Abstract:
A method uses inter-base station control messages to provide neighbor base station information to mobile subscriber stations in a mobile communication system. The method includes obtaining, at a serving base station, physical channel information of neighbor base stations over a backbone network via, either directly or via a server; periodically transmitting the obtained physical channel information from the serving base station to a mobile subscriber station connected to the serving base station; and measuring, based on the updated physical channel information, signal quality of the at least one neighbor base station at the mobile subscriber station. Thus, the serving base station receives from the neighbor base stations the inter-base station control messages containing the neighbor base station information, updates the information, and provides the updated information to the corresponding mobile subscriber station(s), to be used for a specific purpose such as handover or network entry.
Abstract:
A method of performing a ranging process between a base station and a mobile station in sleep mode in a wireless access system, wherein the base station provides the mobile station with an initial notification of a periodic ranging time that occurs during a sleep time interval and during which the mobile station is to perform the ranging process, the initial notification included in a first message, the first message indicating whether the mobile station should terminate sleep mode to receive downlink data, and wherein the base station provides the mobile station with subsequent notifications of periodic ranging times that occur during the sleep time interval, the subsequent notifications indicated in a second message, the second message transmitted to the mobile station as part of the ranging process such that the mobile station performs a plurality of ranging processes within the sleep time interval.
Abstract:
A method of performing a ranging process between a base station and a mobile station in sleep mode in a wireless access system, wherein the base station provides the mobile station with an initial notification of a periodic ranging time that occurs during a sleep time interval and during which the mobile station is to perform the ranging process, the initial notification included in a first message, the first message indicating whether the mobile station should terminate sleep mode to receive downlink data, and wherein the base station provides the mobile station with subsequent notifications of periodic ranging times that occur during the sleep time interval, the subsequent notifications indicated in a second message, the second message transmitted to the mobile station as part of the ranging process such that the mobile station performs a plurality of ranging processes within the sleep time interval.
Abstract:
A method of performing a ranging process between a base station and a mobile station in sleep mode in a wireless access system, wherein the base station provides the mobile station with an initial notification of a periodic ranging time that occurs during a sleep time interval and during which the mobile station is to perform the ranging process, the initial notification included in a first message, the first message indicating whether the mobile station should terminate sleep mode to receive downlink data, and wherein the base station provides the mobile station with subsequent notifications of periodic ranging times that occur during the sleep time interval, the subsequent notifications indicated in a second message, the second message transmitted to the mobile station as part of the ranging process such that the mobile station performs a plurality of ranging processes within the sleep time interval.
Abstract:
Wiring for a semiconductor device which is suitable for high density device packing, and a method for forming the same, are disclosed. The wiring includes: impurity regions formed in a substrate on both sides of an insulated gate electrode; a first conduction layer formed on the impurity regions; and a second conduction layer formed in contact with the first conduction layer on one side of the gate electrode. The method includes the steps of: forming impurity regions in a substrate on both sides of an insulated gate electrode; forming a first conduction layer on the impurity regions; and forming a second conduction layer in contact on one side of the gate electrode with the first conduction layer.
Abstract:
A semiconductor device includes a semiconductor substrate having an active area including first and second impurity regions of a transistor, a gate formed over the active area of the semiconductor substrate and isolated from the semiconductor substrate, a first insulating interlayer formed on the semiconductor substrate and having first and second contact holes exposing the first and the second impurity regions, respectively, a capacitor having a storage electrode and a plate electrode, the storage electrode being connected electrically to the first impurity region through the first contact hole, a bit line contact pad connected electrically to the second impurity region through the second contact hole, a second insulating interlayer formed on the plate electrode and having a third contact hole exposing the bit line contact pad, and a bit line formed on the second insulating interlayer and in contact with the bit line contact pad through the third contact hole.
Abstract:
A method of fabricating a semiconductor device having a memory device region and a logic device region on a substrate includes the steps of forming first and second gate lines on the substrate at the memory device region and the logic device region, respectively, forming a sidewall insulating layer on both sides of each of the first and second gate lines, forming a plurality of impurity regions in the substrate, forming a silicon nitride layer on the memory device including the first gate lines, forming a silicide layer on the second gate line and impurity regions at the logic device region, and forming an oxide layer on an exposed surface excluding portions over each one of the impurity regions at the memory region and the logic device region, respectively.
Abstract:
The present invention relates to a device isolation structure and a device solation method in a semiconductor power IC. The device isolation structure according to the present invention includes: a semiconductor substrate including a high voltage region and a low voltage region; a trench overlapping the high voltage device region of the semiconductor substrate and an interfacing region formed between the high voltage device region and the low voltage device region; a fourth insulating film, a fifth insulating film, and a conductive film sequentially layered in the trench; a first insulating film pattern formed on the semiconductor substrate including the trench; and field insulating films respectively formed on the trench and on a portion of an upper surface of the semiconductor substrate which is exposed out of the first insulating film pattern. The present invention has several advantages concerning manufacturing costs and reliability, some of which being achieved by forming a thermal oxide film in an empty space of the conductive film by which oxygen is permeated thereinto and thus restraining breakdown from being generated between high voltage devices at a high voltage.
Abstract:
A dynamic random access memory (DRAM) organized as a matrix of basic organizational units each having a capacitor pair. Each capacitor pair has one of the first capacitors and one of the second capacitors in it. Each basic organizational unit is arranged as follows: a first word line and a second word line are formed, as parallel lines, on the substrate; the first word line lies between a first doped region and a second doped region to define a first transistor; the second word line lies between the second doped region of the first transistor and a third doped regions to define a second transistor; a bit line lies on the second doped region of the substrate at an oblique angle to the first word line and second word line; the first capacitor overlies the first doped region and the first word line, is substantially centered over the first doped region, is connected to the first doped region via a first contact hole, and has a hexagon-shaped planar portion; the second capacitor overlies the third doped region and the second word line, is substantially centered over the third doped region, is connected to the third doped region via a second contact hole, and has a hexagon-shaped planar portion; and a center point of each of the first doped region, second doped region and third doped region of the basic organizational unit are connectable by an imaginary straight characteristic line.
Abstract:
A semiconductor device capacitor structure comprises a semiconductor substrate having an impurity diffusion region; an insulating layer formed on the semiconductor substrate and having a contact hole on the impurity diffusion region; a first lower electrode of a half ring type formed on the insulating film along an upper edge of the contact hole; a second lower electrode formed on a surface of the substrate exposed through the contact hole, a wall of the contact hole, and the first lower electrode; a dielectric layer formed on the first and second lower electrodes; and an upper electrode formed on the dielectric layer. This structure increases capacitance, thereby improving the characteristics and reliability of the device.