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公开(公告)号：US11335836B2
公开(公告)日：2022-05-17
申请号：US16563529
申请日：2019-09-06
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Tae Hwan Song
Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same that facilitate realizing of pixels of the micro LED structure.
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公开(公告)号：US20220123165A1
公开(公告)日：2022-04-21
申请号：US17607030
申请日：2020-05-07
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: H01L33/00 , H01L21/683 , H01L25/075
Abstract: The invention provides a micro LED suction body, and a method of manufacturing a micro LED display using the same. Proposed is a micro LED suction body for transferring micro LEDs from a first substrate to a second substrate and, more particularly, is a micro LED suction body for transferring micro LEDs by a vacuum suction method.
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公开(公告)号：US20210337674A1
公开(公告)日：2021-10-28
申请号：US17232750
申请日：2021-04-16
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
Abstract: Proposed are an anodic aluminum oxide mold made of an anodic aluminum oxide film, a manufacturing method thereof, a half-finished probe product, a manufacturing method thereof, a probe card, and a manufacturing method thereof.
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公开(公告)号：US20210307159A1
公开(公告)日：2021-09-30
申请号：US17209178
申请日：2021-03-22
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Dong Eun LEE
Abstract: Proposed is an anodic aluminum oxide structure made of anodic aluminum oxide and, more particularly, is an anodic aluminum oxide structure that minimizes damage to a material in the vicinity of a conductor and prevents a problem of delamination between the conductor and a member existing thereon.
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公开(公告)号：US20210223507A1
公开(公告)日：2021-07-22
申请号：US17153433
申请日：2021-01-20
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Young Heum EOM , Sin Seok HAN
Abstract: Light emission apparatus for an exposure machine is proposed. The light emission apparatus includes: a supporter; a plurality of light emission units individually installed on a first surface of the supporter and each having a plurality of light emitters generating light; and a plurality of reflectors individually installed on the first surface of the supporter to correspond to the light emission units, respectively, in which the reflectors are divided into a first reflective group in which reference axes of reflective beams are horizontal and a second reflective group in which reference axes of reflective beams are inclined.
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Patent Agency Ranking
公开(公告)号：US20210102975A1
公开(公告)日：2021-04-08
申请号：US17029979
申请日：2020-09-23
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
Abstract: Proposed is a probe card for performing a circuit test on a wafer and, more particularly, a probe card capable of realizing a reduction in size and pitch of probe insertion holes.
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公开(公告)号：US20210043797A1
公开(公告)日：2021-02-11
申请号：US16534699
申请日：2019-08-07
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
IPC: H01L33/00 , H01L25/075 , H01L33/48 , H01L27/15
Abstract: The present invention relates to a transfer head and a method of manufacturing a micro LED display using the same. In particular, the present invention relates to a transfer head and a method of manufacturing a micro LED display using the same, the transfer head mounting normal micro LEDs on a display substrate without performing a complicated process of sorting out defective micro LEDs from the micro LEDs mounted on the display substrate and replacing the defective micro LEDs with normal micro LEDs.
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公开(公告)号：US20210013259A1
公开(公告)日：2021-01-14
申请号：US16921564
申请日：2020-07-06
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
Abstract: Disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same. More particularly, disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same, wherein the need for a micro LED replacement process is eliminated.
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公开(公告)号：US20200271693A1
公开(公告)日：2020-08-27
申请号：US16794147
申请日：2020-02-18
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: G01R1/073
Abstract: The present invention provides a guide plate for a probe card. The guide plate for the probe card according to the present invention includes: a first guide plate including a plurality of first pin insertion holes formed therein, and made of an anodic oxide film; and a second guide plate disposed to be spaced apart from the first guide plate by a predetermined distance, and including a plurality of second pin insertion holes through which probe pins passing through the first pin insertion holes pass, wherein a buffer part is provided at least partially on each of an upper portion and a lower portion of the first guide plate.
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公开(公告)号：US10705064B2
公开(公告)日：2020-07-07
申请号：US15702666
申请日：2017-09-12
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Tae Hwan Song
Abstract: Disclosed is a microsensor package. Particularly, disclosed is a microsensor package configured such that a substrate with a sensor electrode is formed with a plurality of pores penetrating vertically therethrough, the lower surface of the substrate is formed with a bonding portion, and the pores under the sensor electrode pad are provided therein with respective connecting portions electrically connecting the sensor electrode pad and the bonding portion, whereby it is possible to provide a light, slim, and compact microsensor package, and it is possible to mount the microsensor package to a printed circuit board (PCB) without wire bonding.
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