公开(公告)号：US20210074606A1

公开(公告)日：2021-03-11

申请号：US16952080

申请日：2020-11-19

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei Wang ,  Ching Sheng Chen ,  Ra-Min Tain ,  Ming-Hao Wu ,  Hsuan-Wei Chen

IPC: H01L23/373 ,  H01L23/498 ,  H01L21/48

Abstract: A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.

公开(公告)号：US10937723B2

公开(公告)日：2021-03-02

申请号：US16028440

申请日：2018-07-06

Applicant: Unimicron Technology Corp.

Inventor： Yu-Chung Hsieh ,  Chun-Hsien Chien ,  Yu-Hua Chen

IPC: H01L23/498 ,  H01L49/02 ,  H01L21/683 ,  H01L21/48 ,  H01L23/00 ,  H01F27/28 ,  H01F27/40 ,  H01L25/16

Abstract: A package carrier structure includes an insulating substrate, a first wiring layer, a second wiring layer, at least one conductive via, a plurality of first and second conductive pads, a first insulating layer, a plurality of first and second conductive structures, and an encapsulated layer. The first and second wiring layers are disposed on the upper and lower surfaces of the insulating substrate respectively. The conductive via penetrates through the insulating substrate and electrically connected to the first and second wiring layers. The first and second conductive pads are disposed on the upper surface and electrically connected to the first wiring layer. The first insulating layer is disposed on the upper surface and exposing the first and second conductive pads. The first and second conductive structures are disposed on the first and second conductive pads respectively. The lower surface of the insulating substrate is covered by the encapsulation layer.

公开(公告)号：US20210057320A1

公开(公告)日：2021-02-25

申请号：US16690143

申请日：2019-11-21

Applicant: Unimicron Technology Corp.

Inventor： Fu-Yang Chen ,  Chun-Hsien Chien ,  Cheng-Hui Wu ,  Wei-Ti Lin

IPC: H01L23/498 ,  H01L21/48

Abstract: A method of preparing a package structure is provided, which includes providing a carrier plate including a supporting layer, a first release layer, and a first metal layer; forming a first dielectric layer over the first metal layer, the first dielectric layer having a plurality of holes, each of the holes having an end portion substantially coplanar with each other at a same plane; forming a plurality of conductive protrusions filling the holes, each of the conductive protrusions having a first end and a second end opposite thereto; forming a circuit layer structure including at least one circuit layer and at least one second dielectric layer, the circuit layer being connected to the second end, the second dielectric layer being disposed over the circuit layer; removing the carrier plate; and removing a portion of the first dielectric layer to expose the conductive protrusions. A package structure is also provided.

公开(公告)号：US20210050288A1

公开(公告)日：2021-02-18

申请号：US16595491

申请日：2019-10-08

Applicant: Unimicron Technology Corp.

Inventor： Tzu-Hsuan WANG

IPC: H01L23/498 ,  H01L23/367 ,  H01L23/13 ,  H01L21/48

Abstract: A circuit carrier includes a substrate, a laminar circuit structure, a metal heat slug, a first fixing piece, and a second fixing piece. The laminar circuit structure is disposed over the substrate and includes a plurality of dielectric layers and circuits in the dielectric layers. The metal heat slug is disposed in the laminar circuit structure. The first fixing piece is disposed on the first side of the upper surface of the metal heat slug. The second fixing piece is disposed on the second side of the upper surface of the metal heat slug, wherein the first side is perpendicular to the second side. A method of manufacturing a circuit carrier is also provided herein.

公开(公告)号：US20210014963A1

公开(公告)日：2021-01-14

申请号：US16533808

申请日：2019-08-07

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Chi-Chun Po ,  Po-Hsiang Wang

IPC: H05K1/02 ,  H05K1/05 ,  H05K7/20

Abstract: A circuit board structure includes a carrier and a patterned circuit layer. The patterned circuit layer is disposed on the carrier, and the patterned circuit layer has at least one fluid channel therein. The fluid channel has a heat absorption section and a heat dissipation section relative to the heat absorption section. A heat source is electrically connected to the patterned circuit layer, and the heat absorption section is adjacent to the heat source. The heat generated by the heat source is transferred from the patterned circuit layer to the heat absorption section of the fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation.

公开(公告)号：US10856421B2

公开(公告)日：2020-12-01

申请号：US16679337

申请日：2019-11-11

Applicant: Unimicron Technology Corp.

Inventor： Ching-Hao Huang ,  Ho-Shing Lee ,  Yu-Cheng Lin

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/24 ,  H05K3/06 ,  H05K3/28 ,  H05K1/11

Abstract: A circuit board is disposed on a substrate and includes a dielectric layer and a circuit layer. The dielectric layer is disposed on the substrate. The circuit layer is embedded in the dielectric layer and has plural traces. Each of the traces has a first top surface and a first bottom surface which are opposite to each other, and the first bottom surface faces toward the substrate. The first top surface is exposed from the dielectric layer, and an area of a vertical projection of the first top surface on the substrate is smaller than an area of a vertical projection of the first bottom surface on the substrate.

公开(公告)号：US10804126B2

公开(公告)日：2020-10-13

申请号：US15815719

申请日：2017-11-17

Applicant: Unimicron Technology Corp.

Inventor： Po-Hsuan Liao

IPC: H01L21/673 ,  H01L21/02 ,  H01L21/67 ,  H05K3/46 ,  H05K3/38

Abstract: A method for manufacturing a circuit board includes forming recess structures on a transferring layer; forming a dielectric layer on the transferring layer to form a stacking structure, in which the dielectric layer is at least embedded with the recess structures; bonding the stacking structure a base board by pressing, such that the dielectric layer is in contact with the base board; patterning the dielectric layer, including performing an exposure process on the stacking structure through the transferring layer; and after the exposure process is finished, removing the transferring layer.

公开(公告)号：US10660202B1

公开(公告)日：2020-05-19

申请号：US16221587

申请日：2018-12-17

Applicant: Unimicron Technology Corp.

Inventor： Wen-Liang Yeh ,  Chun-Hsien Chien ,  Chien-Chou Chen ,  Cheng-Hui Wu

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/02 ,  H05K3/10 ,  H05K3/30 ,  H05K3/46 ,  H05K3/28 ,  H05K3/34

Abstract: A carrier structure including a glass substrate, a buffer layer, and an inner circuit layer is provided. The glass substrate has a first surface, a second surface opposite to the first surface, and at least one through hole penetrating through the glass substrate. The buffer layer is disposed on the first surface and the second surface of the glass substrate. The inner circuit layer is disposed on the buffer layer and in the through hole of the glass substrate. The inner circuit layer exposes a part of the buffer layer.

公开(公告)号：US10658282B2

公开(公告)日：2020-05-19

申请号：US16167540

申请日：2018-10-23

Applicant: Unimicron Technology Corp.

Inventor： Cheng-Ta Ko ,  Kai-Ming Yang ,  Yu-Hua Chen ,  Tzyy-Jang Tseng

IPC: H01L23/498

Abstract: A package substrate structure includes a first substrate, a second substrate, a plurality of conductive pillars and an adhesive layer. The first substrate includes a plurality of vias and a plurality of pads. The vias and the pads are disposed on the first substrate, and fills the vias. The second substrate is disposed opposite to the first substrate. Each conductive pillar is disposed between the first substrate and the second substrate, where each conductive pillar electrically connects each pad and the second substrate, and the adhesive layer fills the gaps between the conductive pillars. A bonding method of the package substrate structure is also provided.

公开(公告)号：US20200075564A1

公开(公告)日：2020-03-05

申请号：US16161080

申请日：2018-10-16

Applicant: Unimicron Technology Corp.

Inventor： Wei-Ti Lin ,  Chun-Hsien Chien ,  Fu-Yang Chen

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/62 ,  H01L23/00

Abstract: A light-emitting diode package structure includes a carrier, at least one self-assembled material layer, a first solder mask layer, and at least one light-emitting diode. The carrier includes a first build-up circuit. The self-assembled material layer is disposed on the first build-up circuit. The first solder mask layer is disposed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the self-assembled material layer. The light-emitting diode is disposed on the first build-up circuit. The light-emitting diode has a self-assembled pattern. The light-emitting diode is self-assembled into the opening of the first solder mask layer through a force between the self-assembled pattern and the self-assembled material layer. A manufacturing method of the light-emitting diode package structure is also provided.