摘要:
Methods of fabricating semiconductor devices including providing a substrate having a channel region defined therein; forming an insulation layer on the substrate; forming a gate trench for forming a gate electrode having a sidewall portion, a bottom portion and an edge portion between the sidewall portion and the bottom portion on the insulation layer, the gate electrode trench overlapping the channel region; and forming a gate electrode in the gate electrode trench. Forming the gate electrode includes forming a first metal layer pattern in the gate electrode trench and forming a second metal layer pattern on the first metal layer pattern.
摘要:
Integrated circuit memory devices include a semiconductor substrate and a bit line on the semiconductor substrate. A plurality of memory cells is also provided. Each of these magnetic memory cells includes a magnetic storage element, a magnetic flux focusing layer on the magnetic storage element and an electrically insulating layer extending between the bit line and the magnetic flux focusing layer. This electrically insulating layer may contact an upper surface of the magnetic flux focusing layer and a lower surface of the bit line. The magnetic memory cell further includes a non-ferromagnetic electrically conductive layer extending between the magnetic flux focusing layer and the magnetic storage element. The electrically insulating layer is configured to cause current passing in a first direction (e.g., vertical direction) from the magnetic storage element to the non-ferromagnetic electrically conductive layer during a cell writing operation to spread laterally in the magnetic flux focusing layer (and non-ferromagnetic electrically conductive layer) in a second direction (e.g., lateral direction), which is orthogonal to the first direction. The magnetic flux focusing layer may be formed of a ferromagnetic material, such as NiFe.
摘要:
Methods of forming a semiconductor device include forming a trench mask pattern on a semiconductor substrate having active regions and device isolation regions. A thermal oxidation process is performed using the trench mask pattern as a diffusion mask to form a thermal oxide layer defining a convex upper surface of the active regions. The thermal oxide layer and the semiconductor substrate are etched using the trench mask pattern as an etch mask to form trenches defining convex upper surfaces of the active regions. The trench mask pattern is removed to expose the convex upper surfaces of the active regions. Gate patterns are formed extending over the active regions.
摘要:
Integrated circuit memory devices include a semiconductor substrate and a bit line on the semiconductor substrate. A plurality of memory cells is also provided. Each of these magnetic memory cells includes a magnetic storage element, a magnetic flux focusing layer on the magnetic storage element and an electrically insulating layer extending between the bit line and the magnetic flux focusing layer. This electrically insulating layer may contact an upper surface of the magnetic flux focusing layer and a lower surface of the bit line. The magnetic memory cell further includes a non-ferromagnetic electrically conductive layer extending between the magnetic flux focusing layer and the magnetic storage element. The electrically insulating layer is configured to cause current passing in a first direction (e.g., vertical direction) from the magnetic storage element to the non-ferromagnetic electrically conductive layer during a cell writing operation to spread laterally in the magnetic flux focusing layer (and non-ferromagnetic electrically conductive layer) in a second direction (e.g., lateral direction), which is orthogonal to the first direction. The magnetic flux focusing layer may be formed of a ferromagnetic material, such as NiFe.
摘要:
A magnetic memory includes digit lines, bit lines, and magnetic tunnel junctions (MTJs) that are between the bits lines and the digit lines. The digit lines intersect the bit lines at an oblique angle. The digit lines may intersect the bit lines at an oblique angle of from 15° to 75°.
摘要:
A non-volatile memory device can include a plurality of parallel active regions that are defined by a plurality of device isolation layers formed on a semiconductor substrate, where each of the plurality of parallel active regions extends in a first direction and has a top surface and sidewalls. A plurality of parallel word lines can extend in a second direction and cross over the plurality of parallel active regions at intersecting locations. A plurality of charge storage layers can be disposed at the intersecting locations between the plurality of parallel active regions and the plurality of parallel word lines. Each of the plurality of charge storage layers at the intersecting locations can have a first side and a second side that is parallel to the second direction and can have a first length, a third side and a fourth side that are parallel to the first direction and can have a second length, where the first length is less than the second length.
摘要:
Non-volatile memory devices are provided including a control gate electrode on a substrate; a charge storage insulation layer between the control gate electrode and the substrate; a tunnel insulation layer between the charge storage insulation layer and the substrate; a blocking insulation layer between the charge storage insulation layer and the control gate electrode; and a material layer between the tunnel insulation layer and the blocking insulation layer, the material layer having an energy level constituting a bottom of a potential well.
摘要:
A magnetic random access memory (MRAM) device may include a magnetic tunnel junction structure between first and second electrodes. Methods of operating such as MRAM device may include providing a write current through the first electrode, through the magnetic tunnel junction structure, and through the second electrode. An auxiliary switching magnetic field may be generated by the write current through the first electrode, and a portion of the auxiliary switching magnetic field may pass through the magnetic tunnel junction structure in a direction perpendicular to a direction of the write current through the magnetic tunnel junction structure. Moreover, a magnitude of the write current and/or the auxiliary switching magnetic field may be sufficient to change a program state of the magnetic tunnel junction structure. Related devices and structures are also discussed.
摘要:
Nonvolatile memory devices are provided. Devices include active regions that may be defined by device isolation layers formed on a semiconductor substrate and extend in a first direction. Devices may also include word lines that may cross over the active regions and extend in a second direction intersecting the first direction. The active regions have a first pitch and the word lines have a second pitch that is greater than the first pitch.