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    Stack frame for electrical connections and the method to fabricate thereof
    73.
    发明授权
    Stack frame for electrical connections and the method to fabricate thereof 有权

    公开(公告)号：US10593561B2

    公开(公告)日：2020-03-17

    申请号：US15955696

    申请日：2018-04-18

    Applicant: CYNTEC CO., LTD.

    Inventor： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

    IPC: H01L23/00 ,  H01L21/48 ,  H01L23/495 ,  H01L21/768 ,  H01L25/00 ,  H01L25/16

    Abstract: A package structure comprises: a plurality of metal parts, wherein each metal part is made of metal and each two adjacent metal parts are spaced apart by a gap being filled with an insulating material; a first insulating layer, disposed over a top of the plurality of metal parts and the top surface of a conductive element; and a first conductive layer, disposed over the first insulating layer, wherein a first conductive pattern electrically connects a first terminal of the conductive element to a first metal part through at least one first via disposed in the first insulating layer, wherein a bump is disposed in the first insulating layer and electrically connected to a second terminal of the conductive element.

    Wireless package with antenna connector and fabrication method thereof
    74.
    发明授权
    Wireless package with antenna connector and fabrication method thereof 有权

    公开(公告)号：US10438907B2

    公开(公告)日：2019-10-08

    申请号：US15375146

    申请日：2016-12-11

    Applicant: CYNTEC CO., LTD.

    Inventor： Chun-Fu Hu ,  Chih-Yu Hu ,  Shu-Wei Chang

    IPC: H01L23/66 ,  H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L21/56 ,  H01L23/50

    Abstract: The present invention discloses a wireless package with a resilient connector for connecting a substrate to an antenna. The antenna is disposed directly on a top surface of a molding compound of the wireless package. The resilient connector has a lower terminal bonded to the substrate, a horizontal contact portion, and an oblique support portion integrally extending between the horizontal contact portion and the lower terminal. The horizontal contact portion has a flat top surface that is coplanar with the top surface of the molding compound and is in direct contact with the antenna such that the contact resistance distribution is concentrated and the production yield of the wireless package is improved.

    Planar reactor
    79.
    发明授权
    Planar reactor 有权

    公开(公告)号：US10134522B2

    公开(公告)日：2018-11-20

    申请号：US15046423

    申请日：2016-02-17

    Applicant: CYNTEC CO., LTD.

    Inventor： Wei Zhang ,  Chu-Keng Lin ,  Hung-Chih Lin ,  Hsieh-Shen Hsieh

    IPC: H01F27/08 ,  H01F27/10 ,  H01F27/02 ,  H01F17/00 ,  H01F17/06 ,  H01F27/24 ,  H01F27/34 ,  H01F27/29

    Abstract: A planar reactor includes a core and a coil. The core includes an upper board, a lower board and a pillar. The pillar is located between the upper board and the lower board. A winding space is located among the upper board, the lower board and the pillar. The coil is wound around the pillar and located in the winding space. The pillar and at least one of the upper board and the lower board are coplanar at a first side of the planar reactor. The pillar is sunk into the winding space from a second side of the planar reactor, wherein the first side is opposite to the second side. A first end of the coil is exposed from the first side of the planar reactor. A second end of the coil is hidden in the winding space partially or wholly at the second side of the planar reactor.

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