摘要:
A display element drive circuit includes a first circuit which holds as a voltage component electric charges based on a gradation signal corresponding to display data, a second circuit which supplies the gradation signal to the electric charge holding circuit at a timing of application of a selection signal, current control type display elements, and a third circuit which generates a driving current based on the voltage component held in the first circuit and supplies the generated driving current to the display element. One of the second and third circuits includes at least one field effect transistor. The field effect transistor includes gate, electrode and drain electrodes, and a source-side parasitic capacitance formed between the gate and source electrodes and a drain-side parasitic capacitance formed between the gate and drain electrodes of the field effect transistor have different capacitance values.
摘要:
A drive circuit which drives an optical element in accordance with a gradation signal corresponding to display data includes an electric charge holding circuit which holds electric charges based on the gradation signal as a voltage component, and a driving current control circuit which generates a driving current based on the voltage component held in the electric charge holding circuit and supplies the generated driving current to the optical element. The driving current control circuit has at least one double-gate type thin film transistor. The transistor includes a semiconductor layer, a first gate electrode provided above the semiconductor layer, a second gate electrode provided below the semiconductor layer, and a source and drain electrodes provided on both end portion sides of the semiconductor layer.
摘要:
A display panel (110) comprises a plurality of optical elements (OEL) each having a pair of electrodes and performing an optical operation according to current passing between the pair of electrodes, a current line (DL), a switch circuit (Tr2) that passes a write current (Ia) with a predetermined current value through the current line (DL) during a selection time (Tse) and stops passing current during a non-selection time (Tnse), and a current storage circuit (Tr1, Tr2, Cs, Cp) that stores current data according to the current value of the write current (Ia) passing through the current line (DL) during the selection time (Tse) and that supplies a drive current (Ib) having a current value, which is obtained by subtracting a predetermined offset current (Ioff) from the current value of the stored write current (Ia), to the optical elements (OEL) during the non-selection time (Tnse). The current storage circuit (Tr1, Tr2, Cs, Cp) includes a first capacitor device (Cs) to which an electrical charge corresponding to the write current (Ia) is written and a second capacitor device (Cp) to which an electrical charge corresponding to offset current (Ioff) is written, and the second capacitor device (Cp) has a capacitive value, which is equal to or larger than the first capacitor device (Cs).
摘要:
A semiconductor device is provided which can be manufactured even by using an inexpensive FZ wafer in a wafer process and still has a sharp inclination of a high impurity concentration in a high impurity concentration layer at the outermost portion of the reverse side and at the boundary between the high impurity concentration and a low impurity concentration drift layer, thus achieving both low cost and a high performance. A method for manufacturing a semiconductor device is also provided which can form a high impurity concentration buffer layer and a high impurity concentration layer at the outermost portion of the reverse side without any significant trouble, even after the formation of an active region and an electrode thereof at the right side, to thereby achieve both low cost and high performance.
摘要:
A gate drive circuit in a power converter includes a voltage-driven switching device, and a gate drive circuit connected to the voltage-driven switching device for driving the same. The gate drive circuit includes a detection device for detecting a physical quantity in the switching device, and an operation device for changing a gate drive condition of the switching device. When an output of the detection means becomes a value outside a specified value at a turn-on or turn-off operation of the switching device, the operation device changes the gate drive condition instantaneously or for a predetermined time to reduce a voltage applied to the switching device.
摘要:
Provision of a super-junction semiconductor device capable of reducing rises in transient on-resistance at the time of repeated switching operation. A super-junction structure is provided that has a striped parallel surface pattern, where a super-junction stripe and a MOS cell 6 stripe are parallel, and a p column Y2 over which no MOS cell 6 stripe is arranged and a p column Y1 over which the MOS cell 6 stripe is arranged are connected at an end.
摘要:
On the top surface of a thin semiconductor wafer, top surface structures forming a semiconductor chip are formed. The top surface of the wafer is affixed to a supporting substrate with a double-sided adhesive tape. Then, from the bottom surface of the thin semiconductor wafer, a trench, which becomes a scribing line, is formed by wet anisotropic etching so that side walls of the trench are exposed. On the side walls of the trench with the crystal face exposed, an isolation layer with a conductivity type different from that of the semiconductor wafer for holding a reverse breakdown voltage is formed simultaneously with a collector region of the bottom surface diffused layer by ion implantation, followed by annealing with laser irradiation. The side walls form a substantially V-shaped or trapezoidal-shaped cross section, with an angle of the side wall relative to the supporting substrate being 30-70°. The double-sided adhesive tape is then removed from the top surface to produce semiconductor chips. With such a manufacturing method, a reverse-blocking semiconductor device having high reliability can be formed.
摘要:
Disclosed is a display apparatus including a plurality of display pixels formed of a plurality of first electrodes provided in one surface side of a substrate, a second electrode which faces each of the first electrodes and display functional layers which are provided between each of the first electrodes and the second electrode and a resistive film having a predetermined resistivity in which one surface side is provided so as to face the other surface side of the second electrode having a predetermined space above the upper surface of a partition wall layer to define a forming region for each of the display pixels and which is disposed so as to be conductive to the other surface side of the second electrode by a pressure applied from outside, and the second electrode constructing the display pixels is double used as an electrode for detecting a position where the pressure is applied.
摘要:
Provision of a super-junction semiconductor device capable of reducing rises in transient on-resistance at the time of repeated switching operation. A super-junction structure is provided that has a striped parallel surface pattern, where a super-junction stripe and a MOS cell 6 stripe are parallel, and a p column Y2 over which no MOS cell 6 stripe is arranged and a p column Y1 over which the MOS cell 6 stripe is arranged are connected at an end.
摘要:
A thin semiconductor wafer, on which a top surface structure and a bottom surface structure that form a semiconductor chip are formed, is affixed to a supporting substrate by a double-sided adhesive tape. Then, on the thin semiconductor wafer, a trench to become a scribing line is formed by wet anisotropic etching with a crystal face exposed so as to form a side wall of the trench. On the side wall of the trench with the crystal face thus exposed, an isolation layer for holding a reverse breakdown voltage is formed by ion implantation and low temperature annealing or laser annealing so as to be extended to the top surface side while being in contact with a p collector region as a bottom surface diffused layer. Then, laser dicing is carried out to neatly dice a collector electrode, formed on the p collector region, together with the p collector region, without presenting any excessive portions and any insufficient portions under the isolation layer. Thereafter, the double-sided adhesive tape is removed from the collector electrode to produce semiconductor chips. A highly reliable reverse-blocking semiconductor device can thus be formed at a low cost.