摘要:
A method of manufacturing a semiconductor device includes removing a part of a semiconductor substrate to form a protruding portion and a recess portion in a surface area of the semiconductor substrate, forming a first epitaxial semiconductor layer in the recess portion, forming a second epitaxial semiconductor layer on the protruding portion and the first epitaxial semiconductor layer, removing a first part of the second epitaxial semiconductor layer with a second part of the second epitaxial semiconductor layer left to expose a part of the first epitaxial semiconductor layer, and etching the first epitaxial semiconductor layer from the exposed part of the first epitaxial semiconductor layer to form a cavity under the second part of the second epitaxial semiconductor layer.
摘要:
A semiconductor substrate cleaning liquid composition is provided that includes one or more types selected from the group consisting of a compound having at least two sulfonic acid groups per molecule, phytic acid, and a condensed phosphoric acid compound; an inorganic acid; and water. There is also provided a process for cleaning a semiconductor substrate that includes a first step of cleaning the semiconductor substrate using the semiconductor substrate cleaning liquid composition and, subsequent to the first step, a second step of cleaning the semiconductor substrate with pure water, ozone water formed by dissolving ozone gas in pure water, or aqueous hydrogen peroxide.
摘要:
A duplexed network system is formed with a plurality of programmable controllers and two different networks. Each of the programmable controllers includes a CPU unit, a primary communication unit connected to one of these networks (the first network) and a secondary communication unit connected to the other of the networks (the second network). The primary communication unit serves to compile participation status of nodes connected to the first network. The CPU unit gives priority to the primary communication unit when a request to transmit a communication command is issued to both the primary and secondary communication units. The primary communication unit serves to judge, when a request to transmit a communication command to an addressee node is received from the CPU unit, whether transmission to the addressee node is possible based on the participation status of the first network, to transmit the communication command if the transmission is judged to be possible and to request the secondary communication unit to transmit the communication command if the transmission is judged to be not possible.
摘要:
A method has been disclosed which cleans a semiconductor substrate using a cleaning liquid produced by mixing bubbles of a gas into an acid solution in which the gas has been dissolved to the saturated concentration and which brings the zeta potentials of the semiconductor substrate and adsorbed particles into the negative region by the introduction of an interfacial active agent. Alternatively, a semiconductor substrate is cleaned using a cleaning liquid produced by mixing bubbles of a gas into an alkaline solution in which the gas has been dissolved to the saturated concentration and whose pH is 9 or more.
摘要:
According to the present invention, there is provided a semiconductor substrate processing apparatus comprising: a processing bath which etches a semiconductor substrate by dipping the semiconductor substrate into a processing solution; an outer bath which is positioned outside said processing bath and receives the processing solution overflowing from said processing bath; a circulation channel which resupplies the processing solution discharged from said outer bath to said processing bath; a heater which adjusts a temperature of the processing solution flowing through said circulation channel; a filter which removes foreign matter in the processing solution flowing through said circulation channel; and a controller which measures, after the semiconductor substrate is loaded into said processing bath, one of the temperature of the processing solution in said processing bath and a time during which the temperature of the processing solution restores a predetermined temperature, calculates a processing time during which the semiconductor substrate is etched on the basis of the measurement result, and etches the semiconductor substrate on the basis of the calculated processing time.
摘要:
A planar lightwave circuit includes at least one optical waveguide core, and at least one feature proximate the core having a stress-engineered property to balance stress and therefore minimize birefringence affecting the core. A protective passivation layer is formed over the core and the feature to be substantially non-interfering with the balanced stress provided by the feature. The stress balancing feature may be an overcladding layer formed over the core, doped to have a coefficient of thermal expansion approximately matched to that of an underlying substrate, to symmetrically distribute stress in an undercladding between the overcladding and the substrate, away from the core. The protective passivation layer is formed to have a coefficient of thermal expansion approximately matched to that of the overcladding. In one exemplary embodiment, the passivation layer is formed from silicon nitride. Related concepts of stress release grooves, and core overetching, are also disclosed.
摘要:
A fuse circuit (11) having a plurality of terminals (22, 23) provided on a common joint plate (21) and a fuse circuit (11′) having a plurality of terminals (22′, 23′) provided on a common joint plate (21′) are incorporated into a housing (12), thereby constituting a fuse link assembly (10). The plurality of fuse circuits (11, 11′) are provided with circuit connection portions (27, 27′) which share a power input portion. The fuse circuits (11, 11′) are incorporated into the housing (12) in parallel. As a result, the number of circuits is increased, by means of only enlargement of widthwise direction Y which is easy to increase while enlargement of longitudinal direction X stemming from packaging of circuits is minimized.
摘要:
A planar lightwave circuit includes an arrayed waveguide grating (AWG), with input and output waveguides, partially curved array waveguides with respective length differences, and planar waveguide regions for focusing optical energy between the input/output and array waveguides. Optimal waveguide widths and spacing along the planar waveguide region facets are disclosed, which are largely determinative of AWG size and optical performance. Also disclosed are optimal cross-sectional waveguide dimensions (e.g., width and height); modified index of refraction difference between the waveguide core and cladding regions; and optimal array waveguide lengths, path length differences, and free spectral range. These features, especially when combined with advanced fiber attachment, passivation and packaging techniques, result in high-yield, high-performance AWGs (both gaussian and flattop versions).
摘要:
In an electric connection box-producing method, block members (2) for connecting electrical circuit parts are provided on a mounting frame (4), and this method includes a block member-molding step of molding individual block members (2) separate from one another, a block member-combining step of arranging the plurality of block members (2) in the irrespective predetermined positions, and welding these block members together to form a block assembly (3), and a block assembly-mounting step of fixedly securing the block assembly (3) to the mounting frame (4).
摘要:
The method includes the steps of: calculating a direction-dependent distribution of ejected particles from a target, dividing a range of the vertical angle &thgr;, with respect to a direction perpendicular to the surface of the target, into sections of an equal interval, counting a number of the ejected particles for every section of the vertical angle &thgr;, and calculating a vertical distribution function by interpolating the counted numbers of the ejected particles as a function of the vertical angle &thgr;. The method also includes determining values of the vertical angle &thgr; likely to emerge in a random process of a particle ejection from the target using the vertical distribution function based on a rejection method, determining values of the horizontal angle &phgr;, measured from a direction in the surface plane of the target, likely to emerge in a random process of a particle ejection from the target, and calculating tracks of sputtered particles in a sputtering arrangement using the values of the vertical angles and the horizontal angles determined by the third step and the fourth step in accordance with the Monte Carlo method.