摘要:
A slider includes a transducer including a magnetic structure having a front edge and a back edge. The slider further includes an electronic lapping guide (ELG) substantially coplanar with the magnetic structure and having a top edge and a bottom edge. The slider further includes a plurality of pads configured to calibrate a sheet resistance of the ELG and an offset of the ELG.
摘要:
A method for fabricating an optical assembly by placing a flexible portion of a substrate, including a waveguide, upon a horizontally movable stage of a flip-chip bonder. Then moving a clamp through an opening in the stage to bend the flexible portion of the substrate to place the waveguide exposed end in approximately a vertical position and vertically downwardly moving a bond head containing an optical component upon the waveguide exposed substrate edge to position the optical component with the exposed waveguide and mounting the optical component to the substrate edge. Then releasing the optical component from the bond head while moving the clamp downward through the stage opening and unbending the flexible portion of the substrate with the optical component mounted thereon.
摘要:
A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.
摘要:
A method and system for providing transducer(s) including a disk structure and having an air-bearing surface (ABS) are described. The disk structure resides a distance from the ABS and has a disk dimension substantially perpendicular to the ABS. Lapping control and disk windage ELGs are provided. The lapping control ELG has first and second edges first and second distances from the ABS. The disk windage ELG has edges different distances from the ABS. A difference between these edges corresponds to the disk dimension. A windage resistance of the disk windage ELG is measured and a disk windage determined. The disk windage corresponds to a difference between designed and actual disk dimensions perpendicular to the ABS. A lapping ELG target resistance is determined based on the disk windage. The transducer is lapped. Lapping is terminated based on a resistance of the lapping control ELG and the lapping ELG target resistance.
摘要:
The method according to the present invention includes the steps of: sequentially applying a plurality of different voltages to an MR element and sequentially detecting output signals from the MR element; and eliminating the MR element as a defective product when an evaluation value, based on a difference of SN ratios of the output signals from the MR element respectively obtained for each applied voltage, is less than a threshold value, and selecting the MR element as a non-defective product when the evaluation value is greater than or equal to the threshold value.
摘要:
In one embodiment, a magnetic head includes a magnetoresistive free layer, wherein a width of the free layer nearest an air bearing surface (ABS) is less than a width of the free layer at a point away from the ABS in a track width direction, with the magnetic head being configured to pass a sense current in a direction perpendicular to a plane of deposition of the free layer. In another embodiment, a method includes forming a magnetoresistive film above a shield, forming a masking layer above the magnetoresistive film, patterning the masking layer such that it exposes portions of the magnetoresistive film, wherein the masking layer defines an area which is narrow near an area that forms an ABS side of a free layer and wider at an area away from the ABS, and removing the exposed portions of the magnetoresistive film to form the free layer.
摘要:
A flexure metal plate includes distal and proximal end side-center-support plate forming regions that are positioned on distal and proximal sides within an open section. To a distal end section of a supporting part that is positioned on a distal side of the open section, first and second-distal side-metal plates are fixed so as to be positioned on an outer side of the distal end side-center-support plate forming region in a width direction, and to a proximal end section of the supporting part that is positioned on a proximal side of the open section, first and second-proximal side-metal plates are fixed so as to be positioned on an outer side of the proximal end side-center-support plate forming region in the width direction. The first and second-distal side-metal plates form a distal end side-support plate in cooperation with the distal end side-center-support plate forming region, and the first and second-proximal side-metal plates form a proximal end side-support plate in cooperation with the proximal end side-center-support plate forming region.
摘要:
A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.
摘要:
A thin film magnetic head substrate includes a plurality of head element portions having read elements and write elements in rows. Adjacent head element portions interpose a read monitor element and a write monitor element that are used as element resistance monitors for the read element and the write element when a lapping process is performed to form a medium-facing surface on the head element portion. A common electrode terminal is connected with the read monitor element and the write monitor element. A pair of individual electrode terminals are each connected to the read monitor element and the write monitor element, respectively.
摘要:
Head elements are formed on a wafer to suppress deterioration in pinning strength of a pinned layer, which is caused by ESD generated during air bearing surface polishing of a thin film magnetic head. The wafer is cut into rovers in each of which are connected head elements. Rover air bearing surfaces are polished until an MR elements attain a predetermined height. A final polishing step finishes air bearing surfaces by applying an electroconductive polishing liquid to achieve a predetermined shape and surface roughness with high accuracy. A pinning defect occurrence rate is reduced by suppressing deterioration in pinning strength of a pinned layer of a read element. To achieve this, a specific resistance of the electroconductive polishing liquid is controlled to 5 GΩ·cm or less. A shallow rail and a deep rail are formed on the air bearing surfaces, and the rover is cut into thin film magnetic heads.