Vacuum insulating glass unit including infrared meltable glass frit, and/or method of making the same
    63.
    发明申请
    Vacuum insulating glass unit including infrared meltable glass frit, and/or method of making the same 有权
    包括红外线熔融玻璃料的真空中空玻璃单元和/或制造它的方法

    公开(公告)号:US20100275654A1

    公开(公告)日:2010-11-04

    申请号:US12453221

    申请日:2009-05-01

    IPC分类号: C03B29/00 C03C8/02 B32B3/02

    摘要: Certain example embodiments of this invention relate to vacuum insulating glass (VIG) units including infrared meltable glass frits, and/or methods of making the same. More particularly, certain example embodiments relate to increasing the amount of ferrous oxide in glass frits (e.g., lead-free glass frits) used to form edge seals such that the glass frits absorb an increased amount of IR energy. The techniques of certain example embodiments make it possible to expose some or all of the VIG intermediate assembly to infrared source(s), since the glass frit will heat up faster than the substrates thereby reducing the likelihood of the first and/or second substrate melting and losing heat treatment strength. In certain example embodiments, the frit's glass redox (FeO/Fe2O3) preferably is at least about 0.02 higher than either (or the higher) of the substrates' glass redox (FeO/Fe2O3), more preferably at least about 0.04 higher, and most preferably at least about 0.06 higher.

    摘要翻译: 本发明的某些示例性实施例涉及包括红外线可熔融玻璃料的真空绝热玻璃(VIG)单元和/或制造该玻璃料的方法。 更具体地,某些示例实施方案涉及增加用于形成边缘密封的玻璃料(例如,无铅玻璃料)中的氧化亚铁的量,使得玻璃料吸收增加的IR能量。 某些示例性实施例的技术使得可以将部分或全部VIG中间组件暴露于红外源,因为玻璃料将比衬底更快地加热,从而降低了第一和/或第二衬底熔化的可能性 并损失热处理强度。 在某些示例性实施例中,玻璃料的玻璃氧化还原(FeO / Fe 2 O 3)优选比衬底的玻璃氧化还原(FeO / Fe 2 O 3)的(或更高)高至少约0.02,更优选至少约0.04高, 优选至少约0.06。

    Method for producing an electronic component passivated by lead free glass
    65.
    发明授权
    Method for producing an electronic component passivated by lead free glass 有权
    无铅玻璃钝化电子元件的制造方法

    公开(公告)号:US07569505B2

    公开(公告)日:2009-08-04

    申请号:US11475476

    申请日:2006-06-27

    摘要: The invention relates to a method for the production of glass-coated electric components, wherein the components are, inter alia, passivated by the application of the glass. The lead-free glass used is not affected through purification and processing steps and the electric component is protected from mechanical damaging and other detrimental influences, such as impurities. Further, the method remarkably helps to stabilize the electrical properties of the components. Inter alia, a sufficient acid resistance is achieved and it results in an improvement of the expansion adjustment of the glass.

    摘要翻译: 本发明涉及一种用于制造玻璃涂覆的电气部件的方法,其中所述部件尤其通过施加玻璃被钝化。 所用的无铅玻璃不受净化和加工步骤的影响,并且电子部件被保护免受机械损坏和其他有害影响,例如杂质。 此外,该方法显着地有助于稳定部件的电性能。 特别地,实现了足够的耐酸性,并且其导致玻璃的膨胀调节的改善。

    Glass Frits
    66.
    发明申请
    Glass Frits 有权
    玻璃杯

    公开(公告)号:US20090189126A1

    公开(公告)日:2009-07-30

    申请号:US12022294

    申请日:2008-01-30

    申请人: Robert Prunchak

    发明人: Robert Prunchak

    摘要: Glass frits, conductive inks and articles having conductive inks applied thereto are described. According to one or more embodiments, glass frits with no intentionally added lead comprise TeO2 and one or more of Bi2O3, SiO2 and combinations thereof. One embodiment of the glass frit includes B2O3, and can further include ZnO, Al2O3 and/or combinations thereof. One embodiment provides for conductive inks which include a glass frit with no intentionally added lead and comprising TeO2 and one or more of Bi2O3, SiO2 and combinations thereof. Another embodiment includes articles with substrates such as semiconductors or glass sheets, having conductive inks disposed thereto, wherein the conductive ink includes glass frits having no intentionally added lead.

    摘要翻译: 对玻璃料,导电油墨和涂有导电油墨的制品进行说明。 根据一个或多个实施方案,没有有意添加铅的玻璃料包含TeO 2和一种或多种Bi 2 O 3,SiO 2及其组合。 玻璃料的一个实施方案包括B 2 O 3,并且还可以包括ZnO,Al 2 O 3和/或其组合。 一个实施方案提供了导电油墨,其包括玻璃料,其没有有意添加的铅并且包含TeO 2和一种或多种Bi 2 O 3,SiO 2及其组合。 另一实施例包括具有诸如半导体或玻璃片的衬底的制品,其中设置有导电油墨,其中导电油墨包括没有有意添加铅的玻璃料。

    Frits and obscuration enamels for automotive applications
    67.
    发明授权
    Frits and obscuration enamels for automotive applications 有权
    用于汽车应用的玻璃料和遮光漆

    公开(公告)号:US07560401B2

    公开(公告)日:2009-07-14

    申请号:US11738184

    申请日:2007-04-20

    摘要: Frits, obscuration enamel compositions including frits and automotive windshields having obscuration enamel compositions applied thereto are described. According to one or more embodiments, the obscuration enamel composition comprises a paste component and a frit component having Bi2O3, SiO2 and B2O3 and being substantially free of Na2O. In other embodiments, a reducing agent is included in the frit component. Obscuration enamels of some embodiments have a total solids content of at least 80% by weight.

    摘要翻译: 描述了包含釉料组合物的玻璃料,搪瓷组合物,其包含玻璃料和应用于其上的具有晦暗搪瓷组合物的汽车挡风玻璃。 根据一个或多个实施方案,所述晦暗搪瓷组合物包含糊状组分和具有Bi 2 O 3,SiO 2和B 2 O 3并且基本上不含Na 2 O的玻璃料组分。 在其它实施方案中,还原剂包括在玻璃料组分中。 一些实施方案的晦涩剂具有至少80重量%的总固体含量。

    Dense lead-free glass ceramic for electronic devices
    69.
    发明授权
    Dense lead-free glass ceramic for electronic devices 有权
    电子设备密集的无铅玻璃陶瓷

    公开(公告)号:US06844278B2

    公开(公告)日:2005-01-18

    申请号:US10246847

    申请日:2002-09-18

    CPC分类号: C03C14/004 C03C8/22

    摘要: A dense lead-free glass ceramic that has low dielectric constant and low dielectric loss for producing high-frequency ceramic devices, such as inductors and low temperature co-fired ceramics (LTCC), is disclosed. The glass ceramic consists of 15-35% by weight of lead-free borosilicate glasses with low softening point, 15-35% by weight of lead-free borosilicate glasses with high softening point, 20-80% by weight of combination of amorphous and crystalline SiO2-filler (preferably 5-30% by weight of amorphous SiO2, 10-50% by weight of crystalline SiO2) and 0.1-10% by weight of at least one oxide of Al2O3, BaO, Sb2O3, V2O5, CoO, MgO, B2O3, Nb2O5, SrO and ZnO. The glass ceramic can be densified up to 99% of its theoretical density after firing and is co-firable with conductive metals between 800-900° C. The dense glass ceramic has dielectric constant of 4.2-4.6 and loss tangent (tan δ)

    摘要翻译: 公开了一种致密的无铅玻璃陶瓷,具有低介电常数和低介电损耗,用于生产高频陶瓷器件,如电感器和低温共烧陶瓷(LTCC)。 玻璃陶瓷由15-35重量%的低软化点的无铅硼硅酸盐玻璃组成,15-35重量%的无软化点的无铅硼硅酸盐玻璃,20-80重量%的无定形和 结晶SiO 2填料(优选5-30重量%的无定形SiO 2,10-50重量%的结晶SiO 2)和0.1-10重量%的至少一种Al 2 O 3,BaO,Sb 2 O 3,V 2 O 5,CoO,MgO的氧化物 ,B2O3,Nb2O5,SrO和ZnO。 玻璃陶瓷在焙烧后可以致密化至其理论密度的99%,与导电金属在800-900℃之间是可以共同使用的。致密玻璃陶瓷的介电常数为4.2-4.6,损耗角正切(tanδ)< 0.0025,20MHz,适用于高频电子器件的良好的热/机械强度。