公开(公告)号：US20150062915A1

公开(公告)日：2015-03-05

申请号：US14019257

申请日：2013-09-05

Applicant: Cree, Inc.

Inventor： Christopher P. Hussell ,  Jesse Colin Reiherzer ,  Erin R. F. Welch ,  Florin A. Tudorica

IPC: H01L33/10 ,  F21K99/00 ,  F21V7/22

CPC classification number: F21V7/22 ,  F21K9/60 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K3/28 ,  H05K2201/09881 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/0588 ,  H01L2924/00

Abstract: Light emitter devices and methods are provided herein. In some aspects, emitter devices and methods provided herein are for light emitting diode (LED) chips and can include providing a substrate, a conductive trace over the substrate, and at least one or more direct attach LED chip over the substrate. A layer of non-conductive and reflective material is disposed over the surface of wherein the layer of reflective material covers at least 25% or more of a surface of the substrate.

Abstract translation: 本文提供了发光器件和方法。 在一些方面，本文提供的发射器件和方法用于发光二极管（LED）芯片，并且可以包括提供衬底，衬底上的导电迹线以及衬底上的至少一个或多个直接附接LED芯片。 非导电和反射材料层设置在其上的反射材料层覆盖基底表面的至少25％或更多的表面上。

公开(公告)号：US20140097453A1

公开(公告)日：2014-04-10

申请号：US14043494

申请日：2013-10-01

Applicant: CREE, INC.

Inventor： Christopher P. Hussell ,  Peter Scott Andrews ,  Jesse Colin Reiherzer ,  David T. Emerson

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate, one or more LEDs disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. The LEDs can be connected in a pattern that is non-linear.

Abstract translation: 公开了用于发光二极管（LED）的发光器件。 在一个实施例中，发光器件可以包括衬底，设置在衬底上的一个或多个LED，并且LED可以包括用于连接到电气元件的电连接器。 发光器件还可以包括设置在衬底上的保持材料，并且保持材料可以设置在至少一部分电连接器上。 LED可以以非线性的方式连接。

公开(公告)号：US20130334548A1

公开(公告)日：2013-12-19

申请号：US13908597

申请日：2013-06-03

Applicant: CREE, INC.

Inventor： Erin R. F. Welch ,  Christopher P. Hussell ,  Jesse Colin Reiherzer ,  Joseph G. Clark

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion.

Abstract translation: 公开了发光器件和方法。 在一个实施例中，发光器件可以包括设置在所述底座上的基座和多个发光二极管（LED）。 底座的至少一部分可以包括至少部分地布置在焊接掩模下方的反射层。 底座内的一个或多个层可以包括一个或多个孔，粗糙的表面纹理或其组合以改善装置内的粘附。 该装置还可以包括分配在多个LED周围的保留材料。 公开了用于改善焊接掩模附着力的装置和方法。