公开(公告)号：US11411144B2

公开(公告)日：2022-08-09

申请号：US17022933

申请日：2020-09-16

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Tomokazu Maruyama ,  Tetsuya Ishikawa

IPC: H01L33/00 ,  H01L33/50 ,  H01L33/36 ,  H01L33/56 ,  H01L33/62 ,  H01L33/34 ,  H01L33/60 ,  H01L33/48

Abstract: A light-emitting device includes a substrate comprising a base member, a first wiring, a second wiring, and a via hole; at least one light-emitting element electrically connected to and disposed on the first wiring; and a covering member having light reflectivity and covering a lateral surface of the light-emitting element and a front surface of the substrate. The base member defines a plurality of depressed portions separated from the via hole in a front view and opening on a back surface and a bottom surface of the base member. The substrate includes a third wiring covering at least one of inner walls of the plurality of depressed portions and electrically connected to the second wiring. A depth of each of the plurality of depressed portions defined from the back surface toward the front surface is larger on a bottom surface side than on an upper surface side of the base member.

公开(公告)号：US11309465B2

公开(公告)日：2022-04-19

申请号：US16693072

申请日：2019-11-22

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/36 ,  H01L33/50 ,  H01L23/00 ,  H01L33/48 ,  H01L25/075

Abstract: A method of manufacturing a light emitting device includes: providing a substrate including a pair of connection terminals, the connection terminals each having a protruding portion at least on a first main surface of the connection terminal; providing a light emitting element on the protruding portion, the light emitting element having a semiconductor laminate and a pair of electrodes on a same surface of the semiconductor laminate; bonding the pair of the electrodes of the light emitting element and the pair of the connection terminals, respectively, by a molten material; and embedding a surface of the protruding portion of the connection terminals, a surface of the molten material, and a space between the substrate and the light emitting element into a light reflecting member.

公开(公告)号：US11227979B2

公开(公告)日：2022-01-18

申请号：US15965415

申请日：2018-04-27

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Tomokazu Maruyama ,  Tetsuya Ishikawa

IPC: H01L33/00 ,  H01L33/50 ,  H01L33/36 ,  H01L33/56 ,  H01L33/62 ,  H01L33/34 ,  H01L33/60 ,  H01L33/48

Abstract: A light-emitting device includes a substrate comprising a base member, a first wiring, a second wiring, and a via hole; at least one light-emitting element electrically connected to and disposed on the first wiring; and a covering member having light reflectivity and covering a lateral surface of the light-emitting element and a front surface of the substrate. The base member defines a plurality of depressed portions separated from the via hole in a front view and opening on a back surface and a bottom surface of the base member. The substrate includes a third wiring covering at least one of inner walls of the plurality of depressed portions and electrically connected to the second wiring. A depth of each of the plurality of depressed portions defined from the back surface toward the front surface is larger on a bottom surface side than on an upper surface side of the base member.

公开(公告)号：US11171272B2

公开(公告)日：2021-11-09

申请号：US16567468

申请日：2019-09-11

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi

IPC: H01L33/62 ,  H01L33/56

Abstract: A method of producing a light source device includes providing a light emitting device having a substrate including a base member that includes a bottom surface and a recess. The substrate further including a wiring portion in the recess. The method further including providing a support substrate having a support base member, a first wiring pattern on a top surface of the support base member and including a joining region, and an insulating region, and applying a solder member such that the solder member on the insulating region has a volume larger than that of the solder member on the joining region. The light emitting device is placed on the support substrate while the solder member is separate from a portion of the wiring portion positioned in the vicinity of the bottom surface and the wiring portion is joined to the joining region.

公开(公告)号：US11056627B2

公开(公告)日：2021-07-06

申请号：US16784387

申请日：2020-02-07

Applicant: NICHIA CORPORATION

Inventor： Suguru Beppu ,  Yoichi Bando ,  Hiroto Tamaki ,  Takuya Nakabayashi

IPC: H01L33/60 ,  H01L33/50 ,  H01L21/3213

Abstract: A light emitting device includes: a light emitting element; a wavelength conversion member disposed on or above an upper surface of the light emitting element; a light-transmissive member disposed on an upper surface of the wavelength conversion member; and a light reflective member disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, wherein an upper surface of the light reflective member is coplanar with an upper surface of the light-transmissive member, and wherein each of the upper surface of the light reflective member and the upper surface of the light-transmissive member is a cut surface.

公开(公告)号：US11038084B2

公开(公告)日：2021-06-15

申请号：US16526263

申请日：2019-07-30

Applicant: NICHIA CORPORATION

Inventor： Toru Hashimoto ,  Takuya Nakabayashi

IPC: H01L33/38 ,  H01L33/40 ,  H01L23/00

Abstract: A light-emitting device includes a first light-emitting element, a second light-emitting element having a peak emission wavelength different from that of the first light-emitting element, a light-guide member covering a light extracting surface and lateral surfaces of the first light-emitting element and a light extracting surface and lateral surfaces of the second light-emitting element, and a wavelength conversion layer continuously covering the light extracting surface of each of the first and second light-emitting elements and disposed apart from each of the first and second light-emitting elements, and a first reflective member covering outer lateral surfaces of the light-guide member. An angle defined by an active layer of the first light-emitting element and an active layer of the second light-emitting element is less than 180° at a wavelength conversion layer side.

公开(公告)号：US10727387B2

公开(公告)日：2020-07-28

申请号：US16795496

申请日：2020-02-19

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Gensui Tamura

IPC: H01L31/00 ,  H01L33/64 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62

Abstract: Alight emitting device includes a substrate including a base member including a front surface, a rear surface opposite to the front surface, a bottom surface perpendicular to the front surface, and a top surface opposite to the bottom surface, a first wiring portion located on the front surface, and a second wiring portion located on the rear surface; a light emitting element electrically connected with the first wiring portion; and a first reflective member covering a lateral surface of the light emitting element and the front surface of the base member. The base member has a recessed portion opened on the rear surface and the bottom surface. The substrate includes a third wiring portion covering an inner wall of the recessed portion and electrically connected with the second wiring portion, and a via in contact with the first wiring portion, the second wiring portion and the third wiring portion.

公开(公告)号：US10672963B2

公开(公告)日：2020-06-02

申请号：US16116494

申请日：2018-08-29

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi

IPC: H05K3/30 ,  H05K3/40 ,  G02B6/42 ,  G02B6/122 ,  H01L33/62 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/54

Abstract: A method of manufacturing a substrate for a light emitting device includes: forming wiring to form a plurality of first wiring parts and second wiring parts on/above an upper surface of a base member; forming projection parts including a first projection part on each of the first wiring parts and a second projection part on each of the second wiring parts by forming a first metal film on a region including at least parts of the first wiring parts and the second wiring parts and etching the first metal film using a resist for forming projection part; and forming an alignment mark by forming a second metal film on the substrate and etching the second metal film using a resist, wherein the resist for forming the projection part and the resist for forming alignment mark are exposed to light in an identical step of exposing to light.

公开(公告)号：US10522731B2

公开(公告)日：2019-12-31

申请号：US16028331

申请日：2018-07-05

Applicant: NICHIA CORPORATION

Inventor： Shimpei Sasaoka ,  Takuya Nakabayashi

IPC: H01L27/30 ,  H01L33/62 ,  H05K1/03 ,  H01L33/38 ,  H01L33/48 ,  H01L33/56 ,  H01L33/54

Abstract: A method of manufacturing a light emitting device includes providing molded packages each of which has a recess. A light emitting component is mounted on a bottom surface of the recess. At least one sealing member covering the light emitting component is formed within the recess. A lead frame including a first lead and a second lead is provided, the first lead having a first groove on an upper surface of the first lead the second lead having a second groove on an upper surface of the second lead. Spaces are formed, each of the spaces being surrounded with an upper metal mold, a lower metal mold, and the lead frame by cooperatively holding the lead frame with the upper metal mold and the lower metal mold. The spaces and the first groove and the second groove are filled with a resin.

公开(公告)号：US10290607B2

公开(公告)日：2019-05-14

申请号：US15784639

申请日：2017-10-16

Applicant: NICHIA CORPORATION

Inventor： Hiroto Tamaki ,  Takuya Nakabayashi

IPC: H01L23/00 ,  H01L33/50 ,  H01L33/48 ,  H01L33/56

Abstract: A method of manufacturing a light emitting device includes: preparing a light-transmissive member including a light reflective sheet that has a through-hole, and a color conversion material layer that is composed of a light-transmissive resin containing a color conversion material and disposed in the through-hole, preparing a light emitting element, fixing the color conversion material layer to the light emitting element, covering a side surface of the light emitting element with a light-reflective member, and cutting the light-reflective member and light-reflective sheet.