公开(公告)号：US5324686A

公开(公告)日：1994-06-28

申请号：US959457

申请日：1992-10-09

申请人： Yoshitaka Tsunashima

发明人： Yoshitaka Tsunashima

IPC分类号： H01L21/22 ,  H01L21/225 ,  H01L21/318 ,  H01L21/334 ,  H01L21/336 ,  H01L29/78

CPC分类号： H01L29/66181 ,  H01L21/2225 ,  H01L21/2255 ,  H01L21/3185 ,  H01L29/6659 ,  H01L29/78

摘要： A method of manufacturing a semiconductor device, which comprises the steps of forming a solid phase diffusion source containing a conductive impurity on a surface of a semiconductor substrate, said impurity serving to enable said semiconductor substrate to exhibit a p-type or n-type conductivity, allowing said solid phase diffusion source to contain a diffusion control substance serving to reduce or oxidize said conductive impurity upon heating so as to change the diffusion coefficient of the conductive impurity contained in the solid phase diffusion source, and thermally diffusing the conductive impurity from the solid phase diffusion source into the semiconductor substrate.

摘要翻译： 一种制造半导体器件的方法，包括以下步骤：在半导体衬底的表面上形成含有导电杂质的固相扩散源，所述杂质用于使得所述半导体衬底能够显示p型或n型导电性 允许所述固相扩散源包含用于在加热时减少或氧化所述导电杂质的扩散控制物质，以便改变固相扩散源中所含的导电杂质的扩散系数，并将导电杂质从 固相扩散源进入半导体衬底。

公开(公告)号：US4791074A

公开(公告)日：1988-12-13

申请号：US073473

申请日：1987-07-15

申请人： Yoshitaka Tsunashima ,  Keisaku Yamada ,  Takako Kashio

发明人： Yoshitaka Tsunashima ,  Keisaku Yamada ,  Takako Kashio

IPC分类号： H01L21/225 ,  H01L21/385

CPC分类号： H01L21/2254 ,  Y10S148/158

摘要： According to the present invention, a method of manufacturing a semiconductor apparatus is provided which comprises the steps of (a) depositing a boron layer on a silicon substrate, and (b) thermally diffusing boron from said boron layer into said silicon substrate. The present invention, which is characteristically based on the solid phase diffusion process, enables even a thin layer to be deposited. Further, unlike the ion implantation process, the present invention enables an impurity to be uniformly diffused even into an inclined plane. Unlike the case where boron-containing glass is used as a diffusion source, the invention enables a sufficient amount of boron to be diffused even at a temperature lower than 1000.degree. C.

摘要翻译： 根据本发明，提供一种制造半导体器件的方法，其包括以下步骤：（a）在硅衬底上沉积硼层，和（b）将硼从所述硼层热扩散到所述硅衬底中。 本发明特征在于基于固相扩散工艺，甚至能够沉积薄层。 此外，与离子注入工艺不同，本发明使得杂质均匀均匀地扩散到倾斜平面中。 与使用含硼玻璃作为扩散源的情况不同，本发明即使在低于1000℃的温度下也能够使足量的硼扩散。

公开(公告)号：US07507634B2

公开(公告)日：2009-03-24

申请号：US11812490

申请日：2007-06-19

申请人： Tsutomu Sato ,  Mie Matsuo ,  Ichiro Mizushima ,  Yoshitaka Tsunashima ,  Shinichi Takagi

发明人： Tsutomu Sato ,  Mie Matsuo ,  Ichiro Mizushima ,  Yoshitaka Tsunashima ,  Shinichi Takagi

IPC分类号： H01L21/764 ,  H01L27/12

CPC分类号： H01L27/10805 ,  B82Y20/00 ,  G02B6/122 ,  G02B6/1225 ,  G02B2006/12097 ,  H01L21/3247 ,  H01L21/7624 ,  H01L21/76283 ,  H01L21/76289 ,  H01L21/764 ,  H01L21/84 ,  H01L27/10894 ,  H01L27/10897 ,  H01L27/12 ,  H01L27/1203 ,  H01L29/0657 ,  H01L29/7842 ,  H01L29/78603 ,  H01L29/78639

摘要： To change a plurality of trenches to one flat empty space by two-dimensionally forming the trenches on the surface of a semiconductor substrate and then applying heat treatment to the semiconductor substrate.

摘要翻译： 通过在半导体衬底的表面上二维地形成沟槽，然后对半导体衬底进行热处理，将多个沟槽改变为一个平坦的空间。

公开(公告)号：US07235456B2

公开(公告)日：2007-06-26

申请号：US11340594

申请日：2006-01-27

申请人： Tsutomu Sato ,  Mie Matsuo ,  Ichiro Mizushima ,  Yoshitaka Tsunashima ,  Shinichi Takagi

发明人： Tsutomu Sato ,  Mie Matsuo ,  Ichiro Mizushima ,  Yoshitaka Tsunashima ,  Shinichi Takagi

IPC分类号： H01L21/764 ,  H01L27/12

CPC分类号： H01L27/10805 ,  B82Y20/00 ,  G02B6/122 ,  G02B6/1225 ,  G02B2006/12097 ,  H01L21/3247 ,  H01L21/7624 ,  H01L21/76283 ,  H01L21/76289 ,  H01L21/764 ,  H01L21/84 ,  H01L27/10894 ,  H01L27/10897 ,  H01L27/12 ,  H01L27/1203 ,  H01L29/0657 ,  H01L29/7842 ,  H01L29/78603 ,  H01L29/78639

摘要： To change a plurality of trenches to one flat empty space by two-dimensionally forming the trenches on the surface of a semiconductor substrate and then applying heat treatment to the semiconductor substrate.

摘要翻译： 通过在半导体衬底的表面上二维地形成沟槽，然后对半导体衬底进行热处理，将多个沟槽改变为一个平坦的空间。

公开(公告)号：US07019364B1

公开(公告)日：2006-03-28

申请号：US09650748

申请日：2000-08-30

申请人： Tsutomu Sato ,  Mie Matsuo ,  Ichiro Mizushima ,  Yoshitaka Tsunashima ,  Shinichi Takagi

发明人： Tsutomu Sato ,  Mie Matsuo ,  Ichiro Mizushima ,  Yoshitaka Tsunashima ,  Shinichi Takagi

IPC分类号： H01L27/12

CPC分类号： H01L27/10805 ,  B82Y20/00 ,  G02B6/122 ,  G02B6/1225 ,  G02B2006/12097 ,  H01L21/3247 ,  H01L21/7624 ,  H01L21/76283 ,  H01L21/76289 ,  H01L21/764 ,  H01L21/84 ,  H01L27/10894 ,  H01L27/10897 ,  H01L27/12 ,  H01L27/1203 ,  H01L29/0657 ,  H01L29/7842 ,  H01L29/78603 ,  H01L29/78639

摘要： To change a plurality of trenches to one flat empty space by two-dimensionally forming the trenches on the surface of a semiconductor substrate and then applying heat treatment to the semiconductor substrate.

摘要翻译： 通过在半导体衬底的表面上二维地形成沟槽，然后对半导体衬底进行热处理，将多个沟槽改变为一个平坦的空间。

公开(公告)号：US06989281B2

公开(公告)日：2006-01-24

申请号：US10957609

申请日：2004-10-05

申请人： Akihito Yamamoto ,  Takashi Nakao ,  Yuuichi Mikata ,  Yoshitaka Tsunashima

发明人： Akihito Yamamoto ,  Takashi Nakao ,  Yuuichi Mikata ,  Yoshitaka Tsunashima

IPC分类号： H01L21/00

CPC分类号： H01L21/67253

摘要： A cleaning method for a semiconductor device manufacturing apparatus includes a process of forming a film on a subject piece in a processing chamber, applying light having a predetermined wavelength to a monitoring section to indirectly monitor a thickness of a film formed on the subject piece, introducing cleaning gas capable of removing a substance deposited on the monitoring section into the processing chamber, measuring a reflection light which is the application light reflected near the monitoring section, measuring an amount of a substance corresponding to a thickness of a film deposited on the monitoring section based on a measurement result of the reflection light; and introducing, into the processing chamber, a cleaning gas which can remove the substance on the monitoring section until a measurement value of the amount of the substance on the monitoring section becomes zero.

摘要翻译： 半导体器件制造装置的清洁方法包括在处理室中的被检体上形成膜的处理，将具有预定波长的光施加到监视部分，以间接监视形成在被检体上的膜的厚度，引入 清除气体，其能够将沉积在监测部分上的物质去除到处理室中，测量作为在监测部分附近反射的应用光的反射光，测量与沉积在监测部分上的膜的厚度相对应的物质的量 基于反射光的测量结果; 并且在所述处理室内引入能够去除所述监测部件上的物质直到所述监测部件上的物质的量的测量值变为零的清洁气体。

公开(公告)号：US06713359B1

公开(公告)日：2004-03-30

申请号：US09564191

申请日：2000-05-04

申请人： Ichiro Mizushima ,  Shigehiko Saida ,  Takeo Furuhata ,  Yoshitaka Tsunashima

发明人： Ichiro Mizushima ,  Shigehiko Saida ,  Takeo Furuhata ,  Yoshitaka Tsunashima

IPC分类号： H01L21336

CPC分类号： H01L29/66477 ,  H01L21/28052 ,  H01L29/41775 ,  H01L29/41783 ,  H01L29/456 ,  H01L29/665

摘要： SiGe or SiC films are selectively grown on source/drain regions, followed by selectively growing silicon. A monocrystalline film having a high dislocation density or a polycrystalline film can be grown in growing the silicon film by making the C or Ge concentration higher than a predetermined level. The silicon layer on each of the source/drain regions is not monocrystalline or, even if monocrystalline, has a high density of dislocation. Therefore, the silicon film formed thereon is in the form of a monocrystalline silicon film having a high dislocation density or a polycrystalline silicon film. It is possible to suppress an impurity diffusion to reach a deep region caused by channeling of ions generated in the doping step by means of an ion implantation.

摘要翻译： SiGe或SiC膜选择性地在源极/漏极区域上生长，随后选择性地生长硅。 通过使C或Ge浓度高于预定水平，可以在生长硅膜时生长具有高位错密度的单晶膜或多晶膜。 源极/漏极区域中的每一个上的硅层不是单晶的，即使单晶也具有高密度的位错。 因此，其上形成的硅膜是具有高位错密度的单晶硅膜或多晶硅膜的形式。 可以通过离子注入来抑制在掺杂步骤中产生的离子的沟道引起的深度区域的杂质扩散。

公开(公告)号：US06600189B1

公开(公告)日：2003-07-29

申请号：US09598379

申请日：2000-06-21

申请人： Tsutomu Sato ,  Ichiro Mizushima ,  Yoshitaka Tsunashima ,  Junichiro Iba

发明人： Tsutomu Sato ,  Ichiro Mizushima ,  Yoshitaka Tsunashima ,  Junichiro Iba

IPC分类号： H01L27108

CPC分类号： H01L27/1087 ,  H01L28/84 ,  Y10S438/909

摘要： A semiconductor device includes a semiconductor substrate having a trench on a surface thereof and an embedding member embedding the interior of the trench therewith. While the section of the trench when cut by a first plane perpendicular to the direction of the depth of the trench is defined as a first section and the section of the trench when cut by a second plane perpendicular to the direction of the depth of the trench and closer to the bottom of the trench than the first plane is defined as a second section, the area of the first section is smaller than that of the second section and a minimum radius of curvature of the first section is smaller than a minimum radius of curvature of the second section. As a result, it is possible to lessen the concentration of the electric field into the bottom of the trench.

摘要翻译： 半导体器件包括在其表面上具有沟槽的半导体衬底和嵌入沟槽内部的嵌入构件。 虽然当垂直于沟槽深度方向的第一平面切割沟槽的部分被定义为第一部分，并且当垂直于沟槽深度方向的第二平面切割沟槽的部分时 并且比所述第一平面更靠近所述沟槽的底部被限定为第二部分，所述第一部分的面积小于所述第二部分的面积，并且所述第一部分的最小曲率半径小于所述第一部分的最小半径 第二部分的曲率。 结果，可以减小进入沟槽底部的电场的浓度。

公开(公告)号：US06570217B1

公开(公告)日：2003-05-27

申请号：US09296669

申请日：1999-04-22

申请人： Tsutomu Sato ,  Ichiro Mizushima ,  Yoshitaka Tsunashima ,  Toshihiko Iinuma ,  Kiyotaka Miyano

发明人： Tsutomu Sato ,  Ichiro Mizushima ,  Yoshitaka Tsunashima ,  Toshihiko Iinuma ,  Kiyotaka Miyano

IPC分类号： H01L2926

CPC分类号： H01L29/66583 ,  H01L21/324 ,  H01L21/76229 ,  H01L21/76232 ,  H01L29/0649 ,  H01L29/0653 ,  H01L29/0657 ,  H01L29/42356 ,  H01L29/66651 ,  H01L29/78 ,  H01L29/7831 ,  H01L29/78639

摘要： To provide a cavity in the portion of the silicon substrate which lies beneath the channel region of the MOS transistor.

公开(公告)号：US06313047B2

公开(公告)日：2001-11-06

申请号：US09811451

申请日：2001-03-20

申请人： Kazuhide Hasebe ,  Yuichiro Morozumi ,  Dong-Kyun Choi ,  Takuya Sugawara ,  Seiji Inumiya ,  Yoshitaka Tsunashima

发明人： Kazuhide Hasebe ,  Yuichiro Morozumi ,  Dong-Kyun Choi ,  Takuya Sugawara ,  Seiji Inumiya ,  Yoshitaka Tsunashima

IPC分类号： H01L2131

CPC分类号： H01L21/02183 ,  C23C16/0272 ,  C23C16/405 ,  H01L21/02271 ,  H01L21/31604

摘要： Disclosed is an MOCVD method of forming a tantalum oxide film. First, water vapor used as an oxidizing agent is supplied into a process container to cause moisture to be adsorbed on a surface of each semiconductor wafer. Then, PET gas used as a raw material gas is supplied into the process container and is caused to react with the moisture on the wafer at a process temperature of 200° C., thereby forming an interface layer of tantalum oxide. Then, PET gas and oxygen gas are supplied into the process container at the same time, and are caused to react with each other at a process temperature of 410° C., thereby forming a main layer of tantalum oxide on the interface layer.

摘要翻译： 公开了一种形成氧化钽膜的MOCVD方法。 首先，将作为氧化剂使用的水蒸气供给到处理容器中，使得水分吸附在各半导体晶片的表面上。 然后，将作为原料气体使用的PET气体供给到处理容器中，并在200℃的处理温度下与晶片上的水分反应，由此形成氧化钽界面层。 然后，将PET气体和氧气同时供给到处理容器中，并在410℃的处理温度下彼此反应，从而在界面层上形成氧化钽的主层。