公开(公告)号：US20180112102A1

公开(公告)日：2018-04-26

申请号：US15803657

申请日：2017-11-03

Applicant: Valspar Sourcing, Inc.

Inventor： Richard H. Evans ,  Jeffrey Niederst ,  Robert M. O'Brien ,  Benoit Prouvost ,  Kevin Romagnoli ,  Grant Schutte ,  Paul Stenson ,  Tom Van Kuren

IPC: C09D171/08 ,  B65D25/00 ,  B21D31/00 ,  C09D5/08 ,  C08G59/06 ,  C08G59/24

CPC classification number: C09D171/08 ,  B21D31/00 ,  B65D25/00 ,  C08G59/066 ,  C08G59/24 ,  C09D5/08 ,  Y10T428/1355

Abstract: This invention provides a polymer that is useful in a variety of applications, including as a binder polymer of a coating composition, and especially a packaging coating composition. Packaging articles (e.g., containers) comprising the polymer and methods of making such packaging articles are also provided.

公开(公告)号：US20130217187A1

公开(公告)日：2013-08-22

申请号：US13855629

申请日：2013-04-02

Applicant: Nitto Denko Corporation

Inventor： Takashi Oda ,  Naohide Takamoto ,  Takeshi Matsumura

IPC: C09D171/08 ,  H01L21/78

CPC classification number: C09D171/08 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/562 ,  H01L2924/0002 ,  Y10T428/265 ,  Y10T428/31511 ,  H01L2924/00

Abstract: The present invention aims to provide a film for forming a protective layer that is capable of preventing cracks in a low dielectric material layer of a semiconductor wafer while suppressing an increase in the number of steps in the manufacture of a semiconductor device. This object is achieved by a film for forming a protective layer on a bumped wafer in which a low dielectric material layer is formed, including a support base, an adhesive layer, and a thermosetting resin layer, laminated in this order, wherein the melt viscosity of the thermosetting resin layer is 1×102 Pa·S or more and 2×104 Pa·S or less, and the shear modulus of the adhesive layer is 1×103 Pa or more and 2×106 Pa or less, when the thermosetting resin layer has a temperature in a range of 50 to 120° C.

Abstract translation: 本发明的目的在于提供一种形成保护层的膜，其能够防止半导体晶片的低电介质材料层中的裂纹，同时抑制半导体器件的制造中的步骤数量的增加。 该目的通过在其上形成低介电材料层的凸起晶片上形成保护层的膜来实现，该薄膜包括依次层叠的支撑基底，粘合层和热固性树脂层，其中熔体粘度 的热固性树脂层的摩尔比为1×102Pa·S以上且2×104Pa·S以下，粘合剂层的剪切模量为1×10 3 Pa以上2×10 6 Pa以下时， 树脂层的温度为50〜120℃。

公开(公告)号：US20130178558A1

公开(公告)日：2013-07-11

申请号：US13784875

申请日：2013-03-05

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Martine M. Rousse ,  Ludovic Valette

IPC: C09D163/00 ,  C09D125/06 ,  C09D179/08 ,  C09D181/06 ,  C09D159/00 ,  C09D181/04 ,  C09D161/02 ,  C09D171/08 ,  C09D165/00 ,  C09D169/00

CPC classification number: C09D163/00 ,  C08G59/4042 ,  C08G59/5086 ,  C08G2261/3444 ,  C08L63/00 ,  C08L65/00 ,  C09D125/06 ,  C09D159/00 ,  C09D161/02 ,  C09D165/00 ,  C09D169/00 ,  C09D171/08 ,  C09D179/08 ,  C09D181/04 ,  C09D181/06

Abstract: Thermoset compositions useful for dampening vibrations at elevated temperatures are disclosed. The thermoset compositions may have a glass transition temperature of 150° C. or greater, a tan δ peak of 0.2 or greater, and a tan δ peak width measured at half-height larger than about 40° C., as measured by dynamic thermo-mechanical analysis (DMTA) at a frequency of 1 Hz. The thermoset compositions may be used to dampen vibrations at temperatures in excess of 100° C.

Abstract translation: 公开了用于在高温下抑制振动的热固性组合物。 热固性组合物可以具有150℃或更高的玻璃化转变温度，0.2或更大的tanδ峰值，以及在半高度测量的tanδ峰宽度大于约40℃，如通过动态热 机械分析（DMTA），频率为1Hz。 热固性组合物可用于在超过100℃的温度下抑制振动。

公开(公告)号：US20120171478A1

公开(公告)日：2012-07-05

申请号：US13496224

申请日：2010-09-16

Applicant: Rajesh Gopalan Saliya ,  Ayumu Yokoyama ,  Sheau-Hwa Ma ,  Axel Hans-Joachim Herzog

Inventor： Rajesh Gopalan Saliya ,  Ayumu Yokoyama ,  Sheau-Hwa Ma ,  Axel Hans-Joachim Herzog

IPC: B32B27/18 ,  C08K5/16 ,  B05D3/00 ,  C09D167/00 ,  C09D171/08 ,  B05D5/00 ,  C07C265/14 ,  C09D133/00

CPC classification number: C07C319/20 ,  C08G18/3814 ,  C08G18/6229 ,  C08G18/73 ,  C08G18/792 ,  C08K5/21 ,  C09D7/43 ,  C09D7/47 ,  C09D7/63 ,  C09D167/00 ,  C09D175/04 ,  Y10T428/269 ,  Y10T428/31855 ,  C07C323/41

Abstract: The present disclosure is directed to a sag control agent comprising a reaction product of an isocyanate and a fluorinated amine. This disclosure is further directed to a coating composition comprising the sag control agent. This disclosure is also directed to a process of forming a sag-free coating layer on a substrate.

Abstract translation: 本公开涉及包含异氰酸酯和氟化胺的反应产物的流挂控制剂。 本公开进一步涉及包含松弛控制剂的涂料组合物。 本公开还涉及在基材上形成无卷曲涂层的方法。

公开(公告)号：US20110236586A1

公开(公告)日：2011-09-29

申请号：US13129754

申请日：2009-11-09

Applicant: Andreas Bauer ,  Volker Stanjek

Inventor： Andreas Bauer ,  Volker Stanjek

IPC: C09D171/08 ,  C09D7/12 ,  B05D3/02

CPC classification number: C09D175/04 ,  C08G65/336

Abstract: The invention relates to a method for sealing surfaces using single-component, moisture-curing coating compositions (C) containing 5 to 75 wt % of one or more silane-terminated polymers (P) having end groups of the formula (I) —O—C(=O) —NH—A—Si (OR1) (I), wherein A stands for a linear or branched alkylene group having 1 to 10 carbon atoms, R1 stands for a linear or branched, possibly halogenated alkyl group having 1 to 10 carbon atoms, R2 stands for a linear or branched, possibly halogenated alkyl group having 1 to 10 carbon atoms, and X is 1, 2, or 3, 1 to 80 wt % of one or more fillers (F), 0.1 to 10 wt % of one or more water catchers (W), 0.01 to 5 wt % of one or more hardening catalysts (K), 0.01 to 10 wt % of one or more adhesion promoters (A), and possibly further substances common in moisture-curing coating compositions, wherein the weight amounts total 100%.

Abstract translation: 本发明涉及一种使用含有5至75重量％的具有式（I）端基的一个或多个硅烷封端的聚合物（P）的单组分，湿固化涂料组合物（C） - 密封表面的方法-O -C（= O）-NH-A-Si（OR 1）（I）其中A代表具有1-10个碳原子的直链或支链亚烷基，R1代表具有1个 至10个碳原子，R2代表具有1-10个碳原子的直链或支链的可能卤化的烷基，X是1,2或3,1-80重量％的一种或多种填料（F），0.1至 10重量％的一种或多种吸水剂（W），0.01至5重量％的一种或多种硬化催化剂（K），0.01至10重量％的一种或多种助粘剂（A），以及可能的其它常用于水分 固化涂料组合物，其中总重量为100％。

公开(公告)号：US5491209A

公开(公告)日：1996-02-13

申请号：US207007

申请日：1994-03-07

Applicant: Bradley J. Helmer ,  Shirley J. Loughney ,  Jon MacDonagh-Dumler

Inventor： Bradley J. Helmer ,  Shirley J. Loughney ,  Jon MacDonagh-Dumler

IPC: C08F2/16 ,  C08F220/28 ,  C08F236/04 ,  C08F283/00 ,  C08F290/06 ,  C08L51/00 ,  C08L51/08 ,  C09D151/00 ,  C09D151/08 ,  C09D171/08 ,  D21H19/20 ,  D21H19/58 ,  C08F20/26

CPC classification number: C09D151/003 ,  C08F220/28 ,  C08F236/04 ,  C08F283/006 ,  C08F290/06 ,  C08F290/062 ,  C08L51/003 ,  C08L51/08 ,  C09D151/08 ,  D21H19/58

Abstract: The present invention relates to a copolymer comprising in polymerized form from about 1 to about 15 weight percent of one or more ethylenically unsaturated poly(ethylene glycol) monomers represented by the following formula: ##STR1## where R.sup.1 is an ethylenically unsaturated functional group, R is H, OH or OCH.sub.3, and n is from 3 to 20, and from about 60 to about 99 weight percent of one or more monovinyl aromatic monomers, one or more aliphatic conjugated diene monomers or a mixture thereof. Paper coating compositions comprising this copolymer impart improved sheet gloss and dry pick characteristics to the coated paper.

Abstract translation: 本发明涉及一种共聚物，其包含约1至约15重量％的由下式表示的一种或多种烯属不饱和聚（乙二醇）单体的聚合形式：其中R1是烯属不饱和官能团，R 是H，OH或OCH 3，n为3至20，以及约60至约99重量％的一种或多种单乙烯基芳族单体，一种或多种脂族共轭二烯单体或其混合物。 包含该共聚物的纸涂料组合物赋予涂布纸提高的片材光泽度和干燥选择性能。

公开(公告)号：US5300625A

公开(公告)日：1994-04-05

申请号：US819061

申请日：1992-01-10

Applicant: Brigitte Helmreich ,  Klaus Burger ,  Gerhard Maier ,  Reinhold Hecht ,  Oskar Nuyken

Inventor： Brigitte Helmreich ,  Klaus Burger ,  Gerhard Maier ,  Reinhold Hecht ,  Oskar Nuyken

IPC: B01D71/52 ,  C08G65/40 ,  C08J5/00 ,  C08J5/18 ,  C08L71/08 ,  C08L71/10 ,  C09D171/00 ,  C09D171/08 ,  C09D171/10 ,  C08G65/00

CPC classification number: C08G65/4006 ,  B01D71/52 ,  C08G65/4037 ,  C08G65/405

Abstract: Polyethers which contain recurring units of the formula I ##STR1## in which A is a divalent aryl or heteroaryl radical,X is O, S or NR,Z is a divalent aryl or heteroaryl radical or an alkynyl, azo or (CF.sub.2) group, andR is arylare synthesized. The polyethers can be used as thermoplastics for the production of injection-molded articles, extrudates, polymer blends and coatings and for the production of films and membranes from solution.

Abstract translation: 含有式I（I）的重复单元的聚醚，其中A是二价芳基或杂芳基，X是O，S或NR，Z是二价芳基或杂芳基或炔基，偶氮或（CF 2 ）基团，并且R是芳基。 聚醚可以用作热塑性塑料，用于生产注模制品，挤出物，聚合物共混物和涂料以及用于从溶液中生产膜和膜。

公开(公告)号：US4657954A

公开(公告)日：1987-04-14

申请号：US857396

申请日：1986-04-21

Applicant: Katsuyoshi Watanabe ,  Yoshiya Fukuyama

Inventor： Katsuyoshi Watanabe ,  Yoshiya Fukuyama

IPC: C08G59/62 ,  C08G65/26 ,  C08G65/28 ,  C08L71/00 ,  C09D171/08 ,  C09J171/10 ,  C08L63/02

CPC classification number: C08L71/00 ,  C08G59/621 ,  C08G65/2612

Abstract: Poly(hydroxy ether) having a repeat unit of the formula, ##STR1## wherein R is a dihydric mononuclear phenol residue, R' is a dihydric polynuclear phenol residue, n is a positive number and n' is 0 or a positive number, provided that n and n' satisfy 35.ltoreq.n+n'.ltoreq.400. The poly(hydroxy ether) is useful for the production of paints for metal, wood, glass and plastics as well as varnishes, primers, films, fibers, resin-modifying agents, and molding materials and it is particularly useful for zinc dust paints.

Abstract translation: 具有下式重复单元的聚（羟基醚）其中R是二元单核酚残基，R'是二元多核酚残基，n是正数，n'是0或正数，提供 n和n'满足35