Semiconductor device employing buried insulating layer and method of fabricating the same
    66.
    发明申请
    Semiconductor device employing buried insulating layer and method of fabricating the same 有权
    采用埋层绝缘层的半导体器件及其制造方法

    公开(公告)号:US20050133881A1

    公开(公告)日:2005-06-23

    申请号:US11011258

    申请日:2004-12-13

    摘要: A semiconductor device employs an asymmetrical buried insulating layer, and a method of fabricating the same. The semiconductor device includes a lower semiconductor substrate. An upper silicon pattern is located on the lower semiconductor substrate. The upper silicon pattern includes a channel region, and a source region and a drain region spaced apart from each other by the channel region. A gate electrode is electrically insulated from the upper silicon pattern and intersects over the channel region. A bit line and a cell capacitor are electrically connected to the source region and the drain region, respectively. A buried insulating layer is interposed between the drain region and the lower semiconductor substrate. The buried insulating layer has an extension portion partially interposed between the channel region and the lower semiconductor substrate.

    摘要翻译: 半导体器件采用非对称埋层绝缘层及其制造方法。 半导体器件包括下半导体衬底。 上硅图案位于下半导体衬底上。 上部硅图案包括通道区域以及由沟道区域彼此间隔开的源极区域和漏极区域。 栅电极与上硅图案电绝缘,并且在沟道区域上相交。 位线和单元电容器分别电连接到源极区域和漏极区域。 掩埋绝缘层插入在漏区和下半导体衬底之间。 掩埋绝缘层具有部分插入在沟道区域和下半导体衬底之间的延伸部分。