摘要:
Various embodiments of the present invention provide systems and methods for data processing. As an example, a data processing circuit is disclosed that includes: a data decoder circuit and a local iteration adjustment circuit. The data decoder circuit is operable to perform a number of local iterations on a decoder input to yield a data output. The local iteration adjustment circuit is operable to generate a limit on the number of local iterations performed by the data decoder circuit.
摘要:
Various embodiments of the present invention provide data processing circuits that include: a data detector circuit, a data decoder circuit, and a modification circuit. The data detector circuit is operable to apply a data detection algorithm to a data input to yield a detected output. The data decoder circuit is operable to apply a data decode algorithm to a decode input to yield a decoded output. The decode input is selected between at least the detected output, and a modified version of the detected output. The modification circuit is operable to receive the detected output and to provide the modified version of the detected output.
摘要:
Various embodiments of the present invention provide apparatuses, systems and methods for data detection in a detector with soft pruning. For example, a data detector is disclosed that includes a branch metric calculator operable to calculate branch metrics for transitions between states in a trellis for the data detector, and a branch metric offset circuit operable to apply branch metric offsets to the branch metrics to yield soft pruned branch metrics. The branch metric offsets comprise a range of probability values from zero percent to one hundred percent.
摘要:
Embodiments of the present inventions are related to systems and methods for data processing, and more particularly to systems and methods for format efficient data processing.
摘要:
The present inventions are related to systems and methods for data processing, and more particularly to systems and methods for power governance in a data processing system.
摘要:
Various embodiments of the present invention provide apparatuses, systems and methods for data detection in a detector with soft pruning. For example, a data detector is disclosed that includes a branch metric calculator operable to calculate branch metrics for transitions between states in a trellis for the data detector, and a branch metric offset circuit operable to apply branch metric offsets to the branch metrics to yield soft pruned branch metrics. The branch metric offsets comprise a range of probability values from zero percent to one hundred percent.
摘要:
Various embodiments of the present invention provide systems and methods for data processing. As an example, a data processing circuit is disclosed that includes a data detecting circuit having: a first vector translation circuit, a second vector translation circuit, and a data detector core circuit. The data detecting circuit is operable to receive an input data set and at least one input vector in a first format. The at least one input vector corresponds to a portion of the input data set. The first vector translation circuit is operable to translate the at least one vector to a second format. The data detector core circuit is operable to apply a data detection algorithm to the input data set and the at least one vector in the second format to yield a detected output. The second vector translation circuit operable to translate a derivative of the detected output to the first format to yield an output vector.
摘要:
A chip package having asymmetric molding includes a lead frame, a chip, an adhesive layer, bonding wires and a molding compound. The lead frame includes a turbulent plate and a frame body having inner lead portions and outer lead portions. The turbulent plate is bended downwards to form a concave portion. The first end of the turbulent plate is connected to the frame body, and the second end is lower than the inner lead portions. The chip is fixed under the inner lead portions through the adhesive layer. The bonding wires are connected between the chip and the inner lead portions. The molding compound encapsulates the chip, the bonding wires, and the turbulent plate. The ratio between the thickness of the molding compound over and under the concave portion is larger than 1. The thickness of the molding compound under and over the outer lead portions is not equal.