公开(公告)号：US20200052176A1

公开(公告)日：2020-02-13

申请号：US16660776

申请日：2019-10-22

Applicant: X-Celeprint Limited

Inventor： Matthew Meitl ,  Tanya Yvette Moore ,  Ronald S. Cok ,  Salvatore Bonafede ,  Brook Raymond ,  Christopher Andrew Bower ,  Carl Ray Prevatte, JR.

IPC: H01L33/62 ,  H01L33/48

Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.

公开(公告)号：US10446719B2

公开(公告)日：2019-10-15

申请号：US14743915

申请日：2015-06-18

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: G09G3/32 ,  H01L27/15 ,  H01L33/38 ,  H01L23/482 ,  H01L23/538 ,  H01L25/075 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  H05B33/08 ,  G02B26/04 ,  G02F1/167 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  G09G3/22 ,  F21V9/08 ,  H01L33/58 ,  F21K9/60 ,  H01L33/20 ,  H01L33/40 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y113/13 ,  F21Y101/00 ,  F21Y105/00

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US10431487B2

公开(公告)日：2019-10-01

申请号：US16192779

申请日：2018-11-15

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  António José Marques Trindade ,  Ronald S. Cok ,  Brook Raymond ,  Carl Prevatte

IPC: H01L21/683 ,  H01L33/00 ,  H01L33/38 ,  H01L33/62 ,  H01L23/00

Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.

公开(公告)号：US20190267363A1

公开(公告)日：2019-08-29

申请号：US15908336

申请日：2018-02-28

Applicant: X-Celeprint Limited

Inventor： Christopher Andrew Bower ,  Matthew Meitl ,  Brook Raymond ,  Erich Radauscher

IPC: H01L25/16 ,  G02B27/01 ,  H01L33/62 ,  H01L25/075

Abstract: A transparent display comprises a display substrate having a display area and a bezel area adjacent to each of at least one corresponding side of the display area. The display substrate is at least partially transparent. Light-controlling elements are disposed in, on, or over the display substrate in the display area. Display wires are disposed in, on, or over the display substrate in the display area. The display wires are electrically connected to the light-controlling elements. Bezel wires are disposed in, on, or over the display substrate in the bezel area, the bezel wires electrically connected to respective ones of the display wires. A bezel transparency in the bezel area is greater than or equal to a display transparency in the display area.

公开(公告)号：US10396238B2

公开(公告)日：2019-08-27

申请号：US16137809

申请日：2018-09-21

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Carl Prevatte ,  Salvatore Bonafede

IPC: H01L21/30 ,  H01L21/46 ,  H01L21/00 ,  H01L33/00 ,  H01L33/20 ,  H01L33/40 ,  H01L33/26 ,  H01L29/78 ,  H01L21/683 ,  H01L33/32 ,  H01L33/62 ,  H01L33/38 ,  H01L33/36 ,  H01L33/44

Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

公开(公告)号：US10380930B2

公开(公告)日：2019-08-13

申请号：US14834042

申请日：2015-08-24

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Christopher Bower ,  Matthew Meitl

IPC: G09G5/02 ,  G09G3/20 ,  G09G3/3208 ,  H01L27/32

Abstract: A heterogeneous light-emitter display includes a display substrate having a plurality of pixels disposed thereon. Each pixel including at least a first heterogeneous multiple-component sub-pixel emitting a first color of light and a second sub-pixel emitting a second color of light different from the first color. A heterogeneous light-emitter display can also include an array of heterogeneous pixels. Each heterogeneous pixel includes a plurality of first pixels and a plurality of second pixels. The first sub-pixel of each of the first pixels includes a first light emitter and the first sub-pixel of each of the second pixels includes a second light emitter different from the first light emitter. One or more pixel controllers control the pixels, the first and second pixels, the first and second sub-pixels, and the first and second light emitters.

公开(公告)号：US20190123719A1

公开(公告)日：2019-04-25

申请号：US16226805

申请日：2018-12-20

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  Ronald S. Cok

IPC: H03H9/64 ,  H03H9/56 ,  H03H9/02 ,  H03H9/05 ,  H03H3/02 ,  H03H9/54 ,  H03H3/08

Abstract: A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.

公开(公告)号：US10230048B2

公开(公告)日：2019-03-12

申请号：US14869369

申请日：2015-09-29

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  Ronald S. Cok

IPC: H01L51/00 ,  H01L51/52 ,  H01L51/56 ,  H01L27/32

Abstract: An organic light-emitting diode (OLED) structure includes an organic light-emitting diode having a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material. At least a portion of a tether extending from a periphery of the organic light-emitting diode. The organic light-emitting diodes can be printable organic light-emitting diode structures that are micro transfer printed over a display substrate to form a display.

公开(公告)号：US10224460B2

公开(公告)日：2019-03-05

申请号：US14743788

申请日：2015-06-18

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L33/00 ,  H01L29/18 ,  H01L33/38 ,  G09G3/32 ,  H01L23/482 ,  H01L23/538 ,  H01L25/075 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  H05B33/08 ,  G02B26/04 ,  G02F1/167 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  G09G3/22 ,  H01L27/15 ,  F21K99/00 ,  F21V9/08 ,  H01L33/58 ,  H01L33/20 ,  H01L33/40 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y113/13 ,  F21Y101/02 ,  F21Y105/00

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US10222698B2

公开(公告)日：2019-03-05

申请号：US15662214

申请日：2017-07-27

Applicant: X-Celeprint Limited

Inventor： Carl Prevatte ,  Christopher Bower ,  Matthew Meitl

IPC: H01L23/00 ,  G03F7/20 ,  H05K3/30

Abstract: A printable component includes a component substrate and one or more electrical conductors. One or more electrically conductive connection posts protrudes from the component substrate to form an exposed electrical contact. Each connection post is electrically connected to at least one of the electrical conductors and one or more wicking posts protrude from the component substrate. The wicking post can be insulating. In certain embodiments, a printable component source wafer comprises a source wafer, a plurality of sacrificial portions separated by anchor portions formed in a sacrificial layer of the source wafer, and a plurality of printable components. Each printable component is disposed over a corresponding sacrificial portion and connected to an anchor portion by a tether. A destination substrate structure comprises a destination substrate having one or more electrically conductive contact pads, an adhesive layer disposed on the destination substrate, and one or more printable components.