公开(公告)号：US20180027698A1

公开(公告)日：2018-01-25

申请号：US15547554

申请日：2015-02-13

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  John Franz

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20781 ,  H05K7/20836

Abstract: An example device comprises a coolant distribution unit configured to be contained within a housing configured to house a plurality of liquid cooled computing units, the coolant distribution unit configured to fluidly couple to a rear door heat exchanger of the housing and to fluidly couple to the plurality of liquid cooled computing units, the coolant distribution unit to: receive coolant from the rear door heat exchanger via a first fluid line; pump the coolant toward the liquid cooled computing units using at least one pump coupled to the first fluid line; and supply the coolant to the liquid cooled computing units via a second fluid line coupled to the plurality of liquid cooled computing units.

公开(公告)号：US20180020577A1

公开(公告)日：2018-01-18

申请号：US15545745

申请日：2015-01-29

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John Franz

IPC: H05K7/20 ,  H05K7/14 ,  F16L3/16

CPC classification number: H05K7/20781 ,  F16L3/16 ,  H05K7/1492 ,  H05K7/1497 ,  H05K7/2079

Abstract: The present disclosure relates to a movable rack. For example, the movable rack includes an umbilical connection to deliver a fluid, an electrical current, or a network connection to the movable rack. The present disclosure further relates to the movable rack to include a translating frame to move the umbilical connection to correspond with a movement of the movable rack.

公开(公告)号：US20180017538A1

公开(公告)日：2018-01-18

申请号：US15546090

申请日：2015-01-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Anita Rogacs ,  Greg Scott Long ,  Tahir Cader ,  Keith Mathew McAuliffe ,  John Franz

IPC: G01N33/18 ,  F01P11/18 ,  G01N27/02 ,  H05K7/20 ,  G01N27/07 ,  G01N27/407

CPC classification number: G01N33/1886 ,  F01P11/14 ,  F01P11/18 ,  F01P2003/001 ,  F01P2025/80 ,  G01N27/026 ,  G01N27/07 ,  G01N27/4071 ,  H05K7/20672

Abstract: An example device in accordance with an aspect of the present disclosure includes a sensor, a controller, and an injector. The sensor is to provide sensor output regarding fluid chemistry of a fluid of a cooling system. The controller is to identify attributes of the fluid. The injector is to inject at least one additive into the fluid to bring at least one attribute into a threshold range.

公开(公告)号：US20220404079A1

公开(公告)日：2022-12-22

申请号：US17350493

申请日：2021-06-17

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Harvey J. Lunsman ,  Benjamin Kufahl

IPC: F25B45/00 ,  H05K7/20 ,  F25B41/24 ,  F25B41/31 ,  F25B49/00

Abstract: Example implementations relate to a leak mitigation (LM) system. The LM system may include a collection tank, a first valve unit coupled to the collection tank, a second valve unit coupled to a cooling loop carrying a coolant, and an LM pump coupled between the first valve unit and the second valve unit. Moreover, the leak mitigation system may also include a controller operatively coupled to the first valve unit, the second valve unit, and the LM pump to operate, in an event of a leak of the coolant from the cooling loop, the first valve unit, the second valve unit, and the LM pump to transfer at least a portion of the coolant to the collection tank from the cooling loop via the second valve unit and the first valve unit.

公开(公告)号：US20220091642A1

公开(公告)日：2022-03-24

申请号：US17030677

申请日：2020-09-24

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Steven Dean ,  John Franz ,  Brady Dulian

IPC: G06F1/18 ,  H05K1/14 ,  H05K7/10

Abstract: Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.

公开(公告)号：US11284535B2

公开(公告)日：2022-03-22

申请号：US16556447

申请日：2019-08-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Harvey Lunsman ,  Benjamin Kufahl

IPC: G05B19/042 ,  H05K7/20 ,  G06F1/20

Abstract: Example implementations relate to a leak mitigation system for a cooling system in a computing infrastructure. The leak mitigation system may include tank that is pre-pressurized, a valve unit fluidly coupled to the tank and a cooling loop, and controller operatively coupled to the valve unit. The cooling loop comprises one or more tubes to facilitate a flow of a coolant to cool one or more computing devices. The controller may detect a leak of the coolant from the cooling loop, and in response to detection of the leak of the coolant, the controller may operate the valve unit to establish a fluid coupling between the tank and the cooling loop to transfer at least a portion of the coolant away from the cooling loop.

公开(公告)号：US11152283B2

公开(公告)日：2021-10-19

申请号：US16192576

申请日：2018-11-15

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Harvey J. Lunsman ,  Tahir Cader

IPC: H01L23/473 ,  G06F1/20 ,  F04B43/04 ,  F04B19/00 ,  F04B53/08

Abstract: Systems and devices for cooling servers are provided. In one aspect, a cooling device includes a first axial pump including a body having an impeller, the first axial pump coupled to a first pump housing, the first axial pump housing coupled to a chassis, a rack, a row of racks, or one or more racks of the row of racks that are housing one or more servers. The cooling device also includes an inlet pipe coupled to an inlet of the first pump housing, the inlet pipe supplying cooling fluid to the first axial pump. The cooling device also includes an outlet pipe having an outlet coupled to the first pump housing, the outlet pipe receiving the cooling fluid from the first axial pump.

公开(公告)号：US20210320443A1

公开(公告)日：2021-10-14

申请号：US16847924

申请日：2020-04-14

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Brian T. Purcell ,  Paul Danna

IPC: H01R12/72 ,  H05K1/18 ,  H05K1/02 ,  H01R31/06 ,  H01R13/518 ,  H01R12/73

Abstract: A method and system are disclosed that allow easier coupling between high-density connectors. In one example implementation, the connectors on a computer board are mounted on flexible tabs extending from the computer board, the tabs having been formed by cutting slots on both sides of each of the tabs. A milled section within each tab makes the tab thinner, allowing it additional flexibility. In another example implementation, a pass-through connector is used as an intermediary between two mating connectors. The pass-through connector has internal pins with greater tolerance than the tolerance between the two mating connectors, allowing it easier alignment of pins for coupling. In yet another example implementation, mating connectors are coupled using a bundle of cables between the mating connectors that allows the coupling of multiple connectors, one at a time, reducing or eliminating the need to simultaneously couple multiple connectors.

公开(公告)号：US20210109574A1

公开(公告)日：2021-04-15

申请号：US16653335

申请日：2019-10-15

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Robert Mascia ,  Harvey Lunsman ,  Steven Dean ,  Michael Scott

IPC: G06F1/20 ,  G06F1/26 ,  H05K7/20

Abstract: A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.

公开(公告)号：US20210068303A1

公开(公告)日：2021-03-04

申请号：US16556447

申请日：2019-08-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Harvey Lunsman ,  Benjamin Kufahl

IPC: H05K7/20 ,  G06F1/20 ,  G05B19/042

Abstract: Example implementations relate to a leak mitigation system for a cooling system in a computing infrastructure. The leak mitigation system may include tank that is pre-pressurized, a valve unit fluidly coupled to the tank and a cooling loop, and controller operatively coupled to the valve unit. The cooling loop comprises one or more tubes to facilitate a flow of a coolant to cool one or more computing devices. The controller may detect a leak of the coolant from the cooling loop, and in response to detection of the leak of the coolant, the controller may operate the valve unit to establish a fluid coupling between the tank and the cooling loop to transfer at least a portion of the coolant away from the cooling loop.