second sub-package includes a second semiconductor chip including a plurality of second chip through vias, each second chip through via electrically connected to one of the first chip through via and the dielectric through via, a third semiconductor chip positioned on the second semiconductor chip, and a fourth semiconductor chip positioned on the third semiconductor chip. Each of the second to fourth semiconductor chips is exposed at a side surface of the second sub-package and covered with the first encapsulant.

    CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
    603.
    发明申请
    CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME 有权

    公开(公告)号：US20250087562A1

    公开(公告)日：2025-03-13

    申请号：US18816740

    申请日：2024-08-27

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Narae Shin ,  Jeongkyu Ha ,  Woonbae Kim ,  Yechung Chung

    IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

    Abstract: A chip on film package includes a base film having a first surface and a second surface which are opposite to each other, at least one first conductive line disposed on the first surface and extending in a first direction, at least one second conductive line disposed on the second surface and extending in the first direction, a semiconductor chip disposed on the first surface and connected to the at least one first conductive line through a bump structure, a protective layer covering a part of the first surface and a part of the second surface, and a display panel disposed on the first surface and connected to the at least one first conductive line, wherein the at least one second conductive line is not disposed on the second surface between the semiconductor chip and the display panel.

    NONVOLATILE MEMORY DEVICE, STORAGE DEVICE HAVING THE SAME, AND OPERATING METHOD THEREOF
    605.
    发明申请
    NONVOLATILE MEMORY DEVICE, STORAGE DEVICE HAVING THE SAME, AND OPERATING METHOD THEREOF 有权

    公开(公告)号：US20250087264A1

    公开(公告)日：2025-03-13

    申请号：US18958240

    申请日：2024-11-25

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Seongjin Kim ,  Jayang Yoon ,  Chiweon Yoon ,  Cheonan Lee ,  Kichang Jang

    IPC: G11C11/4099 ,  G11C11/4074 ,  G11C11/408

    Abstract: According to the present disclosure, a nonvolatile memory device may include an operational amplifier comparing a reference voltage with a voltage of a feedback node; a first feedback network circuit generating a first output voltage by dividing an input voltage in response to an output voltage of the operational amplifier, and transmitting a voltage corresponding to the first output voltage to the feedback node in response to a first feedback signal, a second feedback network circuit generating a second output voltage by dividing the input voltage in response to the output voltage of the operational amplifier, and transmitting a voltage corresponding to the second output voltage to the feedback node in response to a second feedback signal, and a third feedback network circuit generating a third output voltage by dividing the input voltage in response to the output voltage of the operational amplifier, and transmitting a voltage corresponding to the third output voltage to the feedback node in response to a third feedback signal.

    ELECTRONIC DEVICE INCLUDING IMAGE SENSOR, METHOD FOR OPERATING THE SAME, AND RECORDING MEDIUM
    606.
    发明申请
    ELECTRONIC DEVICE INCLUDING IMAGE SENSOR, METHOD FOR OPERATING THE SAME, AND RECORDING MEDIUM 有权

    公开(公告)号：US20250087018A1

    公开(公告)日：2025-03-13

    申请号：US18802774

    申请日：2024-08-13

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Heejun YOU ,  Minsoo SHIN ,  Wonjung CHOI

    IPC: G06V40/16 ,  G06V10/141 ,  G06V10/20 ,  H04N23/611 ,  H04N23/80

    Abstract: An electronic device may comprise: an image sensor, an image pre-processor comprising circuitry, memory storing instructions, and at least one processor comprising processing circuitry. The instructions, when executed by at least one processor, individually and/or collectively, may cause the electronic device to: obtain raw data including biometric data using the image sensor. The instructions, when executed by at least one processor, individually and/or collectively, may cause the electronic device to store, in a first buffer, the raw data as first image data. The instructions, when executed by at least one processor, individually and/or collectively, may cause the electronic device to store, in a second buffer, second image data generated by applying a change operation to the raw data using the image pre-processor. The instructions, when executed by at least one processor, individually and/or collectively, may cause the electronic device to forward the first image data stored in the first buffer to a first application included in a secure area and apply a first algorithm for biometric authentication to the first image data. The instructions, when executed by at least one processor, individually and/or collectively, may cause the electronic device to forward the second image data stored in the second buffer to a second application included in a non-secure area and apply a second algorithm different from the first algorithm to the second image data. Other various embodiments are also available.

    ELECTRONIC DEVICE AND METHOD FOR PROVIDING VIRTUAL SPACE IMAGE
    609.
    发明申请
    ELECTRONIC DEVICE AND METHOD FOR PROVIDING VIRTUAL SPACE IMAGE 有权

    公开(公告)号：US20250085915A1

    公开(公告)日：2025-03-13

    申请号：US18955153

    申请日：2024-11-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Stephanie AHN ,  Myoungwoo NAM ,  Eunyoung PARK ,  Dongil SON ,  Bona LEE ,  Eunbin LEE ,  Miyeoung CHUNG

    IPC: G06F3/14 ,  G02B7/02

    Abstract: A wearable device includes: at least one first sensor, a display, lens sets including at least one lens arranged with respect to the display, at least one actuator configured to adjust the lens sets, and at least one processor, comprising processing circuitry, individually and/or collectively, configured to: identify movements related to the wearable device through the at least one first sensor based on a screen provided through each of the lens sets being displayed on the display, identify whether a number of times of the movements identified during a reference time is greater than a first reference number of times, adjust a focus of each of the lens sets configured to provide the screen displayed on the display through the at least one actuator in response to the number of times being greater than the first reference number of times, and maintain the adjusted focus based on identifying that the number of times of the movements identified during the reference time being less than or equal to a second reference number of times greater than the first reference number of times, within a designated time interval after adjusting the focus of each of the lens sets.

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