Abstract:
A microelectromechanical system (MEMS) strain gauge includes at least one flexible arm that can be caused to oscillate. Transverse strain on the arm changes the resonant frequency of the arm, providing an indication of the transverse strain of the substrate.
Abstract:
Described are various improved methods of forming stable metallization for electronic devices, electromechanical devices, force-sensing devices and accelerometers. Also described are various improved electronic devices, electromechanical devices, force-sensing devices, and accelerometers.
Abstract:
A method of forming a thin film metallization layer having a predetermined residual stress and a predetermined sheet resistance and force measuring devices formed using the methods.
Abstract:
A stress is detected by the utilization of a semiconductor equipped with a beam oscillator which is driven to generate a compound oscillation comprising a plurality of component oscillations with different component frequencies through the steps of detecting separately component amplitudes of the compound oscillation for the respective component frequencies, standardizing power spectra of the component amplitudes with theoretically obtained reference power spectra respectively, and determining a stress generated in the beam oscillator based on a mean stress value of stress values for the standardized power spectra from relations between power spectrum and stress value previously provided for the respective component amplitudes.
Abstract:
A reactionless single beam vibrating force transducer utilizes counterbalances at opposite ends of the beam that rotate in directions opposite to the ends of the vibrating beam to reduce rotational and normal forces transmitted to the end supports for the beam. The proportions of the counterbalances relative to the size of the beam may be chosen to reduce forces in a direction normal to the beam to zero at the expense of some rotational moments at the end of the beam support, or to reduce moments at the expense of some normal force. The relative amounts of residual rotational moments and normal force can be adjusted to suit particular applications. Flexures may also be utilized to reduce the rotational moments transferred to the beam support even further.
Abstract:
A resonant strain gauge includes a silicon substrate, a polysilicon flexure beam fixed at both ends relative to the substrate, and a polysilicon rigid cover cooperating with the substrate to enclose the flexure beam within a sealed vacuum chamber. An upper bias electrode is formed on the cover, and a lower bias electrode is formed at the bottom of a trough in the substrate directly beneath the flexure beam. A drive electrode and a piezoresistive element are supported by the beam, formed over a silicon nitride thin film layer deposited onto the top surface of the flexure beam. A second silicon nitride layer covers the drive electrode and piezoresistor, cooperating with the first silicon nitride layer to dielectrically encapsulate the drive electrode and piezoresistor. The silicon nitride further extends outwardly of the beam to a location between the polysilicon layer that contains the beam, and the cover, to isolate the cover from the flexure beam. A polysilicon film is applied over the upper silicon nitride layer as a passivation layer to protect the silicon nitride during gauge fabrication. The process for fabricating the gauge includes a sequence of applying the various polysilicon and silicon nitride layers by low pressure chemical vapor deposition, in combination with selective etching to define the flexure beam, electric circuit components and vacuum chamber.
Abstract:
A vibrating beam force transducer that can be realized in a silicon micromachined device such as a micromachined accelerometer. The transducer includes a beam having a longitudinal axis, and a drive circuit electrically coupled to the beam for causing the beam to oscillate at a resonant frequency that is a function of a force applied along the longitudinal beam axis. The drive circuit provides an electrical current to the beam, and the beam, or a conductive portion thereof, conducts the current along a path that includes an axial component parallel to the longitudinal axis. A magnetic field is created intersecting the axial component, such that the electric current interacts with the magnetic field to produce a force that causes the beam to oscillate at the resonant frequency. In a preferred embodiment, the transducer has a double ended tuning fork configuration, and the current path extends along one beam and back along the other beam.
Abstract:
An electro-mechanical load sensor is in the form of a mechanical resonant system with electrostatically coupled electrodes. The mechanical system is formed from a silicon wafer by a selective etching process and comprises a filament of between two terminations 12 and 13 carrying transverse plates M.sub.1 and M.sub.2. Electrostatic (capacitive) coupling to plate electrodes E.sub.1, E.sub.2, E.sub.3 in a self-exciting circuit drives the system. The resonant frequency for angular S vibrations with plates M.sub.1 and M.sub.2 in anti-phase varies with applied load L and is thus a measure of this load.