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148 条记录 (耗时 0.028 秒)

    Actuating transistor including multiple reentrant profiles
    61.
    发明授权
    Actuating transistor including multiple reentrant profiles 有权
    驱动晶体管包括多个折入型材

    公开(公告)号：US08304347B2

    公开(公告)日：2012-11-06

    申请号：US12986218

    申请日：2011-01-07

    申请人： Lee W. Tutt ,  Shelby F. Nelson

    发明人： Lee W. Tutt ,  Shelby F. Nelson

    IPC分类号： H01L21/311

    CPC分类号： H01L29/78642 ,  H01L29/66787

    摘要： A method of actuating a semiconductor device includes providing a transistor. The transistor includes a substrate. A first electrically conductive material layer is positioned on the substrate. A second electrically conductive material layer is in contact with and positioned on the first electrically conductive material layer. The second electrically conductive material layer includes a reentrant profile. The second electrically conductive material layer also overhangs the first electrically conductive material layer. An electrically insulating material layer is conformally positioned over the second electrically conductive material layer, the first electrically conductive material layer, and at least a portion of the substrate. A semiconductor material layer conforms to and is in contact with the electrically insulating material layer. A third electrically conductive material layer is nonconformally positioned over and in contact with a first portion of the semiconductor material layer. A fourth electrically conductive material layer is nonconformally positioned over and in contact with a second portion of the semiconductor material layer. A voltage is applied between the third electrically conductive material layer and the fourth electrically conductive material layer. A voltage is applied to the first electrically conductive material layer to electrically connect the third electrically conductive material layer and the fourth electrically conductive material layer.

    摘要翻译： 驱动半导体器件的方法包括提供晶体管。 晶体管包括衬底。 第一导电材料层位于基底上。 第二导电材料层与第一导电材料层接触并定位在第一导电材料层上。 第二导电材料层包括折入轮廓。 第二导电材料层也突出第一导电材料层。 电绝缘材料层保形地定位在第二导电材料层，第一导电材料层和基板的至少一部分之上。 半导体材料层符合并与电绝缘材料层接触。 第三导电材料层不均匀地定位在半导体材料层的第一部分上并与其接触。 第四导电材料层不均匀地定位在半导体材料层的第二部分上方并与其接触。 在第三导电材料层和第四导电材料层之间施加电压。 向第一导电材料层施加电压以电连接第三导电材料层和第四导电材料层。

    PRODUCING TRANSISTOR INCLUDING REDUCED CHANNEL LENGTH
    62.
    发明申请
    PRODUCING TRANSISTOR INCLUDING REDUCED CHANNEL LENGTH 有权
    生产晶体管，包括减少通道长度

    公开(公告)号：US20120178225A1

    公开(公告)日：2012-07-12

    申请号：US12986206

    申请日：2011-01-07

    申请人： Lee W. Tutt ,  Shelby F. Nelson

    发明人： Lee W. Tutt ,  Shelby F. Nelson

    IPC分类号： H01L21/336

    CPC分类号： H01L29/78642 ,  H01L29/66742

    摘要： A method of producing a transistor includes providing a substrate including in order a first electrically conductive material layer and a second electrically conductive material layer. The first electrically conductive material layer has a thickness. A resist material layer is deposited over the second electrically conductive material layer. The resist material layer is patterned to expose a portion of the second electrically conductive material layer. Some of the second electrically conductive material layer is removed to expose a portion of the first electrically conductive material layer. The second electrically conductive material layer is caused to overhang the first electrically conductive material layer by removing some of the first electrically conductive material layer. The second electrically conductive material layer, the first conductive material layer, and at least a portion of the substrate are conformally coated with an electrically insulating material layer having a thickness such that the thickness of the first conductive material layer is greater than the thickness of the electrically insulating material layer.

    摘要翻译： 一种制造晶体管的方法包括提供包括依次包括第一导电材料层和第二导电材料层的衬底。 第一导电材料层具有厚度。 在第二导电材料层上沉积抗蚀剂材料层。 图案化抗蚀剂材料层以暴露第二导电材料层的一部分。 去除一些第二导电材料层以露出第一导电材料层的一部分。 通过去除一些第一导电材料层，使第二导电材料层悬垂在第一导电材料层上。 所述第二导电材料层，所述第一导电材料层和所述基板的至少一部分共形涂覆有电绝缘材料层，所述电绝缘材料层的厚度使得所述第一导电材料层的厚度大于所述第一导电材料层的厚度 电绝缘材料层。

    TRANSISTOR INCLUDING REDUCED CHANNEL LENGTH
    63.
    发明申请
    TRANSISTOR INCLUDING REDUCED CHANNEL LENGTH 有权
    晶体管，包括减少通道长度

    公开(公告)号：US20120175684A1

    公开(公告)日：2012-07-12

    申请号：US12986197

    申请日：2011-01-07

    申请人： Lee W. Tutt ,  Shelby F. Nelson

    发明人： Lee W. Tutt ,  Shelby F. Nelson

    IPC分类号： H01L29/76

    CPC分类号： H01L29/78642

    摘要： A transistor includes a substrate. A first electrically conductive material layer, having a thickness, is positioned on the substrate. A second electrically conductive material layer is in contact with and positioned on the first electrically conductive material layer. The second electrically conductive material layer overhangs the first electrically conductive material layer. An electrically insulating material layer, having a thickness, is conformally positioned over the second electrically conductive material layer, the first electrically conductive material layer, and at least a portion of the substrate. The thickness of the first electrically conductive material layer is greater than the thickness of the electrically insulating material layer.

    摘要翻译： 晶体管包括衬底。 具有厚度的第一导电材料层位于衬底上。 第二导电材料层与第一导电材料层接触并定位在第一导电材料层上。 第二导电材料层突出第一导电材料层。 具有厚度的电绝缘材料层被共形地定位在第二导电材料层，第一导电材料层和基底的至少一部分之上。 第一导电材料层的厚度大于电绝缘材料层的厚度。

    METHOD OF MAKING LASER-ABLATABLE ELEMENTS
    64.
    发明申请
    METHOD OF MAKING LASER-ABLATABLE ELEMENTS 有权
    制造可激光元件的方法

    公开(公告)号：US20120094018A1

    公开(公告)日：2012-04-19

    申请号：US13334230

    申请日：2011-12-22

    申请人： Christine J. Landry-Coltrain ,  Mitchell S. Burberry ,  Dennis R. Perchak ,  Kam C. Ng ,  Lee W. Tutt ,  Lawrence A. Rowley ,  Linda M. Franklin

    发明人： Christine J. Landry-Coltrain ,  Mitchell S. Burberry ,  Dennis R. Perchak ,  Kam C. Ng ,  Lee W. Tutt ,  Lawrence A. Rowley ,  Linda M. Franklin

    IPC分类号： B05D5/06 ,  B05D1/36

    CPC分类号： B41C1/05 ,  B41M5/24 ,  B41N1/12 ,  Y10S430/145 ,  Y10T428/269 ,  Y10T428/31504

    摘要： A method is used to make a laser-ablatable element for direct laser engraving that has a laser-ablatable, relief-forming layer that has a relief-image forming surface and a bottom surface. The relief-forming layer can be prepared by applying multiple formulations. Each formulation comprises a coating solvent, a laser-ablatable polymeric binder, and an infrared radiation absorbing compound. The infrared radiation absorbing compound concentration in the resulting sub-layers is different in each adjacent pair of sub-layers so that the concentration is always greater in each pair sub-layer that is closer to the substrate, and the concentration is progressively greater in the sub-layers as they are closer to the substrate after the coating solvent is removed, wherein the multiple sub-layers provide a relief-forming layer so that the sub-layer farthest from the substrate provides a relief-image forming surface.

    摘要翻译： 一种用于直接激光雕刻的激光可烧蚀元件的方法，其具有具有凸版图像形成表面和底表面的激光可消除的凸版形成层。 凸版形成层可以通过应用多种制剂来制备。 每种制剂包括涂覆溶剂，可激光可消融的聚合物粘合剂和红外辐射吸收化合物。 所得子层中的红外辐射吸收化合物浓度在每个相邻的子层中是不同的，使得在更接近于衬底的每对子层中的浓度总是较大，并且浓度在 在除去涂覆溶剂之后它们更靠近基板的子层，其中多个子层提供凸版形成层，使得离基板最远的子层提供凸版图像形成表面。

    Component fabrication using thermal resist materials
    66.
    发明授权
    Component fabrication using thermal resist materials 有权
    使用耐热材料的部件制造

    公开(公告)号：US07989146B2

    公开(公告)日：2011-08-02

    申请号：US11869008

    申请日：2007-10-09

    申请人： Mitchell S. Burberry ,  Lee W. Tutt

    发明人： Mitchell S. Burberry ,  Lee W. Tutt

    IPC分类号： G03F7/26

    CPC分类号： H05K3/0082 ,  H01L21/0272 ,  H01L29/66969 ,  H01L29/7869 ,  H05K3/061 ,  H05K2203/107

    摘要： A method for producing a patterned material for electronic or photonic circuits, comprising the steps of: p) providing a substrate; q) coating the substrate with a polymer layer; r) coating a thermal resist solution over the polymer layer to form a thermal resist layer, wherein the polymer layer is substantially immiscible in the thermal resist solution; s) exposing predetermined areas of the thermal resist layer, corresponding to a desired image pattern, using infrared light; t) removing portions of the thermal resist layer corresponding to a desired image pattern, using a developer; u) removing the polymer layer where the thermal resist layer has been previously removed and undercutting a portion of the remaining thermal resist layer by an etching process; v) depositing a material using a substantially anisotropic process; and removing the remaining thermal resist layer and any overlying material with a solvent for the polymer or thermal resist layers leaving the material in a desired pattern.

    摘要翻译： 一种用于制造用于电子或光子电路的图案化材料的方法，包括以下步骤：p）提供衬底; q）用聚合物层涂覆基材; r）在所述聚合物层上涂覆热抗蚀剂溶液以形成热阻层，其中所述聚合物层基本上不混溶在所述耐热溶液中; s）使用红外光曝光对应于所需图像图案的热抗蚀剂层的预定区域; t）使用显影剂去除与所需图像图案相对应的热阻层的部分; u）除去先前已除去热阻层的聚合物层，然后通过蚀刻工艺对其余热阻层的一部分进行底切; v）使用基本上各向异性的工艺沉积材料; 以及用聚合物或热抗蚀剂层的溶剂除去剩余的热阻层和任何上覆材料，使材料以期望的图案离开。

    DIGITAL MANUFACTURE OF AN OPTICAL WAVEGUIDE
    68.
    发明申请
    DIGITAL MANUFACTURE OF AN OPTICAL WAVEGUIDE 有权
    光波导的数字化制造

    公开(公告)号：US20110076611A1

    公开(公告)日：2011-03-31

    申请号：US12569985

    申请日：2009-09-30

    申请人： Lee W. Tutt ,  Donna P. Suchy

    发明人： Lee W. Tutt ,  Donna P. Suchy

    IPC分类号： G03G13/16 ,  B32B37/00

    CPC分类号： H01B11/00 ,  G02B6/0043 ,  G02B6/0065 ,  G02B6/1221 ,  G02B6/13 ,  G03G15/043 ,  G03G15/221 ,  H01P11/001 ,  H01P11/003

    摘要： The electrographic printing of one or more multi-channeled layers having a particular pattern by electrographic techniques that produces a three-dimensional optical waveguide electrographically. Such electrographic printing comprises the steps of forming a desired print image, electrographically, on a receiver member utilizing predetermined sized marking particles; and, where desired, forming one or more final multi-channeled layers utilizing marking particles of a predetermined size or size distribution.

    摘要翻译： 通过电摄影技术对一个或多个具有特定图案的多通道层的电印打印，其通过电摄影产生三维光波导。 这种电印打印包括以下步骤：利用预定尺寸的标记颗粒在接收器构件上以电摄影形成期望的打印图像; 并且如果需要，使用预定尺寸或尺寸分布的标记颗粒形成一个或多个最终的多通道层。

    Transfer laminate donor for lenticular images with anti-stick backing material
    69.
    发明授权
    Transfer laminate donor for lenticular images with anti-stick backing material 失效
    转移叠层供体用于具有防粘背衬材料的透镜图像

    公开(公告)号：US06846776B2

    公开(公告)日：2005-01-25

    申请号：US10224872

    申请日：2002-08-21

    申请人： Lee W. Tutt ,  Jason E. Anderson

    发明人： Lee W. Tutt ,  Jason E. Anderson

    IPC分类号： G03B35/00 ,  B41M7/00 ,  G02B3/00 ,  G02B27/22 ,  B41M5/035 ,  B41M5/38

    CPC分类号： G02B27/2214 ,  B41M7/0027

    摘要： Disclosed is a multilayer transfer laminate donor comprising a flexible support bearing on the top side of the support: a) a release layer capable of allowing the support to be removed from all layers above the release layer; b) above the release layer a dye receiving layer; c) on top of the transfer laminate donor, a thermal adhesion layer comprising a polymer which has a Tg less than 100° C., and that, upon application of heat, is capable of adhering to a lenticular support; and bearing on the bottom side of the support, d) an anti-stick layer that reduces the tendency of the thermal adhesion layer to stick to the bottom of the support when stored in contact therewith. Also disclosed is a process for preparing a lenticular element.

    摘要翻译： 公开了一种多层转移层压体供体，其包含在支撑体顶侧上的柔性支承轴承：a）能够允许从剥离层上方的所有层移除载体的脱模层; b）在脱模层上方，染料接收 层; c）在转移层压体供体的顶部，热粘合层，其包含Tg小于100℃的聚合物，并且在施加热量时，能够粘附到透镜支撑体上;并且承载于 支撑体的底侧，d）当与其接触时减少热粘合层粘附到支撑体底部的趋势的防粘层。 还公开了一种制备透镜元件的方法。