公开(公告)号：US20020173227A1

公开(公告)日：2002-11-21

申请号：US10097294

申请日：2002-03-14

Inventor： Chuck Fai Lam ,  Kenneth R. Martin ,  Charles A. Gibson

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/013 ,  B24B37/048 ,  B24B49/04 ,  B24B49/10 ,  G11B5/1871 ,  G11B5/3103 ,  G11B5/3116 ,  G11B5/3166 ,  G11B5/3173 ,  G11B5/3948 ,  G11B5/3967 ,  Y10T29/49037

Abstract: A magnetic head cluster is provided along with a method of making a magnetic head cluster. The magnetic head cluster comprises a substrate having a plurality of magnetoresistive (MR) read and inductive magnetic write transducers and a plurality of terminals formed thereon. A plurality of lapping guides are also provided on the substrate between adjacent transducers.

Abstract translation: 提供磁头簇以及制造磁头簇的方法。 磁头簇包括具有多个磁阻（MR）读和磁性写磁换能器以及形成在其上的多个端子的衬底。 在相邻换能器之间的基板上还设置有多个研磨引导件。

公开(公告)号：US20020173226A1

公开(公告)日：2002-11-21

申请号：US10087293

申请日：2002-02-28

Inventor： Glen A. Carlson III

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B25J15/0019 ,  B23B5/02 ,  B23Q5/043 ,  B24B27/0061 ,  B24B29/00 ,  B24B41/04 ,  B25J11/0065

Abstract: A multi-spindle end effector is provided for a multiple axis robot. The multi-spindle end effector includes a plate housing having at least a pair of spaced-apart spindles mounted thereon. A servo-motor drivingly engages the spindles. A gear box steps down the RPMs of the motor to the desired RPM of the object to be rotated. A timing belt, which may be continuous, interlinks the first and second spindles so that the rotation of first spindle matches the rotation of the second spindle. An idler pulley may be employed to properly tension the belt.

Abstract translation: 为多轴机器人提供多主轴端部执行器。 多主轴端部执行器包括板壳体，其具有安装在其上的至少一对间隔开的主轴。 伺服电机驱动地接合主轴。 齿轮箱将马达的RPM降低到要旋转的物体的所需RPM。 可以是连续的同步皮带将第一和第二主轴互连，使得第一主轴的旋转与第二主轴的旋转相匹配。 可以采用惰轮来适当地张紧皮带。

公开(公告)号：US20020173222A1

公开(公告)日：2002-11-21

申请号：US09844407

申请日：2001-04-27

Applicant: International Business Machines Corporation

Inventor： Frederick P. Benning ,  Douglas Allan Kuchta ,  Steven L. Maynard ,  Jon Edward Podolske

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B37/08

Abstract: Disk substrates are polished in a process which uses a single load of the disks to a polishing apparatus and a single polishing slurry. Preferably, the process varies at least one polishing parameter at multiple stages to achieve both a reasonable rate of removal during one stage and a smooth finished surface during another stage. Preferably, a fine grit cerium oxide slurry is used, along with a polishing pad having surface characteristics intermediate those of relatively hard pads typically used for material removal, and of relatively soft pads typically used for fine finishing. The polisher operates at high pressure and speed during a material removal stage, and then reduces speed and pressure during a finishing stage to achieve a suitable surface finish, without removing and cleaning disks between the two stages.

Abstract translation: 在将抛光装置和单个抛光浆料使用单个载荷盘的过程中对盘基材进行抛光。 优选地，该过程在多个阶段改变至少一个抛光参数，以在另一阶段期间实现在一个阶段期间合理的去除速率和平滑的成品表面。 优选地，使用细小的氧化铈浆料，以及具有与通常用于除去材料的相对硬的垫片相比具有中间体的抛光垫以及通常用于精加工的相对软的垫片。 抛光机在材料去除阶段以高压和高速运行，然后在精加工阶段降低速度和压力，以达到合适的表面光洁度，而无需拆卸和清洁两台之间的盘片。

公开(公告)号：US20020168920A1

公开(公告)日：2002-11-14

申请号：US10103150

申请日：2002-03-21

Applicant: Loh Optikmaschinen AG

Inventor： Steffen Wallendorf ,  Holger Schafer

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B9/148 ,  B24B9/14 ,  B24B41/00 ,  B24B47/22 ,  B24B47/225

Abstract: A device is disclosed for edge-machining an optical lens, clampable between two aligned holding shafts rotatable about the rotational axis of a workpiece, having a Z slide, which is guided longitudinally displaceably on a base frame in a Z direction parallel to the rotational axis of the workpiece, and an X slide bearing a tool post with an edge-machining tool, which is guided longitudinally displaceably on the Z slide in an X direction perpendicular to the Z direction in such a way that the edge-machining tool may be brought into machining engagement with the optical lens. For industrial use, the base frame is of substantially O-shaped construction and surrounds the Z slide, wherein the Z slide is likewise of substantially O-shaped construction and surrounds the X slide. In addition or as an alternative thereto, provision is made for an additional machining means to be fixed to the X slide, which means comprises at least one further edge-machining tool, which may be moved from a parked position into a machining position between the lens and the edge-machining tool on the tool post.

Abstract translation: 公开了一种用于边缘加工光学透镜的装置，可夹持在可绕工件的旋转轴线旋转的两个对准的保持轴之间，具有Z滑块，该Z滑块在平行于旋转轴线的Z方向上在基架上纵向移位 以及X轴滑动件，其具有带有边缘加工工具的刀架，该刀架在Z滑块上沿与Z方向垂直的X方向纵向可移位地被引导，使得边缘加工工具可以被带入 与光学透镜进行加工接合。 对于工业用途，基架基本上为O形结构并且围绕Z滑块，其中Z滑块同样具有大致O形结构并且围绕X滑块。 另外，作为替代方案，还提供了一种固定在X滑块上的附加加工装置，该装置包括至少一个另外的边缘加工工具，其可以从停放位置移动到 镜头和刀头上的边缘加工工具。

公开(公告)号：US20020160696A1

公开(公告)日：2002-10-31

申请号：US10134513

申请日：2002-04-30

Inventor： Noburu Shimizu ,  Norio Kimura

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B37/26 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/042 ,  B24B37/105 ,  B24B37/12 ,  B24B37/16 ,  B24B37/245 ,  B24B37/345 ,  H01L21/30625 ,  H01L21/67173 ,  H01L21/67219 ,  H01L21/68785 ,  H01L21/68792

Abstract: A workpiece such as a semiconductor wafer is polished by pressing the workpiece against a polishing surface under a predetermined pressure. A polished surface of the workpiece is processed by pressing the workpiece against a processing surface under a predetermined pressure while the processing surface makes circulatory translational motion along a predetermined path. The processing surface comprises a surface of a polishing cloth or a surface of an abrading plate, and the polished surface of the workpiece is further polished or cleaned.

Abstract translation: 通过在预定压力下将工件压靠在抛光表面上来对诸如半导体晶片的工件进行抛光。 通过在预定压力下将工件压靠在处理表面上，同时处理表面沿着预定路径进行循环平移运动来处理工件的抛光表面。 处理表面包括抛光布的表面或研磨板的表面，并且进一步抛光或清洁工件的抛光表面。

公开(公告)号：US20020137431A1

公开(公告)日：2002-09-26

申请号：US09992568

申请日：2001-11-17

Inventor： Michael A. Labunsky ,  Guangwei Wu

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00 ,  B24D011/00

CPC classification number: B24B37/205 ,  B24B37/042 ,  B24B49/12

Abstract: A pad for processing substrates such as a pad for CMP and methods of using the pad: the pad is capable of allowing the substrate to be optically monitored during the process. In one embodiment, at least a portion of the pad includes an optical filter for attenuating optical noise so that optical signals used for monitoring the substrate provide a more accurate representation of the process status. The optical filter is capable of transmitting the optical signal while reducing the amount of optical noise. In another embodiment, the surface of the filter is recessed from the polishing surface of the pad so that the filter surface is subjected to less abrasion during polishing processes and during pad conditioning.

Abstract translation: 用于处理诸如用于CMP的衬垫的衬底的衬垫以及使用衬垫的方法：衬垫能够在该过程期间光学地监测衬底。 在一个实施例中，焊盘的至少一部分包括用于衰减光学噪声的光学滤波器，使得用于监测衬底的光学信号提供对工艺状态的更准确的表示。 滤光器能够在减少光学噪声的量的同时发送光信号。 在另一个实施例中，过滤器的表面从衬垫的抛光表面凹陷，使得过滤器表面在抛光过程中和在衬垫调节期间经受较少磨损。

公开(公告)号：US20020132559A1

公开(公告)日：2002-09-19

申请号：US10097568

申请日：2002-03-15

Inventor： Tetsuji Togawa

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B37/30 ,  B24B47/06 ,  B24B49/16 ,  B24B53/017

Abstract: A polishing apparatus for polishing a substrate comprises a polishing table having a polishing surface, and a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against the polishing surface. The substrate holding apparatus comprises a vertically movable top ring body for holding a substrate, and a fluid supply source for supplying a fluid under a positive pressure or a negative pressure to a hermetically sealed chamber which is defined in the top ring body to control the pressure under which the substrate is pressed against the polishing surface. The substrate holding apparatus further comprises a measuring device disposed in a fluid passage interconnecting the hermetically sealed chamber and the fluid supply source for measuring a flow rate of the fluid in the fluid passage.

Abstract translation: 用于抛光基板的抛光装置包括具有抛光表面的抛光台和用于保持要抛光的基板并将基板压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的可垂直移动的顶环体，以及用于将正压或负压下的流体供应到限定在顶环体中的气密密封室的流体供给源，以控制压力 衬底被压在抛光表面上。 基板保持装置还包括设置在将气密密封室和流体供应源互连的流体通道中的测量装置，用于测量流体通道中流体的流量。

公开(公告)号：US20020119731A1

公开(公告)日：2002-08-29

申请号：US09935067

申请日：2001-08-21

Inventor： Jim Hofmann

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B37/013 ,  B24B49/04 ,  B24B49/12

Abstract: Planarizing machines and methods for endpointing or otherwise controlling mechanical and/or chemical-mechanical planarization of microelectronic-device substrates. In one embodiment of the invention, a method for planarizing a microelectronic substrate assembly includes removing material from the substrate assembly during a planarizing cycle by contacting the substrate assembly with a planarizing medium and moving the substrate assembly and/or the planarizing medium relative to each other. The method can also include controlling the planarizing cycle by predicting a thickness of an outer film over a first region on the substrate assembly and providing an estimate of an erosion rate ratio between the first region and a second region. The endpointing procedure continues by determining an estimated value of an output factor, such as a reflectance intensity from the substrate assembly, by modeling the output factor based upon the thickness of the outer film over the first region and the erosion rate ratio between the first region and the second region. The endpointing procedure continues by ascertaining an updated predicted thickness of the outer film over the first region by measuring an actual value of the output factor during the planarizing cycle without interrupting removal of material from the substrate, and then updating the predicted thickness of the outer film according to the actual value of the output factor and the estimated value of the output factor. The updated predicted thickness can be determined using an Extended Kalman Filter. The planarizing process is controlled according to the updated predicted thickness of the outer film.

Abstract translation: 用于终点或以其他方式控制微电子器件衬底的机械和/或化学机械平面化的平面化机器和方法。 在本发明的一个实施例中，用于平坦化微电子衬底组件的方法包括在平坦化循环期间通过使衬底组件与平坦化介质接触并且相对于彼此移动衬底组件和/或平坦化介质来从衬底组件移除材料 。 该方法还可以包括通过预测衬底组件上的第一区域上的外部膜的厚度来控制平坦化循环，并且提供第一区域和第二区域之间的侵蚀速率比的估计。 通过基于第一区域上的外部膜的厚度和第一区域之间的侵蚀速率比建模输出因子，确定输出因子的估计值，例如来自基板组件的反射强度， 和第二个地区。 通过在平坦化循环期间测量输出因子的实际值而不中断材料从衬底去除，然后更新外部膜的预测厚度，继续确定第一区域上外部膜的更新预测厚度 根据输出因子的实际值和输出因子的估计值。 可以使用扩展卡尔曼滤波器来确定更新的预测厚度。 根据外膜的更新预测厚度来控制平坦化处理。

公开(公告)号：US20020115384A1

公开(公告)日：2002-08-22

申请号：US10115675

申请日：2002-04-04

Applicant: Micron Technology, Inc.

Inventor： Dinesh Chopra ,  Gundu Sabde

IPC: B24B051/00 ,  B24B049/00

CPC classification number: B24B37/0056 ,  B24B9/065 ,  B24B37/042 ,  C09K13/00 ,  C09K13/04 ,  C09K13/06 ,  H01L21/3212 ,  H01L21/7684 ,  Y10T29/49156

Abstract: Planarizing solutions, and their methods of use, for removing titanium nitride from the surface of a substrate using a fixed-abrasive planarizing pad. The planarizing solutions take the form of an etchant solution or an oxidizing solution. The etchant solutions are aqueous solutions containing an etchant and a buffer. The etchant contains one or more etching agents selective to titanium nitride. The oxidizing solutions are aqueous solutions containing an oxidizer and a buffer. The oxidizer contains one or more oxidizing agents selective to titanium nitride. In either solution, i.e., etchant or oxidizing solution, the buffer contains one or more buffering agents. Titanium nitride layers planarized in accordance with the invention may be utilized in the production of integrated circuits, and various apparatus utilizing such integrated circuits.

公开(公告)号：US20020094766A1

公开(公告)日：2002-07-18

申请号：US10091700

申请日：2002-03-04

Inventor： Steven M. Zuniga ,  Ming-Kuei Tseng

IPC: B24B049/00 ,  B24B051/00 ,  B24B041/06

CPC classification number: B24B37/30 ,  B24B37/0053 ,  B24B49/00 ,  H01L21/681

Abstract: A carrier head for a chemical mechanical polishing system includes a flexible membrane with a substrate receiving surface, a sensor mechanism to determine if a substrate is properly attached to the carrier head, and means for preventing fluid that may be located between the substrate and the flexible membrane from interfering with the substrate detection mechanism.