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公开(公告)号：US20150351281A1
公开(公告)日：2015-12-03
申请号：US14826421
申请日：2015-08-14
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
CPC分类号： H05K7/20318 , B23P15/26 , B23P2700/10 , H05K7/203 , H05K7/20781 , H05K7/2079 , Y10T29/49361
摘要： Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s). In one implementation, the pumped dielectric fluid flow provides two-phase cooling to the electronic component(s) via flow boiling.
摘要翻译： 提供冷却装置及其制造方法，其有助于电子部件的抽吸浸没冷却。 所述冷却装置包括具有容纳所述电子部件的隔室的外壳和所述隔室内的介电流体，至少部分地浸没所述电子部件。 液体冷却散热器与外壳相关联，以冷却与隔室相关联的至少一个冷却表面，并且便于通过介电流体从电子部件传递到散热器。 泵设置在隔室的外部并与其流体连通以便于泵送的介电流体流过隔间。 泵送的电介质流体流过隔室增强了通过冷却表面从电子部件到液体冷却的散热器的热传递。 在一个实施方案中，泵送介质流体流通过沸腾流向电子部件提供两相冷却。
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公开(公告)号：US20150109735A1
公开(公告)日：2015-04-23
申请号：US14058530
申请日：2013-10-21
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20318 , B23P15/26 , B23P2700/10 , H05K7/203 , H05K7/20781 , H05K7/2079 , Y10T29/49361
摘要： Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s). In one implementation, the pumped dielectric fluid flow provides two-phase cooling to the electronic component(s) via flow boiling.
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63.发明申请FABRICATING THERMAL TRANSFER AND COOLANT-COOLED STRUCTURES FOR COOLING ELECTRONICS CARD(S) 有权制造电子卡的热转印和冷却冷却结构（S）公开(公告)号：US20150052754A1
公开(公告)日：2015-02-26
申请号：US14528075
申请日：2014-10-30
发明人： Amilcar R. ARVELO , Levi A. CAMPBELL , Michael J. ELLSWORTH, JR. , Eric J. McKEEVER , Richard P. SNIDER
IPC分类号： H05K7/20
CPC分类号： H05K7/2039 , H05K7/20636 , H05K7/20772 , Y10T29/4935
摘要： Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided which include: coupling a thermal transfer structure configured to one or more sides of an electronics card having one or more electronic components to be cooled, the thermal transfer structure including a thermal spreader coupled to the one side of the electronics card; and disposing a coolant-cooled structure adjacent to the socket of the electronic system, the coolant-cooled structure including one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket, and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s).
摘要翻译： 提供了制造冷却装置和冷却剂冷却的电子组件的方法，其包括：将构造成具有一个或多个要冷却的电子部件的电子卡的一侧或多侧的热传递结构联接在一起，所述热传递结构包括耦合 到电子卡的一边; 并且将冷却剂冷却结构设置在电子系统的插座附近，冷却剂冷却结构包括一个或多个低剖面冷轨，其大小和构造成沿着热扩散器的底部边缘热耦合到散热器，其操作 电子卡在插座内的对接，以及与低剖面冷轨相关联的一个或多个冷却剂传送通道，用于将热量从低剖面冷轨移除到流过冷却剂承载通道的冷却剂 （s）。
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公开(公告)号：US20140247555A1
公开(公告)日：2014-09-04
申请号：US13782357
申请日：2013-03-01
发明人： Amilcar R. ARVELO , Mark A. BRANDON , Levi A. CAMPBELL , Tan D. DOAN , Michael J. ELLSWORTH, JR. , Randall G. Kemink , Eric J. McKEEVER
CPC分类号： H05K7/20254 , B23P15/26 , G06F1/20 , H01L23/473 , H01L2924/0002 , H05K7/20772 , Y10T29/4935 , H01L2924/00
摘要： Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the card to the coolant-cooled structure.
摘要翻译： 提供了冷却装置和冷却剂冷却的电子组件，其包括被配置为耦合到可操作地插入到电子系统中的电子卡的热转印结构。 热传递结构包括可在打开位置和夹紧位置之间移动的夹紧结构。 与电子系统可操作地插入的电子系统相关联的冷却剂冷却结构驻留在电子卡之间，并且至少部分地通过将电子卡插入电子系统中的夹持结构。 夹紧结构的打开位置便于电子系统内的电子卡与卡之间的冷却剂冷却结构与至少部分地夹持结构之间的卡止结构，并且夹紧结构向夹紧位置的移动有利于夹紧 冷却剂冷却结构的热传递结构以及从卡到冷却剂冷却结构的热传导。
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公开(公告)号：US20140146467A1
公开(公告)日：2014-05-29
申请号：US13684712
申请日：2012-11-26
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
CPC分类号： H05K7/20236 , G06F1/20 , H05K7/203 , H05K7/20318 , H05K7/20336 , H05K7/2079 , H05K7/20809
摘要： A cooled electronic system and cooling method are provided, where an electronics board having a plurality of electronic components mounted to the board is cooled by an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.
摘要翻译： 提供了一种冷却的电子系统和冷却方法，其中具有安装到板上的多个电子部件的电子板通过包括浸没冷却电子部件部分和传导冷却电子部件部分的设备来冷却。 浸没冷却部分包括至少部分地围绕和形成围绕安装到电子板的电子部件的多个电子部件的隔室以及设置在隔间内的流体的外壳。 多个电子部件至少部分地浸入流体中以便于这些部件的浸入冷却。 传导冷却的电子部件部分包括安装到电子板的电子部件的至少一个电子部件，并且至少一个电子部件至少部分地通过从至少一个 电子元件
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公开(公告)号：US20140133099A1
公开(公告)日：2014-05-15
申请号：US13782012
申请日：2013-03-01
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： F28F9/00 , H05K7/20781
摘要： A method is provided which includes providing a cooling apparatus which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.
摘要翻译： 提供了一种方法，其包括提供冷却装置，其包括在机架的入口或空气出口侧处联接到电子机架的门组件。 门组件包括：气流开口，其构造成便于通过安装到机架的门组件通过电子机架进入或流出气流; 空气冷却剂热交换器，其布置成使得通过气流开口的气流穿过空气 - 冷却剂热交换器，空气 - 冷却剂热交换器被配置为从通过其的气流中提取热量; 以及蒸汽冷凝器，其被配置为便于从电子机架的至少一个浸没冷却的电子部件部分出口的介电流体蒸气的冷凝。 包括门组件的冷却装置有助于电子机架的不同电子部件的空气冷却和浸没冷却。
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公开(公告)号：US20140133098A1
公开(公告)日：2014-05-15
申请号：US13674217
申请日：2012-11-12
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Roger R. SCHMIDT , Robert E. SIMONS , Daniel E. ZAMBRANO
CPC分类号： F28D15/00 , F28F9/00 , H05K7/2079 , H05K7/20827
摘要： A cooling apparatus for an electronics rack is provided which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack.
摘要翻译： 提供了一种用于电子机架的冷却装置，其包括构造成联接到电子机架的空气入口侧的门组件。 门组件包括：一个或多个气流开口，便于气流通过门组件并进入电子机架; 一个或多个空气冷却剂热交换器被设置成使得通过气流开口的气流穿过热交换器，该热交换器被配置为从穿过其的气流中提取热量; 以及一个或多个气流再分布器，其布置在气流通过热交换器的下游并且至少部分对准的气流开口的方向上。 气流再分布器有助于通过空气 - 液体热交换器的气流再次分布到电子机架的空气入口侧的所需气流图案，例如穿过空气入口侧的均匀气流分布 的架子。
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68.发明申请公开(公告)号：US20140124190A1
公开(公告)日：2014-05-08
申请号：US13782003
申请日：2013-03-01
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20281 , F28F27/02 , H05K7/20781 , H05K7/20836
摘要： A method is provided which includes providing a coolant-conditioning unit which includes a facility coolant path, having a facility coolant flow control valve, and a system coolant path accommodating a system coolant, and having a bypass line with a system coolant bypass valve. A heat exchanger is coupled to the facility and system coolant paths to facilitate transfer of heat from the system coolant to facility coolant in the facility coolant path, and the bypass line is disposed in the system coolant path in parallel with the heat exchanger. A controller automatically controls a regulation position of the coolant bypass valve and a regulation position of the facility coolant flow control valve based on a temperature of the system coolant, and automatically adjusts the regulation position of the system coolant bypass valve to facilitate maintaining the facility coolant flow control valve at or above a specified, partially open, minimum regulation position.
摘要翻译： 提供一种方法，其包括提供冷却剂调节单元，该冷却剂调节单元包括具有设备冷却剂流量控制阀的设备冷却剂通道和容纳系统冷却剂的系统冷却剂通道，并且具有与系统冷却剂旁通阀的旁路管路。 热交换器被耦合到设备和系统冷却剂路径，以便于将热量从系统冷却剂传送到设备冷却剂路径中的设备冷却剂，并且旁路管线与热交换器平行地设置在系统冷却剂路径中。 控制器基于系统冷却液的温度自动控制冷却剂旁通阀的调节位置和设备冷却剂流量控制阀的调节位置，并且自动调节系统冷却剂旁通阀的调节位置以便于维持设备冷却剂 流量控制阀处于或高于指定的，部分打开的最小调节位置。
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公开(公告)号：US20140124163A1
公开(公告)日：2014-05-08
申请号：US13671829
申请日：2012-11-08
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： F24J3/08
CPC分类号： H05K7/2039 , F24T10/30 , F28D15/0266 , F28D15/0275 , H05K7/20827 , Y02E10/10 , Y02E10/16
摘要： Cooling systems and methods are provided which include a heat sink having a housing with a compartment, a coolant inlet, and a coolant outlet. The housing is configured for a coolant to flow from the coolant inlet through the compartment to the coolant outlet, wherein the coolant is transferring heat extracted from one or more electronic components. The heat sink further includes one or more heat pipes having a first portion disposed within the compartment of the housing and a second portion disposed outside the housing. The heat pipe(s) is configured to extract heat from the coolant flowing through the compartment, and to transfer the extracted heat to the second portion disposed outside the housing. The second portion outside the housing is disposed to facilitate conducting the extracted heat into the ground.
摘要翻译： 提供了冷却系统和方法，其包括散热器，该散热器具有带隔室的壳体，冷却剂入口和冷却剂出口。 壳体构造成用于使冷却剂从冷却剂入口通过隔室流到冷却剂出口，其中冷却剂传送从一个或多个电子部件提取的热量。 散热器还包括一个或多个热管，其具有设置在壳体的隔室内的第一部分和设置在壳体外部的第二部分。 热管被配置为从流过隔室的冷却剂中提取热量，并且将提取的热量传送到设置在壳体外部的第二部分。 壳体外部的第二部分设置成便于将提取的热量导入地面。
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公开(公告)号：US20140096387A1
公开(公告)日：2014-04-10
申请号：US14105716
申请日：2013-12-13
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： B23P15/26
CPC分类号： B23P15/26 , F28D15/0266 , F28F3/00 , F28F3/12 , F28F13/00 , G06F1/20 , H05K7/20254 , H05K7/20272 , H05K7/2029 , H05K7/20772 , Y10T29/4935
摘要： A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).
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