Redundant acknowledgment in loopback entry
    63.
    发明申请
    Redundant acknowledgment in loopback entry 失效
    环回输入中的冗余确认

    公开(公告)号:US20070264730A1

    公开(公告)日:2007-11-15

    申请号:US11395879

    申请日:2006-03-31

    IPC分类号: H01L21/66 G01R31/26

    CPC分类号: G01R31/31716

    摘要: Redundant acknowledgment between agents performing a loopback test over bidirectional communications bus is described. In one example the acknowledgment is performed by initiating loopback communications from a first agent to a second agent, sending a packet including a redundant acknowledgment sequence from the first agent to the second agent, receiving the packet including the redundant acknowledgement sequence looped back from the second agent at the first agent, sending a test sequence from the first agent to the second agent, and receiving the test sequence looped back from the first agent.

    摘要翻译: 描述了在双向通信总线之间进行环回测试的代理之间的冗余确认。 在一个示例中,通过发起从第一代理到第二代理的回送通信来执行确认,从第一代理向第二代理发送包括冗余确认序列的分组,接收包括从第二代理循环回来的冗余确认序列的分组 代理在第一代理程序,从第一代理发送测试序列到第二代理,并接收从第一代理程序循环回来的测试序列。

    High speed active flex cable link
    64.
    发明申请
    High speed active flex cable link 有权
    高速主动柔性电缆连接

    公开(公告)号:US20070004241A1

    公开(公告)日:2007-01-04

    申请号:US11170980

    申请日:2005-06-30

    IPC分类号: H05K1/00

    CPC分类号: H05K1/147 H05K1/118 H05K1/189

    摘要: A method and apparatus, in some embodiments the apparatus includes a flex cable terminating at a first end and a second end and having a plurality of conductors therein, and a repeater circuit disposed between the first end and the second end and connected to at least one of the plurality of conductors to re-transmit a signal transmitted on the at least one of the plurality of conductors.

    摘要翻译: 一种方法和装置,在一些实施例中,该装置包括终端于第一端和第二端并在其中具有多个导体的柔性电缆,以及设置在第一端和第二端之间并连接到至少一个 以重新发送在所述多个导体中的至少一个上传输的信号。

    Fabrication of an ion exchange polish pad
    69.
    发明授权
    Fabrication of an ion exchange polish pad 失效
    制造离子交换抛光垫

    公开(公告)号:US06905526B1

    公开(公告)日:2005-06-14

    申请号:US09993575

    申请日:2001-11-06

    CPC分类号: B24B37/22 B24D3/344 B24D7/02

    摘要: Embodiments of the invention include an ion exchange polish pad for polishing a semiconductor substrate, on which various conductive, semiconductive, and/or insulative layers are formed, for example a conductive copper layer. Embodiments also include the method for the manufacture of an ion exchange polish pad. In certain embodiments an ion exchange polish pad includes a base material and a ion exchange layer including, which further includes an ion exchange material. Cations in the ion exchange material may be exchanged with other cations, such as copper, under the proper process conditions for the planarization of a processed semiconductor substrate.

    摘要翻译: 本发明的实施例包括用于抛光半导体衬底的离子交换抛光垫,其上形成有各种导电,半导体和/或绝缘层,例如导电铜层。 实施例还包括用于制造离子交换抛光垫的方法。 在某些实施方案中,离子交换抛光垫包括基材和离子交换层,所述离子交换层还包括离子交换材料。 离子交换材料中的阳离子可以在适当的工艺条件下与其它阳离子例如铜交换,以便对被处理的半导体衬底进行平坦化。