摘要:
An oligomeric compound that is the Michael addition reaction product of a thiol with a compound having maleimide terminal groups and ester functionality internal in the compound can be formulated into curable compositions to improve adhesion to metal substrates.
摘要:
Difunctional oxazoline resins, which may be produced in a convenient one-step reaction from an arylalkylene dinitrile by reaction with an amino alcohol, are used in compositions with an additional curable compound or resin containing one or more carbon to carbon double bonds. The composition can be cured to a thermoset material, the curing mechanism occurring by the zwitterion polymerization of the bisoxazoline resin with the resin containing the one or more carbon to carbon double bonds. The reaction occurs without the need for curing initiators.(I)
摘要:
Electron donor compounds, suitable for use as adhesives or as components in adhesives, contain a carbon to carbon double bond attached to an aromatic ring and conjugated with the unsaturation in the aromatic ring.
摘要:
A method for attaching a silicon die to a substrate using an adhesive containing an oxetane functionality and an electron acceptor or an electron donor functionality, represented by the formula in which R1 is a methyl or ethyl group, R2 is a divalent hydrocarbon, X and Y are independently a direct bond, or an ether, ester, or carbamate functionality, Q is a divalent hydrocarbon, and F is an electron donor or electron acceptor functionality.
摘要:
This invention relates to a semiconductor package in which a silicon die is adhered to a substrate with an adhesive comprising a resin having the structure: in which Q is an oligomeric or polymeric group containing at least one carbon to carbon double bond, A is a hydrocarbyl group or an aromatic group, and L is a linking group resulting from the reaction of a functional group, excluding epoxy, on the precursor for the segment containing silane and a functional group, excluding epoxy, on the precursor for the segment containing the at least one carbon to carbon double bond.
摘要:
These compounds contain an oxetane functionality and a cinnamyl functionality. The oxetane functionality is homopolymerizable in reactions that can undergo cationic or anionic ring opening, and the cinnamyl functionality is polymerizable with compounds such as electron acceptor compounds. The dual functionality allows for dual cure processing. The generic structure of such compounds is in which R is a methyl or ethyl group, X and Y independently are a direct bond, or an ether, ester, or carbamate group, and Q is a divalent hydrocarbon (which may contain heteroatoms of N, O, or S), provided that X and Y will not both be direct bonds in the same molecule.
摘要:
Compounds with both vinyl ether and carbamate, thiocarbamate or urea functionality are suitable for use in microelectronics applications and show enhanced adhesive strength compared to compounds that do not contain carbamate, thiocarbamate or urea functionality.
摘要:
Curable compositions comprise a benzoxazine compound or resin in combination with at least one additional curable compound or resin. Optionally, the composition will further comprise a curing agent and/or a filler. These compositions have utility as adhesives, coatings and encapsulants, especially for use within the semiconductor fabrication industry, with particular utility as die attach adhesives, films, and underfill materials, such as no-flow underfills, capillary flow underfills, wafer level underfills, and as lead free solders.
摘要:
Compounds containing both electron donor and electron acceptor functionality are suitable for use in adhesives. The electron donor group is a carbon to carbon double bond attached to an aromatic ring and conjugated with the unsaturation in the ring. The electron acceptor group is a maleimide, acrylate, fumarate or maleate.