COATING COMPOSITION
    2.
    发明公开
    COATING COMPOSITION 审中-公开

    公开(公告)号:US20230279258A1

    公开(公告)日:2023-09-07

    申请号:US18116710

    申请日:2023-03-02

    Inventor: Nolan Richard

    CPC classification number: C09D163/00 C09D171/08 C09D127/18

    Abstract: A coating composition includes an epoxy resin including an epoxy monomer, a toughener and one or more self-lubricating fillers. The coating composition can be employed in a bearing that has an outer member that has a radially inwardly facing surface that defines an interior area. An inner member is disposed in the interior area. The inner member has a radially outward facing bearing surface. The coating composition is disposed between the radially inwardly facing surface and the radially outward facing bearing surface.

    Stain and Color Change Resistant Poly(Phenylene Ether) Composition
    3.
    发明申请
    Stain and Color Change Resistant Poly(Phenylene Ether) Composition 审中-公开
    耐污染和耐变色的聚(苯醚)组合物

    公开(公告)号:US20130253105A1

    公开(公告)日:2013-09-26

    申请号:US13762039

    申请日:2013-02-07

    Inventor: Wei Shan

    Abstract: Disclosed are polymer compositions, comprising: (a) a poly(phenylene ether); (b) a hydrogenated block copolymer of an alkenyl aromatic compound and a conjugated diene; (c) a polybutene; (d) a flame retardant; (e) an anti-UV agent wherein the agent comprises a trisaryl-1,3,5-triazine; (f) a copolymer of ethylene and a C3-C12 alpha-olefin; and (g) a polyolefin homopolymer; wherein the polymer composition does not contain a benzotriazole-type UV absorber; all weight percents are based on the total weight of the composition; and wherein an article made from the composition: (i) is substantially stainless; (ii) exhibits a CIELAB color shift, (ΔE) of 3 or less after 168 hours of heat exposure at 75° C.; and (iii) exhibits a CIELAB color shift, (ΔE) of 12 or less after 300 hours of xenon arc exposure according to ASTM D 4459. Also disclosed are processes for making the compositions as well as articles derived therefrom.

    Abstract translation: 公开了聚合物组合物,其包含:(a)聚(苯醚); (b)链烯基芳族化合物和共轭二烯的氢化嵌段共聚物; (c)聚丁烯; (d)阻燃剂; (e)抗紫外线剂,其中所述试剂包括三芳基-1,3,5-三嗪; (f)乙烯和C 3 -C 12α-烯烃的共聚物; 和(g)聚烯烃均聚物; 其中所述聚合物组合物不含苯并三唑型UV吸收剂; 所有重量百分比均以组合物的总重量计; 并且其中由所述组合物制成的制品:(i)基本上不锈钢; (ii)在75℃下暴露168小时后,CIELAB色移(DeltaE)为3以下。 和(iii)根据ASTM D 4459在300小时的氙弧曝光后显示出12或更小的CIELAB色移(DeltaE)。还公开了制备组合物以及由其衍生的制品的方法。

    SURFACE TREATMENT AGENT AND METHOD OF PRODUCING SUBSTRATE HAVING SURFACE-TREATED LAYER

    公开(公告)号:US20230416560A1

    公开(公告)日:2023-12-28

    申请号:US18367663

    申请日:2023-09-13

    Applicant: AGC Inc.

    CPC classification number: C09D171/08 C09D161/18

    Abstract: A surface treatment agent includes: a fluorine-containing compound (A) having a reactive silyl group; and at least one compound (B) selected from the group consisting of a fluorine-containing ketone compound (B1): R1COR2, a fluorine-containing cyclic ketone compound (the following B2), and a fluorine-containing polyether compound (B3): R4—[OR5]q—R6. In Formula (B1), R1 and R2 represent a fluorine-containing alkyl group having from 1 to 5 carbon atoms. In Formula (B2), R3 represents a residue that forms a 3- to 5-membered ring structure with a carbon atom of a carbonyl group and that has a fluorine atom. In Formula (B3), R4 and R6 represent a fluorine-containing alkyl group having from 1 to 3 carbon atoms, q represents an integer of 1 or more, R5 represents a perfluoroalkylene group having from 1 to 6 carbon atoms, and in a case in which q is an integer of 2 or more, plural R5s may be the same or different.

    FILM FOR FORMING PROTECTIVE LAYER
    7.
    发明申请
    FILM FOR FORMING PROTECTIVE LAYER 审中-公开
    形成保护层的电影

    公开(公告)号:US20120208009A1

    公开(公告)日:2012-08-16

    申请号:US13396532

    申请日:2012-02-14

    Abstract: The present invention aims to provide a film for forming a protective layer that is capable of preventing cracks in a low dielectric material layer of a semiconductor wafer while suppressing an increase in the number of steps in the manufacture of a semiconductor device. This object is achieved by a film for forming a protective layer on a bumped wafer in which a low dielectric material layer is formed, including a support base, an adhesive layer, and a thermosetting resin layer, laminated in this order, wherein the melt viscosity of the thermosetting resin layer is 1×102 Pa·S or more and 2×104 Pa·S or less, and the shear modulus of the adhesive layer is 1×103 Pa or more and 2×106 Pa or less, when the thermosetting resin layer has a temperature in a range of 50 to 120° C.

    Abstract translation: 本发明的目的在于提供一种形成保护层的膜,其能够防止半导体晶片的低电介质材料层中的裂纹,同时抑制半导体器件的制造中的步骤数量的增加。 该目的通过在其上形成低介电材料层的凸起晶片上形成保护层的膜来实现,该薄膜包括依次层叠的支撑基底,粘合层和热固性树脂层,其中熔体粘度 的热固性树脂层的摩尔比为1×102Pa·S以上且2×104Pa·S以下,粘合剂层的剪切模量为1×10 3 Pa以上2×10 6 Pa以下时, 树脂层的温度为50〜120℃。

Patent Agency Ranking