NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
    67.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US20100109072A1

    公开(公告)日:2010-05-06

    申请号:US12563832

    申请日:2009-09-21

    IPC分类号: H01L27/115 H01L21/8246

    摘要: A nonvolatile semiconductor memory device includes a first stacked body on a silicon substrate, and a second stacked body is provided thereon. The first stacked body includes a plurality of insulating films alternately stacked with a plurality of electrode films, and a first portion of a through-hole extending in a stacking direction is formed. The second stacked body includes a plurality of insulating films alternately stacked with a plurality of electrode films, and a second portion of the through-hole is formed. A memory film is formed on an inner face of the through-hole, and a silicon pillar is buried in an interior of the through-hole. A central axis of the second portion of the through-hole is shifted from a central axis of the first portion, and a lower end of the second portion is positioned lower than an upper portion of the first portion.

    摘要翻译: 非易失性半导体存储器件包括在硅衬底上的第一层叠体,并且在其上设置第二层叠体。 第一堆叠体包括交替层叠有多个电极膜的多个绝缘膜,并且形成沿堆叠方向延伸的通孔的第一部分。 第二堆叠体包括交替层叠有多个电极膜的多个绝缘膜,并且形成通孔的第二部分。 在通孔的内表面上形成记忆膜,并且将硅柱埋在通孔的内部。 通孔的第二部分的中心轴线从第一部分的中心轴线偏移,并且第二部分的下端位于比第一部分的上部更低的位置。

    NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
    68.
    发明申请
    NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    非挥发性半导体存储器件及其制造方法

    公开(公告)号:US20100096682A1

    公开(公告)日:2010-04-22

    申请号:US12556242

    申请日:2009-09-09

    IPC分类号: H01L29/78 H01L21/768

    摘要: A non-volatile semiconductor storage device has a memory string including a plurality of electrically rewritable memory cells connected in series. The non-volatile semiconductor storage device also has a protruding layer formed to protrude upward with respect to a substrate. The memory string includes: a plurality of first conductive layers laminated on the substrate; a first semiconductor layer formed to penetrate the plurality of first conductive layers; and an electric charge storage layer formed between the first conductive layers and the first semiconductor layer, and configured to be able to store electric charges. Each of the plurality of first conductive layers includes: a bottom portion extending in parallel to the substrate; and a side portion extending upward with respect to the substrate along the protruding layer at the bottom portion. The protruding layer has a width in a first direction parallel to the substrate that is less than or equal to its length in a lamination direction.

    摘要翻译: 非易失性半导体存储装置具有串联连接的多个电可重写存储单元的存储串。 非挥发性半导体存储装置还具有形成为相对于基板向上突出的突出层。 存储器串包括:层叠在基板上的多个第一导电层; 形成为穿透所述多个第一导电层的第一半导体层; 以及形成在第一导电层和第一半导体层之间的电荷存储层,并且能够存储电荷。 多个第一导电层中的每一个包括:平行于基板延伸的底部; 以及沿底部的突出层相对于基板向上延伸的侧部。 该突出层在平行于基板的第一方向上的宽度小于或等于其在层叠方向上的长度。

    NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MAKING THE SAME
    69.
    发明申请
    NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MAKING THE SAME 失效
    非挥发性半导体存储器件及其制造方法

    公开(公告)号:US20100039865A1

    公开(公告)日:2010-02-18

    申请号:US12521997

    申请日:2008-01-31

    摘要: A non-volatile semiconductor memory device according to the present invention includes a substrate; a first word-line provided above the substrate surface, the first word-line having a plate shape in an area where a memory cell is formed; a second word-line provided above the first word-line surface, the second word-line having a plate shape; a plurality of metal wirings connecting the first and second word-lines with a driver circuit; and a plurality of contacts connecting the first and second word-lines with the metal wirings. The contact of the first word-line is formed in a first word-line contact area. The contact of the second word-line is formed in a second word-line contact area. The first word-line contact area is provided on a surface of the first word-line that is drawn to the second word-line contact area.

    摘要翻译: 根据本发明的非易失性半导体存储器件包括:衬底; 设置在所述衬底表面上方的第一字线,所述第一字线在形成存储器单元的区域中具有板形; 设置在所述第一字线表面上方的第二字线,所述第二字线具有板形; 将第一和第二字线与驱动电路连接的多个金属布线; 以及将第一和第二字线与金属布线连接的多个触点。 第一字线的接触形成在第一字线接触区域中。 第二字线的接触形成在第二字线接触区域中。 第一字线接触区域被提供在第一字线的被拉到第二字线接触区域的表面上。

    NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
    70.
    发明申请
    NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    非挥发性半导体存储器件及其制造方法

    公开(公告)号:US20090230458A1

    公开(公告)日:2009-09-17

    申请号:US12392636

    申请日:2009-02-25

    IPC分类号: H01L29/792 H01L21/28

    摘要: A non-volatile semiconductor storage device has a plurality of memory strings with a plurality of electrically rewritable memory cells connected in series. Each of the memory strings includes: a columnar semiconductor layer extending in a direction perpendicular to a substrate; a plurality of conductive layers formed at a sidewall of the columnar semiconductor layer via memory layers; and interlayer insulation layers formed above of below the conductive layers. A sidewall of the conductive layers facing the columnar semiconductor layer is formed to be inclined such that the distance thereof from a central axis of the columnar semiconductor layer becomes larger at lower position thereof than at upper position thereof. While, a sidewall of the interlayer insulation layers facing the columnar semiconductor layer is formed to be inclined such that the distance thereof from a central axis of the columnar semiconductor layer becomes smaller at lower position thereof than at upper position thereof.

    摘要翻译: 非易失性半导体存储装置具有多个具有串联连接的多个电可重写存储单元的存储器串。 每个存储器串包括:在垂直于衬底的方向上延伸的柱状半导体层; 多个导电层,经由存储层形成在所述柱状半导体层的侧壁处; 以及形成在导电层下方的层间绝缘层。 形成面向柱状半导体层的导电层的侧壁,使得其与柱状半导体层的中心轴的距离在其下部位置比在其上部位置变大。 同时,面对柱状半导体层的层间绝缘层的侧壁形成为倾斜,使得其在柱状半导体层的中心轴线处的距离在其下部位置处比在其上部位置变小。