公开(公告)号：US20110076472A1

公开(公告)日：2011-03-31

申请号：US12655516

申请日：2009-12-30

Applicant: Jin Ho Kim ,  Seok Kyu Lee ,  Jae Joon Lee ,  Sung Won Jeong

Inventor： Jin Ho Kim ,  Seok Kyu Lee ,  Jae Joon Lee ,  Sung Won Jeong

IPC: B32B7/02

CPC classification number: H05K3/4682 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K2201/0352 ,  H05K2201/068 ,  Y10T428/2495 ,  H01L2924/00

Abstract: Disclosed is a package substrate, in which the plating area of a first plating layer formed on a layer which is to be connected to a motherboard is larger than the plating area of a second plating layer formed on a layer which is to be connected to an electronic part, and the plating thickness of the second plating layer is greater than the plating thickness of the first plating layer, thus balancing the plating volumes of the plating layers formed on the layers of the package substrate, thereby minimizing warpage of the package substrate which results from the coefficients of thermal expansion being different.

Abstract translation: 公开了一种封装基板，其中形成在要连接到母板的层上的第一镀层的电镀面积大于形成在要连接到母板的层上的第二镀层的镀覆面积 电子部分，并且第二镀层的镀层厚度大于第一镀层的镀层厚度，从而平衡形成在包装衬底的层上的镀层的镀层体积，从而最小化封装衬底的翘曲 来自热膨胀系数的结果不同。

公开(公告)号：US20100132982A1

公开(公告)日：2010-06-03

申请号：US12379687

申请日：2009-02-26

Applicant: Seung Hyun Cho ,  Je Gwang Yoo ,  Tae Eun Chang ,  Sang Soo Lee ,  Jung Woo Lee ,  Dae Young Lee ,  Jae Joon Lee

Inventor： Seung Hyun Cho ,  Je Gwang Yoo ,  Tae Eun Chang ,  Sang Soo Lee ,  Jung Woo Lee ,  Dae Young Lee ,  Jae Joon Lee

IPC: H05K1/00 ,  B05D5/12 ,  H01B13/00

CPC classification number: H05K1/0209 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K3/285 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/09045 ,  H05K2201/0959 ,  H01L2924/00

Abstract: Disclosed is a package substrate including a solder resist layer having pattern parts and a method of fabricating the same, in which the pattern parts are formed on the solder resist layer, thus increasing heat dissipation efficiency and minimizing the warpage of the substrate.

Abstract translation: 公开了一种包括具有图案部分的阻焊层及其制造方法的封装基板，其中，图案部分形成在阻焊层上，从而增加散热效率并使基板翘曲最小化。

公开(公告)号：US20060005220A1

公开(公告)日：2006-01-05

申请号：US11168558

申请日：2005-06-29

Applicant: Jae-joon Lee

Inventor： Jae-joon Lee

IPC: G06F13/00 ,  H04N7/16

CPC classification number: H04N5/44543 ,  H04N5/44504 ,  H04N21/431 ,  H04N21/4316 ,  H04N21/443 ,  H04N21/47 ,  H04N21/472 ,  H04N21/8153

Abstract: A set-top box, which allows a user to input a key command in real time while displaying an animation sequence on an on-screen display (OSD) screen, and a method of outputting the OSD data of the set-top box. The set-top box includes a reception module that receives digital broadcast signals, a demultiplexer that extracts a broadcast signal of a channel selected by a user from the received digital broadcast signals, a decoding module that decodes the extracted broadcast signal using a predetermined method, an on-screen display (OSD) control module that divides OSD animation data into a plurality of subsets, loads each of the subsets in every operating cycle, determines whether a user has input a key command in every operating cycle, and selectively provides the loaded subsets based on the determination result in every operating cycle, wherein the OSD animation data realizes an animation sequence when displayed. The set-top box further includes a combination control module that receives the loaded subsets of the OSD animation data from the OSD control module and overlays the data onto the decoded broadcast signal and provides the overlaid result to a display device.

Abstract translation: 一种机顶盒，其允许用户在屏幕显示（OSD）屏幕上显示动画序列的同时实时输入键盘命令，以及输出机顶盒的OSD数据的方法。 机顶盒包括接收数字广播信号的接收模块，从接收到的数字广播信号中提取用户选择的频道的广播信号的解复用器，使用预定方法对所提取的广播信号进行解码的解码模块， 屏幕显示（OSD）控制模块，其将OSD动画数据划分为多个子集，在每个操作周期中加载每个子集，确定用户是否在每个操作周期中输入了一个密钥命令，并且选择性地提供加载的 基于每个操作周期中的确定结果的子集，其中OSD动画数据在显示时实现动画序列。 机顶盒还包括组合控制模块，其从OSD控制模块接收OSD动画数据的加载子集，并将数据重叠到解码的广播信号上，并将重叠的结果提供给显示装置。