摘要:
A memory controller configured to control a daisy chain of memory chips. The memory controller receives read and write requests from a processor, determines a daisy chain of memory chips that the request is directed to, determines which memory chip in the chain of memory chips the request is directed to, and transmits an address/command word recognizable by the correct memory chip. The memory controller sends write data words to the daisy chain of memory chips that can be associated by the correct memory chip for writing into the correct memory chip. The memory controller receives read data words from the daisy chain of memory chips and returns the read data to the processor. The memory controller transmits a bus clock to the daisy chain of memory chips for controlling transmission of address/command words and data words.
摘要:
A particular chip is designed having a first variant (front side connected chip) of the chip and a second variant (back side connected chip). The first variant of the chip is attached to a carrier. The second variant of the chip is attached to the carrier inverted relative to the first variant of the chip. The first and second variants of the chip are attached to the carrier such that a vertical surface (side) of the first variant of the chip faces a corresponding vertical surface of the second variant of the chip. A circuit on the first variant of the chip is electrically connected to a corresponding circuit on the second variant of the chip.
摘要:
Structures and a computer program product are provided for implementing enhanced wiring capability for electronic laminate packages. Electronic package physical design data are received. Instances of line width and space limit violations in the electronic package physical design data are identified. The identified instances of line width and space limit violations are evaluated using predefined qualified options and tolerance limitations and the electronic package physical design data are modified to optimize shapes to replace the instances of line width and space limit violations.
摘要:
A method is provided for implementing vertically coupled noise control through a mesh plane in an electronic package design. Electronic package physical design data are received. Instances of vertically coupled noise in the electronic package physical design data are identified. The identified instances of vertically coupled noise are quantified. Then the electronic package physical design data are modified to limit the vertically coupled noise.
摘要:
A method, apparatus and computer program product are provided for implementing vertically coupled noise control through a mesh plane in an electronic package design. Electronic package physical design data are received. Instances of vertically coupled noise in the electronic package physical design data are identified. The identified instances of vertically coupled noise are quantified. Then the electronic package physical design data are modified to limit the vertically coupled noise.
摘要:
A memory controller for controlling a daisy chain of self timed memory chips. The memory controller has information as to how long each self timed memory chip in the daisy chain of memory chips takes to make a read access and a write access to an array on the self timed memory chip. The memory controller determines current access time information on a memory chip by sending a command to the memory chip. The memory chip returns a data word containing the current access time information. Alternatively, the memory controller transmits an address/command word to the memory chip and, after completing an access, transmits a responsive data word to the memory controller. The memory controller determines the access time information using the interval from transmission of the address/command word to reception of the responsive data word.
摘要:
A carrier having at least one self timed memory chip in a daisy chain of memory chips. A first carrier has at least a portion of a daisy chain of memory chips attached to the first carrier. An address/command bus input on the first carrier carries an address/command word to a first memory chip in the daisy chain of memory chips. If the first memory chip determines that the address/command word is not directed to the first memory chip, the first memory chip re-drives the address/command word to a second memory chip in the daisy chain of memory chips using a point to point address/command bus link. If there are no more memory chips on the first carrier, the address/command word is re-driven to an address/command bus off-carrier connector. An array on a memory chip has an access time dynamically determined by how fast the array can be accessed.
摘要:
A memory system having a data bus coupling a memory controller and a memory. The data bus has a number of data bus bits. The data bus is programmably apportioned to a first portion dedicated to transmitting data from the memory controller to the memory and a second portion dedicated to transmitting data from the memory to the memory controller. The apportionment can be assigned by suitable connection of pins on a memory chip in the memory and the memory controller to logical values. Alternatively, the apportionment can be scanned into the memory controller and the memory at bring up time. In another alternative, the apportionment can be changed by suspending data transfer and dynamically changing the sizes of the first portion and the second portion.
摘要:
A computer system having a memory system, the memory system having a memory controller and a memory. The memory comprises one or more daisy chains of self timed memory chips. An address/command word is chained through a daisy chain of memory chips and is handled by one of the memory chips in the daisy chain of memory chips. Data to be written to a memory chip is sent as part of the address/command word, or is transferred on an outgoing data bus chain. Data read from a memory chip is transferred on an incoming data bus chain. Access timing on each memory chip is determined by a self time block on each memory chip.
摘要:
A socket assembly with incorporated memory structure is provided. A chip carrier socket assembly includes dual stage clamping actuation. A first clamping actuation stage provides clamping force for ball grid array (BGA) contact pads and a second clamping actuation stage provides clamping force for a thermal interface. The first clamping actuation stage provides clamping force proximate to a perimeter of a carrier where a plurality of BGA contact pads are located. The second clamping actuation stage provides clamping force generally centrally of the chip carrier socket assembly for thermal interface actuation.