公开(公告)号：US06969305B2

公开(公告)日：2005-11-29

申请号：US10357473

申请日：2003-02-04

申请人： Norio Kimura ,  Tadakazu Sone ,  Tomohiko Akatsuka ,  Tatsuya Sasaki

发明人： Norio Kimura ,  Tadakazu Sone ,  Tomohiko Akatsuka ,  Tatsuya Sasaki

IPC分类号： B24B49/16 ,  B24B53/007 ,  B24B53/017 ,  B24B1/00

CPC分类号： B24B53/017 ,  B24B49/16

摘要： A polishing apparatus for polishing a substrate comprises a turntable having a polishing surface, a substrate holder for holding a substrate and bringing the substrate into contact under pressure with the polishing surface, a dresser including a dresser tool adapted to be brought into contact under a pressure with the polishing surface to dress or condition the polishing surface and a pressure device connected to the dresser for moving the dresser between a raised position where the dresser is spaced away from the polishing surface and a dressing position where the dresser rests on the polishing surface such that the dresser tool is in contact with the polishing surface under a pressure exerted by the weight of the dresser itself, the dresser comprising a follow-up mechanism allowing each one of dressing element to move up and down relative to a flange portion so as to follow a contour of the polishing surface of the turntable.

摘要翻译： 用于抛光衬底的抛光装置包括具有抛光表面的转盘，用于保持衬底并使衬底在压力下与抛光表面接触的衬底保持器，包括修整器工具的修整器，其适于在压力下接触 抛光表面用于打磨或调理抛光表面，以及连接到修整器的压力装置，用于在修整器与抛光表面间隔开的升高位置和修整器搁置在抛光表面上的修整位置之间移动修整器， 修整器工具在由修整器本身的重量施加的压力下与抛光表面接触，该修整器包括随动装置，其允许每个修整元件相对于凸缘部分上下移动，以便 遵循转盘抛光表面的轮廓。

公开(公告)号：USRE38854E1

公开(公告)日：2005-10-25

申请号：US10142980

申请日：2002-05-13

申请人： Masamichi Nakashiba ,  Norio Kimura ,  Isamu Watanabe ,  Kaori Yoshida

发明人： Masamichi Nakashiba ,  Norio Kimura ,  Isamu Watanabe ,  Kaori Yoshida

IPC分类号： B24B5/00 ,  B24B37/04 ,  B24B49/16

CPC分类号： B24B37/042 ,  B24B37/30 ,  B24B49/16

摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.

公开(公告)号：US06939208B2

公开(公告)日：2005-09-06

申请号：US09787121

申请日：2001-01-22

申请人： Kenji Kamimura ,  Norio Kimura ,  Satoshi Okamura ,  Hideo Aizawa ,  Makoto Akagi ,  Katsuhiko Tokushige ,  Hisanori Matsuo ,  Manabu Tsujimura

发明人： Kenji Kamimura ,  Norio Kimura ,  Satoshi Okamura ,  Hideo Aizawa ,  Makoto Akagi ,  Katsuhiko Tokushige ,  Hisanori Matsuo ,  Manabu Tsujimura

IPC分类号： B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/306

CPC分类号： B24B53/017 ,  B24B29/005 ,  B24B53/003 ,  H01L21/30625

摘要： The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring, and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the ppolishing surface, which is a surface of a polishing cloth.

摘要翻译： 本发明涉及一种用于将诸如半导体晶片的工件抛光成平面镜面抛光的抛光装置。 抛光装置包括具有抛光表面的抛光台和顶环，并且将工件插入在抛光台和顶环之间，并以预定压力按压以抛光工件。 抛光装置包括至少两个修整单元，用于通过与作为抛光布表面的抛光表面接触来修整抛光表面。

公开(公告)号：US06722964B2

公开(公告)日：2004-04-20

申请号：US09824644

申请日：2001-04-04

申请人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

发明人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

IPC分类号： B24B100

CPC分类号： B24B37/345 ,  B24B9/065 ,  B24B37/12 ,  H01L21/67046

摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

摘要翻译： 抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属 电影。 抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光 用于抛光衬底的外周部分的机构。

公开(公告)号：US06645053B1

公开(公告)日：2003-11-11

申请号：US09622638

申请日：2000-11-08

申请人： Norio Kimura ,  You Ishii ,  Yoshikuni Tateyama

发明人： Norio Kimura ,  You Ishii ,  Yoshikuni Tateyama

IPC分类号： B24B100

CPC分类号： B24B53/017 ,  B24B53/02

摘要： A polishing apparatus has a turntable with a polishing cloth attached thereto and a top ring for holding and pressing a workpiece to be polished against the polishing cloth under a certain pressure. The polishing apparatus also has a first dressing unit having a contact-type dresser for dressing the polishing cloth by bringing the contact-type dresser in contact with the polishing cloth, and a second dressing unit having a noncontact-type dresser for dressing the polishing cloth with a fluid jet applied therefrom to the polishing cloth. The contact-type dresser comprises a diamond dresser or an SiC dresser.

摘要翻译： 抛光装置具有安装有抛光布的转台和用于在一定压力下将待抛光的工件保持并压在抛光布上的顶环。 抛光装置还具有第一修整单元，其具有接触型修整器，用于通过使接触型修整器与抛光布接触来修整抛光布;以及第二修整单元，具有用于修整抛光布的非接触式修整器 其中流体喷射从其施加到抛光布上。 接触式修整器包括钻石修整器或SiC修整器。

公开(公告)号：US06579152B1

公开(公告)日：2003-06-17

申请号：US09422802

申请日：1999-10-22

申请人： Norio Kimura

发明人： Norio Kimura

IPC分类号： B24B722

CPC分类号： B24B37/16 ,  B24B37/11

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface, and a top ring having a pressing surface for holding a workpiece to be polished and pressing the workpiece against the polishing surface of the turntable. At least one of the polishing surface of the turntable and the pressing surface of the top ring is a curved surface such as a convex surface or a concave surface.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有抛光表面的转台和具有用于保持要抛光的工件的按压表面并将工件压靠在转台的抛光表面上的顶环。 转台的研磨面和顶环的按压面中的至少一个是弯曲表面，例如凸面或凹面。

公开(公告)号：US06428403B1

公开(公告)日：2002-08-06

申请号：US09580832

申请日：2000-05-30

申请人： Norio Kimura ,  Hozumi Yasuda

发明人： Norio Kimura ,  Hozumi Yasuda

IPC分类号： B24B722

CPC分类号： B24B37/32 ,  B24B37/30 ,  B24B49/16 ,  B24B53/017

摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the polishing cloth under a first pressing force to polish the workpiece. The top ring has a recess defined therein for accommodating the workpiece therein. A presser ring is vertically movably disposed around the top ring, and is pressed against the polishing cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force. Relative rotation between the top ring and the presser ring is achieved during polishing.

摘要翻译： 用于抛光诸如半导体晶片的工件的抛光装置具有安装在其上表面上的抛光布的转盘和用于保持工件的顶环，并且在第一按压力下将工件压靠在抛光布上以抛光 工件。 顶环具有限定在其中的凹部，用于在其中容纳工件。 压环围绕顶环上下移动地设置，并以可变的第二按压力压在抛光布上。 第一和第二按压力彼此独立地变化，并且基于第一按压力来确定第二按压力。 在抛光期间实现顶环和压环之间的相对旋转。

公开(公告)号：US06139677A

公开(公告)日：2000-10-31

申请号：US787916

申请日：1997-01-23

申请人： Tetsuji Togawa ,  Seiji Katsuoka ,  Norio Kimura ,  Toyomi Nishi

发明人： Tetsuji Togawa ,  Seiji Katsuoka ,  Norio Kimura ,  Toyomi Nishi

IPC分类号： B24B53/007 ,  B24B53/017 ,  B24B55/04 ,  C23F1/02

CPC分类号： B24B53/017 ,  B24B55/045

摘要： A polishing apparatus 70 is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable 73 with a polishing 74 cloth mounted on an upper surface thereof, a top ring 75 for supporting the workpiece to be polished and pressing the workpiece against the polishing cloth, and a dressing tool 79 for dressing the polishing cloth on the turntable. The polishing apparatus further includes a cover 10 which covers an upper surface of the turntable for preventing liquid on the turntable from being scattered, and inserting holes 17 and 21 formed in an upper wall of the cover for inserting the top ring and the dressing tool therethrough.

摘要翻译： 抛光装置70用于通过化学抛光和机械抛光的组合将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括：转台73，其上表面安装有抛光74布;顶环75，用于支撑待抛光的工件并将工件压靠在抛光布上;以及修整工具79，用于将抛光布修整在 转盘。 抛光装置还包括覆盖转台上表面以防止转台上的液体散落的盖10，以及形成在盖的上壁中的插入孔17和21，用于将顶环和修整工具穿过其中 。

公开(公告)号：US6024633A

公开(公告)日：2000-02-15

申请号：US18459

申请日：1998-02-04

申请人： Norio Kimura ,  Toshiya Takeuchi

发明人： Norio Kimura ,  Toshiya Takeuchi

IPC分类号： B24B41/06 ,  B24B45/00 ,  B24B29/00

CPC分类号： B24B37/30 ,  B24B41/06 ,  B24B45/00

摘要： A workpiece holding device enables stable polishing to be performed without sacrificing the structural strength of a top ring or the space necessary for machining a through hole or implanting engaging pins while allowing close contact to be made between a workpiece to a polishing cloth on a polishing tool. The top ring includes a top ring member having a holder plate for holding the workpiece on a front surface and a cover plate attached to a back surface of the holder plate by engaging a depression section formed on a back surface of the holder plate with a protrusion section formed on a front surface of the cover plate. A curved surface bearing unit provided between an end portion of a drive shaft and a back surface of the cover plate couples the drive shaft and the top ring member while permitting motion of the top ring member relative to the polishing tool. At least a portion of the curved surface bearing unit is positioned within the depression section.

摘要翻译： 工件保持装置能够进行稳定的抛光，而不会牺牲顶环的结构强度或加工通孔所需的空间或植入接合销，同时允许在工件与抛光工具上的抛光布之间进行紧密接触 。 顶环包括顶环构件，其具有用于将工件保持在前表面上的保持板和通过将形成在保持器板的后表面上的凹陷部分接合到保持器板的后表面的盖板而具有突起 形成在盖板的前表面上。 设置在驱动轴的端部和盖板的后表面之间的曲面轴承单元在允许顶环构件相对于抛光工具的运动的同时将驱动轴和顶环构件相耦合。 曲面承载单元的至少一部分位于凹部内。

公开(公告)号：US5876273A

公开(公告)日：1999-03-02

申请号：US625291

申请日：1996-04-01

申请人： Hiroyuki Yano ,  Katsuya Okumura ,  Norio Kimura ,  Tomoyuki Yahiro ,  Hozumi Yasuda

发明人： Hiroyuki Yano ,  Katsuya Okumura ,  Norio Kimura ,  Tomoyuki Yahiro ,  Hozumi Yasuda

IPC分类号： B24B37/30 ,  B24B29/02

CPC分类号： B24B37/30

摘要： A polishing apparatus is provided which improves uniformity across the surface of a polished wafer. The apparatus includes a wafer carrier, a guide ring coupled to a lower portion of the wafer carrier, a circular plate coupled to a first inner circumference portion of the guide ring distant from the wafer carrier, and a cavity, formed within an area bounded by the lower portion of the wafer carrier, an inner circumference of the circular plate, and a second inner circumference portion of the guide ring between the circular plate and the lower portion of the wafer carrier, the circular plate holding the wafer to be polished in the cavity.

摘要翻译： 提供了一种改善抛光晶片表面均匀性的抛光装置。 该装置包括晶片载体，联接到晶片载体的下部的引导环，耦合到远离晶片载体的引导环的第一内周部分的圆形板，以及形成在由 晶片载体的下部，圆形板的内圆周和导向环的第二内周部分在圆形板和晶片载体的下部之间，圆形板将待抛光的晶片保持在 腔。