Abstract:
An apparatus for manufacturing a liquid crystal display includes a unitary vacuum processing chamber having a substrate entrance, a loader part to load first and second substrates through the substrate entrance, one of the first and second substrates having a liquid crystal material disposed thereupon, upper and lower stages disposed within the vacuum processing chamber for affixing the first and second substrates, a stage moving system for providing relative movement between the upper and lower stages, and a vacuum generating system for evacuating an interior of the vacuum processing chamber.
Abstract:
A substrate bonding apparatus for a liquid crystal display device includes a vacuum processing chamber, a lower stage provided in an interior of the vacuum chamber, an upper stage provided in the interior of the vacuum chamber and having at least one first through hole, a stage moving system having a stage moving axis connected to one of the lower and upper stages, and a driving motor, and at least one first alignment system having one end provided in the interior of the vacuum chamber for aligning a first substrate and a second substrate.
Abstract:
A method for fabricating an LCD by liquid crystal dropping includes the steps of (a) loading a first substrate and a second substrate on a bonding chamber, (b) bonding the first and second substrates, (c) venting the bonding chamber for applying a pressure to the bonded first and second substrates, and (d) unloading the pressed first and second substrates.
Abstract:
Disclosed is a system for fabricating a liquid crystal display using liquid crystal dropping and a method of fabricating a liquid crystal display using the same. The present invention includes a liquid crystal forming line dropping liquid crystals on the first substrate, a sealant forming line forming the sealant on the second substrate, and a bonding and hardening line bonding the two substrates to each other and hardening the sealant, printing a sealant, bonding the substrates each other, and hardening the sealant and an inspection process line of cutting the bonded substrates into panel units and grinding and inspecting the unit panels. And, the GAP process line includes And, the present invention includes the processes of dropping LC on a first substrate using a dispenser, forming a main UV hardening sealant on a second substrate, bonding the first and second substrates to each other in a vacuum state, UV-hardening the main UV hardening sealant, cutting the bonded substrates into cell units, grinding the cut substrates, and inspecting the grinded substrates finally.
Abstract:
A liquid crystal display device includes an upper plate, a lower plate, and a liquid crystal. A sealant is formed along edges of the upper and lower plates to join the upper plate with the lower plate, and a protrusion separates the sealant from a picture displaying area at an inner portion of the upper and lower plates. The liquid crystal injected into the picture displaying area.
Abstract:
A method of cleaning a liquid crystal display bonding chamber includes loading a first substrate and a second substrate in the bonding chamber, bonding the first substrate and the second substrate to produce bonded substrates, unloading the bonded substrates, repeating the loading, the bonding and the unloading for K times, where K is an integer greater than zero, and cleaning the bonding chamber.
Abstract:
A method and apparatus are provided for manufacturing a liquid crystal display device. The method includes the steps of providing at least a first substrate and a second substrate on a single production process line, passing the first and second substrates through a sealing material coating portion of the single production process line in serial order such that a sealing material is coated on the second substrate with the first substrate being passed through the sealing material coating portion without forming a sealing material thereon, passing the first and the second substrates through a liquid crystal dispensing portion of the single production process line in serial order such that liquid crystal is dispensed onto a pixel region of one of the first and second substrates with the other one of the first and second substrates being passed through the liquid crystal dispensing portion without dispensing liquid crystal thereon, and assembling the first substrate with the second substrate to form a liquid crystal panel of at least one liquid crystal display device.
Abstract:
A seal pattern including a plurality of main seal lines, a first auxiliary seal line including a plurality of open holes and surrounding the plurality of main seal lines, and a plurality of second auxiliary seal lines positioned corresponding to the open holes. Since the second auxiliary seal lines pass only gas such as air, the main seal lines are protected from being damaged from cleaning detergent or an etching solution during a cleaning and etching process. A hardening agent is used to seal the open holes during an etching process.
Abstract:
A dielectric microwave filter includes a dielectric body, a trinity of first, second and third resonant slots, a pair of cavities for transmitting input/output signals, a pair of slits, and a trinity of first, second and third resonant holes. Each of the resonant slots (and an associated resonant hole in some embodiments) functions as a resonator having a quarter wavelength. Each of the slits modulates a coupling of electromagnetic fields among the resonant slots (and resonant holes if present). All surfaces of the dielectric microwave filter are completely covered with an electrically conducting material, except for front and top surfaces of the dielectric body. Since the resonators having a quarter wavelength may have reduced surface dimensions, the filter may accommodate associated surface input/output coupling cavities and also be more easily manufactured in a miniaturized structure. In addition, since the filter provides inductive coupling between resonators, it may better preserve a desired overall filter performance.
Abstract:
A semiconductor light emitting device and method of manufacturing the semiconductor light emitting device are provided. The semiconductor light emitting device includes a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. The device may also includes a first electrode connected to the first conductivity type semiconductor layer, and a second electrode connected to the second conductivity type semiconductor layer and having a pad region and a finger region extended from the pad region in one direction. The second electrode may include a transparent electrode part positioned on the second conductivity type semiconductor layer and including at least one opening therein, at least one reflective part spaced apart from the transparent electrode part within the opening and disposed in the pad region and the finger region, and a bonding part positioned on at least one portion of the reflective part and including a plurality of bonding finger parts spaced apart from each other in the finger region and a bonding pad part disposed in the pad region.