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公开(公告)号:USD747299S1
公开(公告)日:2016-01-12
申请号:US29518462
申请日:2015-02-24
Applicant: Samsung Electronics Co., Ltd.
Designer: Hee-Bong Kim , Taehun Kim , Jae Neung Lee
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公开(公告)号:USD737236S1
公开(公告)日:2015-08-25
申请号:US29510265
申请日:2014-11-26
Applicant: Samsung Electronics Co., Ltd.
Designer: Chaejoo Son , Taehun Kim
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公开(公告)号:US20250062229A1
公开(公告)日:2025-02-20
申请号:US18660743
申请日:2024-05-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changhee Lee , Chulmin Choi , Sangyong Park , Dajin Kim , Taeho Kim , Gunwook Yoon , Taehun Kim , Seungjae Baik , Jaeduk Lee
IPC: H01L23/528 , H01L25/065 , H10B41/10 , H10B41/27 , H10B41/35 , H10B43/10 , H10B43/27 , H10B43/35 , H10B80/00
Abstract: A semiconductor device includes a first semiconductor structure that includes a first substrate, circuit devices on the first substrate, a lower interconnection structure, and a lower bonding structure; and a second semiconductor structure disposed on and connected to the first semiconductor structure The second semiconductor structure includes a stack structure; channel structures that including a first portion that penetrate through the stack structure in the vertical direction and a second portion that extends upward from the first portion; a first material layer disposed on the stack structure and the channel structure and having first conductivity; and a second material layer disposed between the first material layer and the stack structure and having second conductivity., The first material layer overlaps second portions of the channel structures in the vertical direction, and the second material layer does not overlap the second portions of the channel structures in the vertical direction.
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公开(公告)号:US12219683B2
公开(公告)日:2025-02-04
申请号:US17248234
申请日:2021-01-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sanggyun Ye , Kyungjin Kim , Eonjoong Kim , Taehun Kim , Jeawon Lee , Inki Jeon , Jiho Jeong , Seunggee Hong
Abstract: A cooking appliance including a cooking chamber configured to cook food therein and openable in a first direction, a shelf provided to be inserted into the cooking chamber in the first direction and having a cooking surface on which food is placed, a magnetron configured to generate high frequency waves to be supplied to the shelf, and a heat generating member configured to generate heat by the high frequency waves generated by the magnetron. Where the cooking surface includes a first area on one side and a second area on another side, the heat generating member includes a first heat generating portion configured to supply heat to the first area and a second heat generating portion disposed to correspond to the second area, and the first heat generating portion supplies more heat to the first area than the second heat generating portion supplies to the second area.
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公开(公告)号:US12085221B2
公开(公告)日:2024-09-10
申请号:US18368663
申请日:2023-09-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Taehun Kim , Chulyong Cho , Jisu Kim , Hyunyong Choi
CPC classification number: F16M11/105 , F16M11/041 , F16M11/14 , F16M11/18 , F16M11/2014 , F16M13/022 , H05K5/0017 , H05K5/0217
Abstract: A display apparatus includes a display module, a supporting device provided to support and turn the display module, and a holding device provided for a mobile device to be coupled to the display module. The supporting device rotatably supports the display module and includes a motor providing a driving force to turn the display module. The holding device supports a mobile device so that the mobile device may be coupled to the display module. The holding device comprises a mounting part provided to be mounted onto the display module and a holder rotatably coupled to the mounting part and provided to support the mobile device.
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66.
公开(公告)号:US12079491B2
公开(公告)日:2024-09-03
申请号:US18150626
申请日:2023-01-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Taewoo Han , Wooil Kim , Taehun Kim
IPC: G06F3/06
CPC classification number: G06F3/0625 , G06F3/0644 , G06F3/0659 , G06F3/0673
Abstract: A memory system includes a memory device including a memory cell array divided into a plurality of memory banks, and a memory controller that sends read requests or write requests to the memory device for the purpose of inputting data to or outputting data from the memory banks of the memory cell array, respectively, and sends the read requests so as to be separated from the write requests based on a read-write switching point. In a first turn, the memory controller sets a near switching point before the read-write switching point. The memory controller blocks scheduling at least one of first bank requests, between the near switching point and the read-write switching point. The memory controller schedules at least one of second bank requests, which cause state switching of the memory banks, so as to be issued between the near switching point and the read-write switching point.
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公开(公告)号:US20240142493A1
公开(公告)日:2024-05-02
申请号:US18497401
申请日:2023-10-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sanguk Han , Jaekul Lee , Hyungsun Jang , Taehun Kim
CPC classification number: G01R1/0466 , G01R31/2863 , H01L24/13 , H01L24/29 , H01L2224/13006 , H01L2224/29022
Abstract: A socket for testing a semiconductor package includes a body having an internal space configured to accommodate a semiconductor package; and at least a first spacer on the body and positioned to contact a first surface of the semiconductor package when the semiconductor package is placed on the body. The body includes a lower socket portion provided with through-holes, configured through which to receive meter reading pins that contact external connection terminals of the semiconductor package, and an upper socket portion disposed above the lower socket portion, and the first spacer is disposed on a surface of the lower socket portion that faces the first surface of the semiconductor package when the semiconductor package is placed on the body.
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公开(公告)号:US11852347B2
公开(公告)日:2023-12-26
申请号:US16712008
申请日:2019-12-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Minho Yun , Taehun Kim , Hyunsang Kim , Sungsoo Park , Sangil Hyun
CPC classification number: F24C15/006 , F24C15/101 , F24C15/102 , F24C15/322
Abstract: A cooking appliance having a cooling system includes an oven; a cooktop provided at an upper side of the oven; an electrical component disposed in a front surface of the cooktop; a first cooling duct provided between a top surface of the oven and a bottom surface of the cooktop to communicate with a first suction port in a front surface of the oven; an exhaust duct disposed in a rear surface of the cooktop and connected to a rear end of the first cooling duct; a second cooling duct communicating with a second suction port in the front surface of the cooktop and provided inside the cooktop; and an exhaust fan disposed in a connecting section between the first cooling duct and the exhaust duct, wherein the second cooling duct is connected to the first cooling duct in a position closer to the exhaust duct than the electrical component.
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69.
公开(公告)号:US20230266893A1
公开(公告)日:2023-08-24
申请号:US18150626
申请日:2023-01-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Taewoo Han , Wooil Kim , Taehun Kim
IPC: G06F3/06
CPC classification number: G06F3/0625 , G06F3/0644 , G06F3/0659 , G06F3/0673
Abstract: A memory system includes a memory device including a memory cell array divided into a plurality of memory banks, and a memory controller that sends read requests or write requests to the memory device for the purpose of inputting data to or outputting data from the memory banks of the memory cell array, respectively, and sends the read requests so as to be separated from the write requests based on a read-write switching point. In a first turn, the memory controller sets a near switching point before the read-write switching point. The memory controller blocks scheduling at least one of first bank requests, between the near switching point and the read-write switching point. The memory controller schedules at least one of second bank requests, which cause state switching of the memory banks, so as to be issued between the near switching point and the read-write switching point.
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公开(公告)号:US11721673B2
公开(公告)日:2023-08-08
申请号:US17568558
申请日:2022-01-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyuekjae Lee , Jihoon Kim , Jihwan Suh , Soyoun Lee , Jiseok Hong , Taehun Kim , Jihwan Hwang
IPC: H01L25/065 , H01L23/31 , H01L23/16 , H01L23/00 , H01L23/538
CPC classification number: H01L25/0657 , H01L23/16 , H01L23/31 , H01L23/5386 , H01L24/14
Abstract: Provided is a semiconductor package including a semiconductor stack including a first lower chip, a second lower chip, a gap filler disposed between the first lower chip and the second lower chip, and a first upper chip disposed on an upper surface of the first lower chip, an upper surface of the second lower chip, and an upper surface of the gap filler, the first lower chip includes first upper surface pads and a first upper surface dielectric layer, the second lower chip includes second upper surface pads and a second upper surface dielectric layer, the first upper chip includes lower surface pads and a lower surface dielectric layer, and an area of an upper surface of each of the second upper surface pads is greater than an area of a lower surface of each of the lower surface pads.
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