Abstract:
A spiral chiller and a method of chilling a food product in a spiral chiller using a cooling medium wherein (a) the food product is conveyed within the chiller by a spiral conveyor having a plurality of spiral flutes and (b) the cooling medium is discharged either upwardly and/or downwardly within, and/or laterally into, one or more vertical gaps between adjacent pairs of spiral flutes using one or more delivery duct structures which extend inside the interior of the product chilling chamber.
Abstract:
A medical instrument includes a sound card or an internal capability for generating sounds from a digital music or sound file. The medical instrument is one which generates unwanted noise and is constantly in the presence of a patient or an operator, and may be in a home, a clinic, a laboratory, or other intimate setting. For instance, a patient may be typically connected for hours to a hemodialysis machine that has a noisy pump. A blood-plasma volunteer may be hooked to a noisy blood separation machine for a period of time. A laboratory technician may work in close proximity to a sample preparation machine that constantly gurgles and whirrs. In each instance, a sound card and a speaker can generate previously-recorded masking noises that make that the presence and operation of the machine more tolerable.
Abstract:
A spiral oven and a method of cooking a food product in a spiral oven using a cooking medium wherein (a) the food product is conveyed within the oven cooking chamber by a spiral conveyor having a plurality of spiral flights and (b) the cooking medium is discharged either upwardly and/or downwardly within, or laterally into, one or more vertical gaps between adjacent pairs of spiral flights using one or more delivery duct structures which extend inside the interior of the cooking chamber.
Abstract:
According to an exemplary embodiment, a semiconductor die including at least one deep silicon via is provided. The deep silicon via comprises a deep silicon via opening that extends through at least one pre-metal dielectric layer of the semiconductor die, at least one epitaxial layer of the semiconductor die, and partially into a conductive substrate of the semiconductor die. The deep silicon via further comprises a conductive plug situated in the deep silicon via opening and forming an electrical contact with the conductive substrate. The deep silicon via may include a sidewall dielectric layer and a bottom conductive layer. A method for making a deep silicon via is also disclosed. The deep silicon via is used to, for example, provide a ground connection for power transistors in the semiconductor die.
Abstract:
A method for aligning a disposable cassette within a dialysis machine includes actuating a pump head toward the disposable cassette and to contact a pumping portion of the disposable cassette and shift the disposable cassette if need be into proper operational alignment and locking the disposable cassette in place.
Abstract:
A dialysis machine includes: a hardware unit including at least one pump actuator, at least one valve actuator and a cassette interface, the cassette interface including: (i) a plate that abuts the cassette; (ii) at least one pump aperture defined by the plate; (iii) at least one pump head moveable out of and retractable into the at least one pump aperture to operate a pumping portion of the cassette; (iv) at least one valve aperture defined by the plate; (v) at least one valve apparatus moveable out of and retractable into the at least one valve aperture to operate a valve portion of the cassette; (vi) at least one sensor aperture defined by the plate; and (vii) at least one sensor located in the least one sensor aperture, the at least one sensor operable with a sensor portion of the cassette.
Abstract:
This invention provides a small lightweight glider that is hollow and made from a molded thin film material. Typically the glider is formed in the shape of a bird or a plane. The body of the glider comprises top half and a lower half, which form a hollow fuselage, a left wing and a right wing extending laterally from the fuselage. The glider also comprises a ballast weight, a stiffener, and optionally an interior skeleton. The interior of the glider is open to the outside atmosphere and requires no inflation.
Abstract:
A method for fabricating an NPN bipolar transistor comprises forming a base layer on a top surface of a substrate. The NPN bipolar transistor may be an NPN silicon-germanium heterojunction bipolar transistor. The method for fabricating the NPN bipolar transistor may further comprise a cap layer situated over the base layer. According to this embodiment, the method for fabricating the NPN bipolar transistor further comprises fabricating an emitter over the base layer, where the emitter defines an intrinsic and an extrinsic base region of the base layer. The emitter may comprise, for example, polycrystalline silicon. The method for fabricating the NPN bipolar transistor further comprises implanting germanium in the extrinsic base region of the base layer so as to make the extrinsic base region substantially amorphous. The method for fabricating the NPN bipolar transistor further comprises implanting boron in the extrinsic base region of the base layer.