公开(公告)号：US11502230B2

公开(公告)日：2022-11-15

申请号：US16668325

申请日：2019-10-30

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seong Gyu Jang ,  Chan Seob Shin ,  Seom Geun Lee ,  Ho Joon Lee ,  Jong Hyeon Chae

IPC: H01L33/38 ,  H01L27/15 ,  H01L33/62 ,  H01L33/52

Abstract: A light emitting device including first, second, and third light emitting parts disposed one over another and each including a first-type semiconductor layer, an active layer, and a second-type semiconductor layer, a first conductive pattern at least partially disposed between the second and third light emitting parts, the first conductive pattern including a first portion electrically coupled with at least one of the first-type and second-type semiconductor layers of the first and second light emitting parts, and a second portion extending from the first portion and disposed on one surface of the second light emitting part between the second and third light emitting parts, and a second conductive pattern disposed on the third light emitting part and electrically coupled with the first conductive pattern, in which the second conductive pattern at least partially overlaps with the second portion of the first conductive pattern.

公开(公告)号：US11362073B2

公开(公告)日：2022-06-14

申请号：US16782594

申请日：2020-02-05

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seom Geun Lee ,  Chan Seob Shin ,  Ho Joon Lee ,  Seong Kyu Jang

IPC: H01L25/13 ,  H01L33/62 ,  H01L33/42 ,  H01L33/08

Abstract: A light emitting device for a display including first, second, and third LED stacks each including a first semiconductor layer, an active layer, and a second semiconductor layer, first, second, and third transparent electrodes in ohmic contact with a lower surface of the first LED stack, an upper surface of the second LED stack, and an upper surface of the third LED stack, respectively, a first electrode pad disposed on the first semiconductor layer of the third LED stack, a lower second electrode pad disposed on the third transparent electrode, and first, second, and third bump pads disposed on the first LED stack and electrically connected to the LED stacks, respectively, and a common bump pad disposed electrically connected to each LED stack, in which an upper surface of the first electrode pad is located at substantially the same elevation as that of the lower second electrode pad.

公开(公告)号：US11302746B2

公开(公告)日：2022-04-12

申请号：US16915384

申请日：2020-06-29

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Chung Hoon Lee ,  Seong Gyu Jang ,  Chang Yeon Kim ,  Ho Joon Lee

IPC: H01L27/15 ,  H01L27/32 ,  H01L25/07 ,  H01L25/16 ,  H01L33/10 ,  H01L33/30 ,  H01L33/40 ,  H01L33/50 ,  H01L33/08 ,  H01L25/075 ,  H01L33/38 ,  H01L33/00

Abstract: A light emitting diode (LED) stack for a display including a first LED sub-unit configured to emit a first colored light, a second LED sub-unit disposed on the first LED sub-unit and configured to emit a second colored light, and a third LED sub-unit disposed on at least one of the first LED sub-unit and the second LED sub-unit and configured to emit a third colored light, in which the first LED sub-unit is configured to emit light through the second LED sub-unit and the third LED sub-unit, and the second LED sub-unit is configured to emit light through the third LED sub-unit.

公开(公告)号：US11222994B2

公开(公告)日：2022-01-11

申请号：US16198784

申请日：2018-11-22

Applicant: Seoul Viosys Co., Ltd.

Inventor： Chang Yeon Kim ,  Jong Hyeon Chae ,  Chung Hoon Lee ,  Seong Gyu Jang ,  Jong Min Jang ,  Ho Joon Lee

IPC: H01L33/08 ,  H01L25/07 ,  H01L27/32 ,  H01L33/38 ,  H01L33/24 ,  H01L33/42 ,  H01L33/44 ,  H01L33/50 ,  H01L33/62 ,  H01L33/32 ,  H01L33/00 ,  H01L25/075 ,  H01L25/065 ,  H01L25/04

Abstract: A light emitting diode pixel for a display including a substrate, a first LED sub-unit disposed on the substrate, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on at least one of the first and second LED sub-units, and vias formed in the substrate, in which each of the first to third LED sub-units comprises a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, and each of the vias is electrically connected to at least one of the first, second, and third LED sub-units.

公开(公告)号：US11217569B2

公开(公告)日：2022-01-04

申请号：US16789877

申请日：2020-02-13

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Chang Yeon Kim ,  Jong Hyeon Chae ,  Jong Min Jang ,  Ho Joon Lee ,  Seong Gyu Jang

IPC: H01L25/075 ,  H01L33/22 ,  H01L33/38 ,  H01L33/40 ,  H01L33/42 ,  G02B5/26 ,  H01L33/62 ,  H01L33/08 ,  H01L33/46 ,  H01L33/64

Abstract: A light emitting device for a display including a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, electrode pads disposed below the first LED sub-unit, and a filler disposed between the electrode pads, in which the electrode pads include a common electrode pad electrically connected in common to the first, second, and third LED sub-units, and first, second, and third electrode pads connected to the first, second, and third LED sub-units, respectively, the first, second, and third LED sub-units are independently drivable, light generated in the first LED sub-unit is configured to be emitted to the outside of the light emitting device through the second and third LED sub-units, and light generated in the second LED sub-unit is configured to be emitted to the outside through the third LED sub-unit.

公开(公告)号：US11211528B2

公开(公告)日：2021-12-28

申请号：US16815823

申请日：2020-03-11

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seong Kyu Jang ,  Chan Seob Shin ,  Seom Geun Lee ,  Ho Joon Lee

IPC: H01L33/24 ,  H01L33/62 ,  H01L25/075 ,  G02B27/01 ,  G06F1/16

Abstract: A light emitting device for a display including first, second, and third LED stacks, and bump pads disposed on the first LED stack, in which each LED stack includes a first semiconductor layer and a second semiconductor layer exposing a portion of the first semiconductor layer, the first LED stack includes upper through-holes and the second LED stack includes lower through-holes, the bump pads include a first bump pad electrically connected to the second semiconductor layer of the first LED stack, a second bump pad electrically connected to the second semiconductor layer of the second LED stack through the upper through-hole, a third bump pad electrically connected to the second semiconductor layer of the third LED stack through the upper through-hole and the lower through-hole, and a common bump pad electrically connected to the first semiconductor layers of each LED stack in common.

公开(公告)号：US11177413B2

公开(公告)日：2021-11-16

申请号：US16198784

申请日：2018-11-22

Applicant: Seoul Viosys Co., Ltd.

Inventor： Chang Yeon Kim ,  Jong Hyeon Chae ,  Chung Hoon Lee ,  Seong Gyu Jang ,  Jong Min Jang ,  Ho Joon Lee

IPC: H01L33/08 ,  H01L25/07 ,  H01L27/32 ,  H01L33/38 ,  H01L33/24 ,  H01L33/42 ,  H01L33/44 ,  H01L33/50 ,  H01L33/62 ,  H01L33/32 ,  H01L33/00 ,  H01L25/075 ,  H01L25/065 ,  H01L25/04

Abstract: A light emitting diode pixel for a display including a substrate, a first LED sub-unit disposed on the substrate, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on at least one of the first and second LED sub-units, and vias formed in the substrate, in which each of the first to third LED sub-units comprises a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, and each of the vias is electrically connected to at least one of the first, second, and third LED sub-units.

公开(公告)号：US10886327B2

公开(公告)日：2021-01-05

申请号：US16219716

申请日：2018-12-13

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Hyeon Chae ,  Seong Gyu Jang ,  Ho Joon Lee

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/40 ,  H01L33/24 ,  G09G3/32 ,  G09G3/20 ,  H01L25/075 ,  G09G3/3225

Abstract: A light emitting stacked structure including a plurality of epitaxial sub-units disposed one over another, each epitaxial sub-unit configured to emit colored light having different wavelength band from each other, and a common electrode disposed between and connected to adjacent epitaxial sub-units, in which light emitting regions of the epitaxial sub-units overlap each other.

公开(公告)号：US10777604B2

公开(公告)日：2020-09-15

申请号：US16198792

申请日：2018-11-22

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Seong Gyu Jang ,  Ho Joon Lee ,  Chang Yeon Kim ,  Chung Hoon Lee

IPC: H01L27/15 ,  H01L25/07 ,  H01L25/13 ,  H01L25/065 ,  H01L25/11 ,  H01L33/00 ,  H01L33/10 ,  H01L33/40 ,  H01L33/42 ,  H01L33/50 ,  H01L33/62 ,  H01L25/075 ,  H01L33/38

Abstract: A light emitting device including first, second, and third LED sub-units, and electrode pads disposed on the first LED sub-unit, electrically connected to the LED sub-units, and including a common electrode pad electrically connected to each of the LED sub-units, and first, second, and third electrode pads connected to a respective one of the LED sub-units, in which the common electrode pad, the second electrode pad, and the third electrode pad are electrically connected to the second LED sub-unit and the third LED sub-unit through holes that pass through the first LED sub-unit, the first, second, and third LED sub-units are configured to be independently driven, light generated in the first LED sub-unit emitted to the outside through the second and third LED sub-units, and light generated in the second LED sub-unit is emitted to the outside through the third LED sub-unit.

公开(公告)号：US10672747B2

公开(公告)日：2020-06-02

申请号：US16207881

申请日：2018-12-03

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Chang Yeon Kim ,  Jong Hyeon Chae ,  Jong Min Jang ,  Ho Joon Lee ,  Seong Gyu Jang

IPC: H01L25/075 ,  H01L33/22 ,  H01L33/38 ,  H01L33/40 ,  H01L33/42 ,  G02B5/26 ,  H01L33/62 ,  H01L33/08 ,  H01L33/46 ,  H01L33/64

Abstract: A light emitting device for a display includes a substrate and first, second, and third LED sub-units, a first transparent electrode between the first and second LED sub-units and in ohmic contact with the first LED sub-unit, a second transparent electrode between the second and third LED sub-units and in ohmic contact with the second LED sub-unit, a third transparent electrode between the second transparent electrode and the third LED sub-unit and in ohmic contact with the third LED sub-unit, at least one current spreader connected to at least one of the first, second, and third LED sub-units, electrode pads disposed on the substrate, and through-hole vias formed through the substrate, in which at least one of the through-hole vias is formed through the substrate and the first and second LED sub-units.