摘要:
An electronic device comprises a first chassis, a second chassis, and at least one flexible circuit extending therebetween. The first chassis is oriented along a first axis and comprises at least one first microprocessor. The second chassis is oriented along a second axis and comprises at least one power generating component. The flexible circuit comprises a first end and a second end, wherein the first end is connectable to the first chassis and the second end is connectable to the second chassis. The first chassis is movable relative to the second chassis between a position wherein the first axis is substantially perpendicular to the second axis and a position wherein the first axis is substantially parallel to the second axis.
摘要:
The invention provides EMI cable shield termination apparatus. The apparatus includes (a) a cable exit panel coupled to a first electronic system and (b) one or more clamps coupled to the exit panel. The exit panel serves as an interface for one or more cables coupled to the first electronic system; the clamps provide mechanical coupling, and EMI shielding, for the cables to that interface. The exit panel couples to electrical ground such as through connection to the chassis of the first electronic system. The clamps also couple to ground through connection with the exit panel. Preferably, one end of the cables attaches to the clamps, at the interface formed by the exit panel, and the other end of the cables attach to respective ferrules coupled to a second electronics system. Beneficially, the apparatus reduces EMI effects generated from the first electronic system and coupled into the second electronic system. In preferred aspects of the invention, the first and second electronic systems are computers; and each of the clamps forms at least one aperture (“clamp aperture”) to affix to a cable coupled to the first electronic system. The invention facilitates configurable cable shield terminations to meet mechanical requirements of a given installation; that is, a single cable construction permits multiple optional clamp attachment locations to accommodate different separations of the attached equipment.
摘要:
Climate regulation within an enclosure (e.g., a case of a workstation or a rack or cabinet of servers) may be achieved through a climate regulator featuring several selectable climate regulator settings (e.g., a variable-speed fan array). Controllers of such climate regulators often select climate regulator settings based on current conditions inside the enclosure, such as the temperature of one or more processors operating within the enclosure. However, such control fails to account for the climate of air outside the enclosure that is drawn in to provide climate regulation, even though the climate properties of inlet air may significantly affect the effectiveness of climate regulation. Accordingly, a controller of a climate regulator may be configured to detect inlet climate properties of air directed into the enclosure, and to map the inlet climate properties (alone or in combination with other factors) to a selected climate regulator setting for the climate regulator.
摘要:
Described is a technology by which magnetic flux is used to provide backup power. A transformer has a line power source controllably coupled to a first input winding, and secondary power source controllably coupled to a second input winding. A controller monitors the line power and switches to the secondary power source if the line power voltage drops too low, or uses the secondary power source to augment the line power source if the line power current gets too high. Also described is incrementally transitioning from the secondary power source back to the line power source.
摘要:
A method described herein includes an act of receiving data that is indicative of predicted weather conditions for a particular geographic region, wherein the particular geographic region has an energy generation system therein, and wherein the energy generation system utilizes at least one renewable energy resource to generate electrical power. The method also includes the act of scheduling a computational workload for at least one computer in a data center based at least in part upon the data that is indicative of the predicted weather conditions for the particular geographic region.
摘要:
Climate regulation within an enclosure (e.g., a case of a workstation or a rack or cabinet of servers) may be achieved through a climate regulator featuring several selectable climate regulator settings (e.g., a variable-speed fan array). Controllers of such climate regulators often select climate regulator settings based on current conditions inside the enclosure, such as the temperature of one or more processors operating within the enclosure. However, such control fails to account for the climate of air outside the enclosure that is drawn in to provide climate regulation, even though the climate properties of inlet air may significantly affect the effectiveness of climate regulation. Accordingly, a controller of a climate regulator may be configured to detect inlet climate properties of air directed into the enclosure, and to map the inlet climate properties (alone or in combination with other factors) to a selected climate regulator setting for the climate regulator.
摘要:
Climate regulation within a chassis of an electronics enclosure (e.g., a workstation case or a server cabinet) may be achieved through an airflow regulated by at least one climate regulator devices (e.g., a variable-speed fan array) and a plenum configured to direct the airflow at the components of the enclosure. The enclosure may store a set of chassis, each having a dedicated plenum and climate regulator devices. However, this architecture may be less efficient than an architecture wherein adjacently mounted chassis may connect plenums (e.g., directly connecting an exhaust of one plenum with an inlet of the adjacent plenum) to unify the airflow directed through several chassis. Additionally, the chassis may feature a removable portion of the plenum wall that provides access to the plenum, and the climate regulator devices may be mounted on the removable portion, such that detachment enables withdrawal and servicing of the climate regulator devices.
摘要:
A cooling apparatus is disclosed. The cooling apparatus comprising a printed circuit (PC) board with an integrated circuit (IC) socket mounted onto the top side of the PC board. A mounting frame generally in the shape of a plate, with a first opening passing through the center of the plate, is mounted on the top side of the PC board with the IC socket located inside the first opening. A cold plate is attached to the mounting frame, the cold plate has an opening that passes through the cold plate. The opening in the cold plate is sized to allow an IC to be inserted into the IC socket through the opening. A fluid passageway is formed inside the cold plate. A fluid inlet port and a fluid outlet port are mounted on the cold plate and coupled to a first end and a second end of the fluid passageway, respectively. A heat spreader is removably attached to the top side of the cold plate wherein the bottom side of the heat spreader is configured to contact the top side of an IC when the IC is mounted in the IC socket.
摘要:
This patent pertains to self-cleaning fan assemblies. One implementation includes electronic components positioned in an enclosure. This implementation also includes a fan assembly that is configured to impart rotational force on air to move the air from outside the enclosure to inside the enclosure and around the electronic components. The fan assembly is further configured to separate contaminants from the air based upon differences in density between the contaminants and the air.
摘要:
A cooling apparatus is disclosed. The cooling apparatus comprising a printed circuit (PC) board with an integrated circuit (IC) socket mounted onto the top side of the PC board. A mounting frame generally in the shape of a plate, with a first opening passing through the center of the plate, is mounted on the top side of the PC board with the IC socket located inside the first opening. A cold plate is attached to the mounting frame, the cold plate has an opening that passes through the cold plate. The opening in the cold plate is sized to allow an IC to be inserted into the IC socket through the opening. A fluid passageway is formed inside the cold plate. A fluid inlet port and a fluid outlet port are mounted on the cold plate and coupled to a first end and a second end of the fluid passageway, respectively. A heat spreader is removably attached to the top side of the cold plate wherein the bottom side of the heat spreader is configured to contact the top side of an IC when the IC is mounted in the IC socket.