Abstract:
The spectroscopy module is provided with a body portion for transmitting light, a spectroscopic portion for dispersing light made incident from the front plane of the body portion into the body portion to reflect the light on the front plane, a light detecting element having a light detecting portion for detecting the light dispersed and reflected by the spectroscopic portion and electrically connected to a wiring formed on the front plane of the body portion by face-down bonding, and an underfill material filled in the body portion side of the light detecting element to transmit the light. The light detecting element is provided with a light-passing hole through which the light advancing into the spectroscopic portion passes, and a reservoir portion is formed on a rear plane of the body portion side in the light detecting element so as to enclose a light outgoing opening of the light-passing hole.
Abstract:
In the spectrometer 1, a lens portion 3 having a spherical surface 35 on which a spectroscopic portion 4 is provided and a bottom plane 31 in which a light detecting element 5 is disposed, has a side plane 32 substantially perpendicular to the bottom plane 31 and a side plane 34 substantially perpendicular to the bottom plane 31 and the side plane 32. Then, a package 11 that houses a spectroscopy module 10 has side planes 16 and 18 respectively coming into planar-contact with the side planes 32 and 34, and contact portions 22 coming into contact with the spherical surface 35. Therefore, the side planes 32 and 34 of the lens portion 3 are respectively brought into planar-contact with the side planes 16 and 18 of the package 11 while bringing the spherical surface 35 of the lens portion 3 into contact with the contact portions 22 of the package 11, that positions the spectroscopic portion 4 and the light detecting element 5 with respect to a light incident window plate 25 of the package 11.
Abstract:
An optical element 20A which is composed of a light transmission characteristic medium, that has a refractive index higher than a refractive index of air, the optical element causes an incident laser beam to be propagated inside while reflecting the laser beam by a wall surface 20a a plurality of times, the optical element includes an incident window 21 which is located in a part of the wall surface 20a, that is for allowing the laser beam to be incident, an emitting window 22 which is located in a part of the wall surface 20a, that is for allowing the laser beam propagated inside to be emit, and wavelength dispersion compensating units 31 and 32 which are integrally located in parts of the medium, the wavelength dispersion compensating units compensate for wavelength dispersion by causing the laser beam to be transmitted or reflected at least twice.
Abstract:
Alignment marks 12a, 12b, 12c, and 12d are formed on the flat plane 11a of the peripheral edge portion 11 formed integrally with the diffracting layer 8, and when the lens portion 7 is mounted onto the substrate 2, these alignment marks 12a, 12b, 12c and 12d are positioned to the substrate 2, thereby making exact alignment of the diffracting layer 8 with respect to the light detecting portion 4a of the light detecting element 4, for example, not by depending on a difference in curvature radius of the lens portion 7. In particular, the alignment marks 12a, 12b, 12c and 12d are formed on the flat plane 11a, thereby image recognition is given to exactly detect positions of the alignment marks 12a, 12b, 12c and 12d, thus making it possible to make exact alignment.
Abstract:
A photodiode array 1 is provided with an n-type silicon substrate 3. A plurality of photodiodes 4 are formed in array on the opposites surface side to an incident surface of light L to be detected, in the n-type silicon substrate 3. A depression 6 with a predetermined depth more depressed than a region not corresponding to regions where the photodiodes 4 are formed is formed in regions corresponding to the regions where the photodiodes 4 are formed, on the incident surface side of the light L to be detected, in the n-type silicon substrate 3.
Abstract:
In a state that the body portion 4 is regulated by inner wall planes 27, 29, 28 of the package 3 so as not to move in parallel or perpendicularly with respect to the rear plane 4b, the spectroscopic module is directly supported by the package 3, thereby when the spectrometer is downsized, the spectroscopic module 2 can be supported securely and also there is provided securely a positional accuracy between the light incident opening 22a of the package 3, the spectroscopic portion 6 of the spectroscopic module 2 and the light detecting element 7. Further, the lead 23 is buried into the package 3 to give derivation and support by the lead deriving portion 26, thereby the lead deriving portion 26 in itself of the package 3 is allowed to act as a base when wire bonding is conducted to electrically connect the lead 23 with the light detecting element 7, thus preventing breakage and deviation of the spectroscopic module 2.
Abstract:
A photodiode array 1 is provided with an n-type silicon substrate 3. A plurality of photodiodes 4 are formed in array on the opposite surface side to an incident surface of light L to be detected, in the n-type silicon substrate 3. A resin film 6 for transmitting the light L to be detected is provided so as to cover at least regions corresponding to regions where the photodiodes 4 are formed, on the incident surface side of the light L to be detected, in the n-type silicon substrate 3.
Abstract:
To provide a highly-reliable spectroscopy module. In a spectroscopy module 1, a light passing hole 5b through which a light L1 advancing to a spectroscopic portion 4 passes is formed in a light detecting element 5. Therefore, it is possible to prevent the relative positional relationship between the light passing hole 5b and a light detecting portion 5a of the light detecting element 5 from deviating. Moreover, the light to be measured L1 advancing to the spectroscopic portion 4 via the light passing hole 5b and the diffracted lights L2 advancing to the light detecting portion 5a from the spectroscopic portion 4 pass through a void formed between the light detecting element 5 and the substrate 2 by an opening portion 10a of a wiring substrate 10. Thereby, it is possible to prevent a situation in which the light to be measured L1 and the diffracted lights L2 are scattered or the like due to a resin adhesive 16 or the like interposed between the light detecting element 5 and the substrate 2. Therefore, it is possible to prevent generation of stray light. Therefore, according to the spectroscopy module 1, it is possible to improve the reliability.