公开(公告)号：US20150134039A1

公开(公告)日：2015-05-14

申请号：US14600401

申请日：2015-01-20

Applicant: Greatbatch Ltd.

Inventor： Thomas Marzano ,  Keith W. Seitz ,  Robert A. Stevenson ,  Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods ,  Steven W. Winn ,  Dominick J. Frustaci ,  Bruehl E. Truex ,  Donald H. Hickel, JR.

IPC: A61N1/375 ,  H01G2/10

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.

Abstract translation: 升高的馈通可附接到有源可植入医疗装置的顶部或侧面。 馈通包括导电套圈和电介质基片。 电介质基板被定义为包括体液侧和设置在导电套圈内的器件侧。 电介质基片包括通常在导电套圈上方升高的体液侧提升部分。 至少一个通孔穿过电介质基底从体液侧设置到器件侧。 导电填料设置在至少一个通孔内，形成气密密封并在体液侧和装置侧之间导电。 引线连接特征在体液侧电耦合到导电填充物并且邻近电介质基底的升高部分设置。

公开(公告)号：US08855768B1

公开(公告)日：2014-10-07

申请号：US14088849

申请日：2013-11-25

Applicant: Greatbatch Ltd.

Inventor： Robert Shawn Johnson ,  Dominick J. Frustaci ,  Warren S. Dabney ,  Robert A. Stevenson ,  Keith W. Seitz ,  Christine A. Frysz ,  Thomas Marzano ,  Richard L. Brendel ,  John E. Roberts ,  William Thiebolt ,  Christopher M. Williams ,  Jason Woods ,  Buehl E. Truex

IPC: H01G4/35 ,  A61N1/05 ,  A61N1/08

CPC classification number: A61N1/08 ,  A61N1/05 ,  A61N1/3718 ,  A61N1/3754 ,  H01G4/35 ,  H03H1/0007

Abstract: An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.

Abstract translation: 用于在选定的MRI频率或范围频率处理来自外部RF场的相关引线中感应的RF功率的用于主动医疗装置（AMD）的RF滤波器包括具有100至10,000皮​​法之间的电容的电容器，以及温度 介电常数为200以下，电容温度系数（TCC）在400〜71212ppm /摄氏度范围内的稳定电介质。 电容器的介电损耗角正切欧姆小于所选MRI射频频率或频率范围内电容器等效串联电阻（ESR）的百分之五。

公开(公告)号：US20130184797A1

公开(公告)日：2013-07-18

申请号：US13743254

申请日：2013-01-16

Applicant: Greatbatch Ltd.

Inventor： Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Robert A. Stevenson ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: A61N1/05

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

Abstract translation: 共同燃烧的密封馈通可附接到主动植入式医疗装置。 馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。 通孔穿过氧化铝电介质基板从体液侧设置到器件侧。 在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。 铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。

公开(公告)号：US12246183B1

公开(公告)日：2025-03-11

申请号：US18631709

申请日：2024-04-10

Applicant: Greatbatch Ltd.

Inventor： Jason Woods ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Keith W. Seitz

IPC: A61N1/375 ,  F16B43/00 ,  H01G4/35 ,  H01R13/52 ,  H01R13/533 ,  H05K1/02

Abstract: A self-centering washer is positioned between a feedthrough and a filter circuit board. The washer has openings through which first and second terminal pins extend. A first opening has an inner arcuate portion contacting the first terminal pin and an outer perimeter portion exposing the braze sealing the terminal pin to the insulator. A second opening has an inner arcuate portion contacting the second terminal pin and an outer perimeter portion exposing the braze sealing the terminal pin to the insulator. In an imaginary configuration with the first and second washer openings superimposed one on top of the other, the cumulative arcuate distance of the inner arcuate portions about one of the terminal pins, subtracting overlap, results in a gap between the superimposed washer openings that is less than a diameter of the first and second terminal pins so that the washer is prevented from lateral movement.

公开(公告)号：US12149021B2

公开(公告)日：2024-11-19

申请号：US17561048

申请日：2021-12-23

Applicant: Greatbatch Ltd.

Inventor： Thomas Marzano ,  Keith W. Seitz ,  Robert A. Stevenson ,  Christine A. Frysz ,  Marc Gregory Martino

IPC: H01R13/52 ,  A61N1/375 ,  H01G4/35 ,  H01R13/426 ,  H01R13/719

Abstract: A hermetic feedthrough terminal pin connector for an active implantable medical device (AIMD) includes an electrical insulator hermetically sealed to an opening of an electrically conductive ferrule. A feedthrough terminal pin is hermetically sealed to and disposed through the insulator, the feedthrough terminal pin extending outwardly beyond the insulator on the inside of the casing of the AIMD. A circuit board is disposed on the inside of the casing of the AIMD. A terminal pin connector includes: an electrically conductive connector housing disposed on the circuit board, wherein the connector housing is electrically connected to at least one electrical circuit disposed on the circuit board; and at least one electrically conductive prong supported by the connector housing, the at least one prong contacting and compressed against the feedthrough terminal pin, the at least one prong making a removable electrical connection.

公开(公告)号：US11406817B2

公开(公告)日：2022-08-09

申请号：US16880392

申请日：2020-05-21

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Keith W. Seitz

IPC: A61N1/08 ,  H01G4/005 ,  H01G4/30 ,  H01G4/35 ,  H01G4/236 ,  A61N1/375 ,  H01G4/12 ,  H03H1/00 ,  A61N1/37

Abstract: A filtered feedthrough assembly includes a ferrule configured to be installed in an AIMD housing. An insulator is disposed within a ferrule opening. A conductive pathway is disposed within a passageway through the insulator. A filter capacitor is disposed on a device side having active and ground electrode plates disposed within a capacitor dielectric k greater than 0 and less than 1,000. A capacitor active metallization is electrically connected to the active electrode plates. A ground capacitor metallization is electrically connected to the ground electrode plates. The filter capacitor is the first filter capacitor electrically connected to the conductive pathway coming from a body fluid side into the device side. An active electrical connection electrically connects the conductive pathway to the capacitor active metallization. A ground electrical connection electrically connects the ground capacitor metallization to the ferrule. The filter capacitor is a flat-through or an X2Y attenuator filter capacitor.

公开(公告)号：US20220115806A1

公开(公告)日：2022-04-14

申请号：US17561048

申请日：2021-12-23

Applicant: Greatbatch Ltd.

Inventor： Thomas Marzano ,  Keith W. Seitz ,  Robert A. Stevenson ,  Christine A. Frysz ,  Marc Gregory Martino

IPC: H01R13/52 ,  H01R13/426 ,  H01G4/35 ,  H01R13/719 ,  A61N1/375

Abstract: A hermetic feedthrough terminal pin connector for an active implantable medical device (AIMD) includes an electrical insulator hermetically sealed to an opening of an electrically conductive ferrule. A feedthrough terminal pin is hermetically sealed to and disposed through the insulator, the feedthrough terminal pin extending outwardly beyond the insulator on the inside of the casing of the AIMD. A circuit board is disposed on the inside of the casing of the AIMD. A terminal pin connector includes: an electrically conductive connector housing disposed on the circuit board, wherein the connector housing is electrically connected to at least one electrical circuit disposed on the circuit board; and at least one electrically conductive prong supported by the connector housing, the at least one prong contacting and compressed against the feedthrough terminal pin, the at least one prong making a removable electrical connection.

公开(公告)号：US11011787B2

公开(公告)日：2021-05-18

申请号：US16240173

申请日：2019-01-04

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Robert S. Rubino ,  Gary Freitag ,  David Dianetti ,  Todd C. Sutay ,  Ho-Chul Yun ,  Thomas Marzano ,  Brian P. Hohl

IPC: H01M50/10 ,  H01M50/116 ,  H01M50/147 ,  H01M50/155 ,  H01M50/169 ,  H01M50/186 ,  H01M50/191 ,  H01M50/543 ,  H01M4/131 ,  H01M10/0525

Abstract: A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The cell casing is formed by joining two ceramic casing halves together. One or both casing halves are machined from ceramic to provide a recess that is sized and shaped to contain the electrode assembly. The opposite polarity terminals are metal feedthroughs, such as of gold, and are formed by brazing gold into openings machined into one or both ceramic casing halves. The two ceramic casing halves are separated from each other by a metal interlayer, such as of gold, bonded to a thin film metallization adhesion layer, such as of titanium, that contacts an edge periphery of each ceramic casing half. A solid electrolyte (LixPOyNz) is used to activate the electrode assembly.

公开(公告)号：US10596369B2

公开(公告)日：2020-03-24

申请号：US16121716

申请日：2018-09-05

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Keith W. Seitz ,  Marc Gregory Martino

IPC: A61N1/08 ,  H01G4/005 ,  H01G4/30 ,  H01G4/35 ,  A61N1/375 ,  H01G4/236 ,  H01G4/12 ,  H03H1/00 ,  A61N1/37

Abstract: A hermetically sealed filtered feedthrough assembly includes an electrically conductive ferrule sealed by a first gold braze to an insulator disposed at least partially within a ferrule opening. A conductive wire is disposed within a via hole disposed through the insulator extending from a body fluid side to a device side. A second gold braze hermetically seals the conductive leadwire to the via hole. A capacitor is disposed on the device side having a capacitor dielectric body with a dielectric constant k that is greater than 0 and less than 1000. The capacitor is the first filter capacitor electrically connected to the conductive leadwire coming from the body fluid side into the device side. An active electrical connection electrically connects the conductive leadwire to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and housing of the active implantable medical device.

公开(公告)号：US10559409B2

公开(公告)日：2020-02-11

申请号：US16362862

申请日：2019-03-25

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Dallas J. Rensel ,  Brian P. Hohl ,  Jonathan Calamel ,  Xiaohong Tang ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Jason Woods ,  Richard L. Brendel

IPC: A61N1/375 ,  B23K1/19 ,  C04B41/51 ,  H01B17/30 ,  C04B41/45 ,  C04B41/88 ,  H01B19/02 ,  B23K1/00 ,  C04B41/00 ,  B23K1/008 ,  B23K26/32 ,  B23K26/21 ,  B22F7/04 ,  B23K101/36 ,  B23K103/14 ,  B22F7/08

Abstract: A method for manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of first forming a ceramic reinforced metal composite (CRMC) paste by mixing platinum with a ceramic material to form a CRMC material, subjecting the CRMC material to a first sintering step to thereby form a sintered CRMC material, ball-milling or grinding the sintered CRMC material to form a powdered CRMC material; and then mixing the powdered CRMC material with a solvent to form the CRMC paste. The method further includes forming an alumina ceramic body in a green state, forming at least one via hole through the alumina ceramic body, filling the via hole with the CRMC paste, drying the ceramic body including the CRMC paste to form a first CRMC material filling the via hole, forming a second via hole through the first CRMC material, providing a metal core in the second via hole, and subjecting the ceramic body including the first CRMC material and the metal core to a second sintering step to thereby form the dielectric body. The dielectric body is then sealed in a ferrule opening to form a feedthrough.