公开(公告)号：US20150357195A1

公开(公告)日：2015-12-10

申请号：US14825921

申请日：2015-08-13

Applicant: APPLIED Materials, Inc.

Inventor： John W. Lam ,  Ismail Emesh ,  Roey Shaviv

IPC: H01L21/288 ,  C25D7/12 ,  H01L21/768

CPC classification number: H01L21/2885 ,  C23C18/1653 ,  C25D3/12 ,  C25D5/10 ,  C25D5/14 ,  C25D5/50 ,  C25D7/00 ,  C25D7/123 ,  H01L21/3247 ,  H01L21/76873 ,  H01L21/76879 ,  H01L21/76882 ,  H01L21/76883 ,  H01L23/53257 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electrochemical process for applying a conductive film onto a substrate having a seed layer includes placing the substrate into contact with an electrochemical plating bath containing cobalt or nickel, with the plating bath having pH of 4.0 to 9.0. Electric current is conducted through the bath to the substrate. The cobalt or nickel ions in the bath deposit onto the seed layer. The plating bath may contain cobalt chloride and glycine. The electric current may range from 1-50 milli-ampere per square cm. After completion of the electrochemical process, the substrate may be removed from the plating bath, rinsed and dried, and then annealed at a temperature of 200 to 400 C to improve the material properties and reduce seam line defects. The plating and anneal process may be performed through multiple cycles.

Abstract translation: 用于将导电膜施加到具有种子层的基底上的电化学方法包括将基底与包含钴或镍的电化学镀浴接触，镀浴的pH为4.0至9.0。 电流通过熔池传导到基板。 浴中的钴或镍离子沉积到种子层上。 电镀浴可能含有氯化钴和甘氨酸。 电流可以为1-50毫安每平方厘米。 电化学工艺完成后，可以将基板从镀液中除去，漂洗并干燥，然后在200-400℃的温度下退火，以改善材料性能并减少接缝线缺陷。 电镀和退火工艺可以通过多个循环进行。

公开(公告)号：US20150325477A1

公开(公告)日：2015-11-12

申请号：US14274611

申请日：2014-05-09

Applicant: APPLIED Materials, Inc.

Inventor： Roey Shaviv ,  Ismail T. Emesh

IPC: H01L21/768 ,  C25D5/02

CPC classification number: H01L21/76882 ,  C25D3/32 ,  C25D3/38 ,  C25D5/10 ,  C25D5/12 ,  C25D5/50 ,  C25D5/505 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76843 ,  H01L21/7685 ,  H01L21/76864 ,  H01L21/76873 ,  H01L21/76879 ,  H01L21/76883 ,  H01L2221/1089

Abstract: A method for at least partially filling a feature on a workpiece generally includes obtaining a workpiece including a feature; and depositing a first layer in the feature, wherein the chemistry for depositing the first layer has a pH in the range of about 6 to about 13, and includes a metal complexing agent and at least one organic or inorganic additive selected from the group consisting of accelerator, suppressor, and leveler.

Abstract translation: 用于至少部分地填充工件上的特征的方法通常包括获得包括特征的工件; 并且在所述特征中沉积第一层，其中用于沉积第一层的化学物质具有在约6至约13范围内的pH，并且包括金属络合剂和至少一种选自以下的有机或无机添加剂： 加速器，抑制器和矫直机。

公开(公告)号：US20140103534A1

公开(公告)日：2014-04-17

申请号：US13915566

申请日：2013-06-11

Applicant: APPLIED Materials, Inc.

Inventor： Ismail T. Emesh ,  Roey Shaviv

IPC: H01L21/768

CPC classification number: H01L21/76882 ,  H01L21/2885 ,  H01L21/76846 ,  H01L21/76864 ,  H01L21/76873 ,  H01L21/76898 ,  H01L2221/1089

Abstract: A method for at least partially filling a feature on a workpiece generally includes obtaining a workpiece including a feature, depositing a first conductive layer in the feature, wherein the sheet resistance of the first conductive layer is greater than 10 ohm/square, depositing a second conductive layer in the feature by electrochemical deposition, wherein the electrical contacts are at least partially immersed in the deposition chemistry.

Abstract translation: 用于至少部分地填充工件上的特征的方法通常包括获得包括特征的工件，在特征中沉积第一导电层，其中第一导电层的薄层电阻大于10欧姆/平方，沉积第二导电层 通过电化学沉积在特征中的导电层，其中电接触件至少部分地浸没在沉积化学中。